Resist processing apparatus
    1.
    发明授权
    Resist processing apparatus 失效
    抗蚀剂加工设备

    公开(公告)号:US6033475A

    公开(公告)日:2000-03-07

    申请号:US579845

    申请日:1995-12-26

    IPC分类号: B01D19/00 G03F7/16

    CPC分类号: B01D19/0031 G03F7/162

    摘要: The present invention has a resist processing apparatus for supplying a processing solution onto an object to be processed to perform a resist process, including a processing solution supply nozzle for supplying the processing solution onto the object to be processed, a processing solution feeding arrangement for feeding the processing solution to the processing solution supply nozzle, a processing solution flow path arranged to extend between the processing solution feeding arrangement and the processing solution supply nozzle, and a processing solution deaeration mechanism arranged at an intermediate portion of the processing solution flow path to deaerate the processing solution. The processing solution deaeration mechanism includes a closed vessel, an inlet port for introducing the processing solution into the closed vessel, a member arranged in the closed vessel and having a gas-liquid separation function, and an evacuating arrangement for evacuating the interior of the closed vessel to deaerate the processing solution through the member having the gas-liquid separation function. Gaseous components are separated from the processing solution, and an outlet port feeds the processing solution, from which gaseous components are separated by the member having the gas-liquid separation function, to the processing solution supply nozzle.

    摘要翻译: 本发明的抗蚀剂处理装置具有将处理液供给到被处理物上进行抗蚀剂处理的工序,该处理液包括:处理液供给喷嘴,用于将处理液供给到被处理物上;处理液供给装置, 处理溶液供应喷嘴的处理溶液,布置成在处理溶液供给装置和处理溶液供应喷嘴之间延伸的处理溶液流路,以及布置在处理溶液流动路径的中间部分处理溶液脱气机构以脱气 处理方案。 处理液脱气机构包括:封闭容器,用于将处理液引入密闭容器的入口端口,配置在密闭容器中的具有气液分离功能的构件,以及用于抽出封闭容器内部的抽空装置 容器通过具有气液分离功能的构件使加工溶液脱气。 气态组分与处理溶液分离,并且出口将进料气体组分由具有气液分离功能的构件分离的处理溶液供给到处理溶液供应喷嘴。

    Substrate processing system
    2.
    发明授权
    Substrate processing system 失效
    基板加工系统

    公开(公告)号:US5826129A

    公开(公告)日:1998-10-20

    申请号:US496319

    申请日:1995-06-29

    IPC分类号: H01L21/00 G03D5/00

    摘要: This invention provides a substrate processing system including a cassette station on which at least one cassette containing a plurality of objects is placed, a process station including a plurality of process chambers for performing processing for the objects, and an object conveying unit for loading the objects into the process chambers and unloading the objects from the process chambers, a first object transfer unit for transferring the objects between the cassette station and the process station, and an interface section including an object waiting region where the objects wait, and a second object transfer unit for transferring the objects to the process station, wherein the process chambers in the process station are arranged around the object conveying unit, and the object conveying unit has a rotating shaft almost parallel to the vertical direction and can move up and down in the vertical direction along the rotating shaft and rotate about the rotating shaft.

    摘要翻译: 本发明提供了一种基板处理系统,其包括:盒站,其上放置有至少一个包含多个物体的盒;处理站,包括用于对物体进行处理的多个处理室;以及物体传送单元,用于装载物体 进入处理室并从处理室卸载物体,第一物体传送单元,用于在物体站和处理站之间传送物体,以及接口部分,其包括物体等待的对象等待区域,以及第二物体传送 用于将物体传送到处理站的单元,其中处理站中的处理室围绕物体传送单元布置,物体传送单元具有几乎平行于垂直方向的旋转轴,并且可以在竖直方向上上下移动 沿着旋转轴的方向旋转并围绕旋转轴旋转。

    Treatment apparatus and treatment method
    3.
    发明授权
    Treatment apparatus and treatment method 有权
    治疗仪器及治疗方法

    公开(公告)号:US06368776B1

    公开(公告)日:2002-04-09

    申请号:US09270806

    申请日:1999-03-17

    IPC分类号: G03C500

    摘要: A gas supplied from a gas source is exposed to an atmosphere above a liquid surface in a tank saving the liquid and thereafter is supplied around a wafer in a treatment chamber through a gas supply passage and a supply port. The gas supplied around the wafer uniformly flows from around the wafer toward above the center of the wafer and thereafter is discharged from an exhaust port which is formed at the top of the treatment chamber. Meanwhile, with respect to the wafer, heat treatment is performed by a heating mechanism and a predetermined PEB is carried out. The humidified gas is supplied into the treatment chamber, thereby preventing drying in the treatment chamber. Therefore, water in resist is not taken out, resulting in that a required resist pattern can be formed on the wafer.

    摘要翻译: 从气源供给的气体暴露在储存液体的槽内的液面以上的气氛中,然后通过气体供给通路和供给口在处理室内的晶片供给。 在晶片周围供给的气体均匀地从晶片周围朝向晶片的中心方向流动,之后从形成在处理室顶部的排气口排出。 同时,相对于晶片,通过加热机构进行热处理,进行规定的PEB。 将加湿气体供给到处理室,防止处理室内的干燥。 因此,抗蚀剂中的水不会被取出,导致可以在晶片上形成所需的抗蚀剂图案。

    Liquid supplying device
    4.
    发明授权
    Liquid supplying device 失效
    液体供应装置

    公开(公告)号:US6015066A

    公开(公告)日:2000-01-18

    申请号:US991783

    申请日:1997-12-16

    IPC分类号: G03F7/30 B67D5/08

    CPC分类号: G03F7/30 Y10T137/3124

    摘要: Disclosed herein is a device for supplying a liquid to a plurality of apparatuses which apply the liquid to substrates to process the substrates. The device comprises a tank containing the liquid, a supply passage for supplying the liquid from the tank to the apparatuses, branch passages connected to the supply passage, for supplying the liquid to liquid-applying members provided in the apparatuses, and valves provided on the branch passages, respectively. The valves are controlled each other, for opening and closing the branch passages such that the liquid-applying member of one apparatus applies the liquid to a substrate while the liquid-applying member of any other apparatus remains to apply the liquid to a substrate.

    摘要翻译: 这里公开了一种用于将液体供应到将液体施加到基板以处理基板的多个装置的装置。 该装置包括容纳液体的容器,用于将液体从罐供给到设备的供给通道,连接到供给通道的分支通道,用于将液体供应到设置在设备中的液体施加部件, 分支通道。 阀被彼此控制,用于打开和关闭分支通道,使得一个设备的液体施加构件将液体施加到基底,同时任何其他设备的液体施加构件保持将液体施加到基底。

    Liquid coating system
    5.
    发明授权
    Liquid coating system 失效
    液体涂层系统

    公开(公告)号:US5374312A

    公开(公告)日:1994-12-20

    申请号:US144492

    申请日:1993-11-01

    摘要: A liquid coating system according to the present invention comprises, a liquid supply source, a nozzle having an inlet communicating with the liquid supply source and a substantially linear liquid discharge portion, a pressure feed unit for feeding the liquid under pressure from the liquid supply source to the nozzle by means of compressed gas, a spin chuck for fixedly supporting a semiconductor wafer, an up-and-down cylinder for causing the liquid discharge portion of the nozzle to closely face the wafer on the spin chuck, and a rotating mechanism for rotating the spin chuck. The nozzle includes a liquid reservoir, in which the liquid supplied from the liquid supply source is collected, and a large number of small passages communicating with the liquid reservoir. The liquid coating system further comprises an air operation valve disposed in a communication passage between the inlet of the nozzle and the liquid supply source and used to reduce the pressure of the liquid fed under pressure to the liquid reservoir.

    摘要翻译: 根据本发明的液体涂覆系统包括:液体供应源,具有与液体供应源连通的入口和基本上线性的液体排出部分的喷嘴;压力供给单元,用于在液体供应源 通过压缩气体到喷嘴,用于固定地支撑半导体晶片的旋转卡盘,用于使喷嘴的液体排出部分紧密地面对旋转卡盘上的晶片的上下缸体,以及用于 旋转旋转卡盘。 喷嘴包括从液体供应源供应的液体被收集的液体储存器和与液体储存器连通的大量小通道。 液体涂布系统还包括设置在喷嘴入口和液体供应源之间的连通通道中的空气操作阀,用于将在压力下供给的液体的压力降低到液体储存器。

    COATING AND DEVELOPING APPARATUS
    6.
    发明申请

    公开(公告)号:US20100326353A1

    公开(公告)日:2010-12-30

    申请号:US12855524

    申请日:2010-08-12

    IPC分类号: B05C9/12

    摘要: Provided is a coating and developing apparatus composed of an assembly of plural unit blocks. A first unit-block stack and a second unit-block stack are arranged at different positions with respect to front-and-rear direction. Unit blocks for development, each of which comprises plural processing units including a developing unit that performs developing process after exposure and a transfer device that transfers a substrate among the processing units, are arranged at the lowermost level. Unit blocks for application, or coating, each of which comprises plural processing units including a coating unit that performs application process before exposure and a transfer device that transfers a substrate among the processing units, are arranged above the unit blocks for development. Unit blocks for application are arranged in both the first and second unit-block stacks. Unit blocks for application which a wafer goes through are determined depending on the layering positional relationship between an antireflective film and a resist film. An exposed wafer goes only through the unit block for development without going through any one of the unit blocks for application.

    Heating apparatus, and coating and developing apparatus
    8.
    发明授权
    Heating apparatus, and coating and developing apparatus 有权
    加热装置和涂装显影装置

    公开(公告)号:US07797855B2

    公开(公告)日:2010-09-21

    申请号:US11505810

    申请日:2006-08-18

    IPC分类号: F26B21/06

    摘要: A heating apparatus 2 comprises a housing 20; a flat heating chamber 4 which is provided in the housing 2 and adapted to heat a wafer W used as a substrate, with one side of the heating chamber 4 opening for carrying in and carrying out the wafer; and a heating plates 44, 45 provided in the heating chamber 4 such that the wafer W can be heated from both above and below. A cooling plate 3 is provided in the housing 20 located in the vicinity of the opening of the heating chamber 4, for cooling the wafer W after being heated by the heating plates 44, 45. Additionally, a carrying means is provided in the housing 20 for carrying the wafer W between an upper position of the cooling plate 3 and the interior of the heating chamber 4 such that a heat treatment for the wafer W can be performed with the wafer W being held in the heating chamber 4.

    摘要翻译: 加热装置2包括壳体20; 平面加热室4,其设置在壳体2中并且适于加热用作基板的晶片W,加热室4的一侧开口用于承载和执行晶片; 以及设置在加热室4中的加热板44,45,使得晶片W能够从上下两者加热。 冷却板3设置在位于加热室4的开口附近的壳体20中,用于在被加热板44,45加热之后冷却晶片W.此外,在壳体20中设置有承载装置 用于在冷却板3的上部位置和加热室4的内部之间承载晶片W,使得可以在将晶片W保持在加热室4中的情况下进行晶片W的热处理。

    Coating and developing apparatus
    9.
    发明授权
    Coating and developing apparatus 有权
    涂装显影装置

    公开(公告)号:US07793609B2

    公开(公告)日:2010-09-14

    申请号:US11342616

    申请日:2006-01-31

    IPC分类号: B05C5/02

    摘要: Provided is a coating and developing apparatus composed of an assembly of plural unit blocks. A first unit-block stack and a second unit-block stack are arranged at different positions with respect to front-and-rear direction. Unit blocks for development, each of which comprises plural processing units including a developing unit that performs developing process after exposure and a transfer device that transfers a substrate among the processing units, are arranged at the lowermost level. Unit blocks for application, or coating, each of which comprises plural processing units including a coating unit that performs application process before exposure and a transfer device that transfers a substrate among the processing units, are arranged above the unit blocks for development. Unit blocks for application are arranged in both the first and second unit-block stacks. Unit blocks for application which a wafer goes through are determined depending on the layering positional relationship between an antireflective film and a resist film. An exposed wafer goes only through the unit block for development without going through any one of the unit blocks for application.

    摘要翻译: 提供一种由多个单元块组成的涂层显影装置。 第一单位块堆叠和第二单位块堆叠被布置在相对于前后方向的不同位置。 用于显影的单元块,每个包括多个处理单元,包括执行曝光之后的显影处理的显影单元和在处理单元之间传送基板的转印装置布置在最下层。 用于应用或涂布的单元块包括多个处理单元,其包括在曝光之前进行施加处理的涂布单元和在处理单元之间传送基板的转印装置,布置在用于显影的单位块上方。 用于应用的单元块被布置在第一和第二单元块堆叠中。 根据防反射膜和抗蚀剂膜之间的层叠位置关系确定晶片通过的应用单元块。 暴露的晶片仅通过单元块进行开发,而不经过用于应用的单元块中的任何一个。