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1.发明申请公开(公告)号：US20170338048A1
公开(公告)日：2017-11-23
申请号：US15672000
申请日：2017-08-08
Applicant: KEMET Electronics Corporation
Inventor： Yaru Shi , Antony P. Chacko , Hong Zhang , Qingping Chen , Lei Xu , Yang Jin , Zhen Wu
CPC classification number: H01G9/042 , C09D5/24 , H01G9/0032 , H01G9/0036 , H01G9/012 , H01G9/025 , H01G9/028 , H01G9/052 , H01G9/07 , H01G9/15
Abstract: A method for forming a capacitor, a capacitor formed thereby and an improved composition for a conductive coating are described. The method includes providing an anode, forming a dielectric on the anode and forming a cathode layer over the dielectric by applying a monoamine, a weak acid and a conductive polymer.
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2.发明授权Solid electrolytic capacitor and improved method for manufacturing a solid electrolytic capacitor 有权固体电解电容器及改进的固体电解电容器制造方法公开(公告)号：US09524829B2
公开(公告)日：2016-12-20
申请号：US14595502
申请日：2015-01-13
Applicant: Kemet Electronics Corporation
Inventor： Hong Zhang , Qingping Chen , Randolph S. Hahn
CPC classification number: H01G9/0032 , H01G9/0036 , H01G9/012 , H01G9/028 , H01G9/15 , Y10T29/417
Abstract: An improved process for forming a capacitor, and improved capacitor formed thereby is described. The process includes: providing an anode comprising a dielectric thereon; applying a first layer of an intrinsically conducting polymer on the dielectric to form a capacitor precursor; applying at least one subsequent layer of an intrinsically conducting polymer on the first layer from a dispersion; and treating the capacitor precursor at a temperature of at least 50° C. no more than 200° C. at a relative humidity of at least 25% up to 100%, or fusing the layered structure by swelling the layered structure with a liquid and at least partially removing the liquid.
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3.发明授权Solid electrolytic capacitor and improved method for manufacturing a solid electrolytic capacitor 有权固体电解电容器及改进的固体电解电容器制造方法公开(公告)号：US09343239B2
公开(公告)日：2016-05-17
申请号：US13896672
申请日：2013-05-17
Applicant: Kemet Electronics Corporation
Inventor： Hong Zhang , Qingping Chen , Randolph S. Hahn
CPC classification number: H01G9/0032 , H01G9/0036 , H01G9/012 , H01G9/028 , H01G9/15 , Y10T29/417
Abstract: An improved process for forming a capacitor, and improved capacitor formed thereby is described. The process includes: providing an anode comprising a dielectric thereon; applying a first layer of an intrinsically conducting polymer on the dielectric to form a capacitor precursor; applying at least one subsequent layer of an intrinsically conducting polymer on the first layer from a dispersion; and treating the capacitor precursor at a temperature of at least 50° C. no more than 200° C. at a relative humidity of at least 25% up to 100%, or fusing the layered structure by swelling the layered structure with a liquid and at least partially removing the liquid.
Abstract translation: 描述了一种用于形成电容器的改进方法以及由此形成的改进的电容器。 该方法包括：在其上提供包含电介质的阳极; 将第一层本征导电聚合物施加在电介质上以形成电容器前体; 从分散体在第一层上施加至少一个本征导电聚合物的后续层; 并且在至少50℃至不超过200℃的温度下处理电容器前体，相对湿度至少为25％至100％，或者通过用液体使层状结构溶胀而使层状结构熔融， 至少部分地去除液体。
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Patent Agency Ranking
4.发明申请Solid Electrolytic Capacitor and Improved Method for Manufacturing a Solid Electrolytic Capacitor 有权固体电解电容器和改进的固体电解电容器制造方法公开(公告)号：US20150124374A1
公开(公告)日：2015-05-07
申请号：US14595502
申请日：2015-01-13
Applicant: Kemet Electronics Corporation
Inventor： Hong Zhang , Qingping Chen , Randolph S. Hahn
CPC classification number: H01G9/0032 , H01G9/0036 , H01G9/012 , H01G9/028 , H01G9/15 , Y10T29/417
Abstract: An improved process for forming a capacitor, and improved capacitor formed thereby is described. The process includes: providing an anode comprising a dielectric thereon; applying a first layer of an intrinsically conducting polymer on the dielectric to form a capacitor precursor; applying at least one subsequent layer of an intrinsically conducting polymer on the first layer from a dispersion; and treating the capacitor precursor at a temperature of at least 50° C. no more than 200° C. at a relative humidity of at least 25% up to 100%, or fusing the layered structure by swelling the layered structure with a liquid and at least partially removing the liquid.
Abstract translation: 描述了一种用于形成电容器的改进方法以及由此形成的改进的电容器。 该方法包括：在其上提供包含电介质的阳极; 将第一层本征导电聚合物施加在电介质上以形成电容器前体; 从分散体在第一层上施加至少一个本征导电聚合物的后续层; 并且在至少50℃至不超过200℃的温度下处理电容器前体，相对湿度至少为25％至100％，或者通过用液体使分层结构溶胀来使层状结构熔融， 至少部分地去除液体。
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5.发明申请Solid Electrolytic Capacitor and Improved Method for Manufacturing a Solid Electrolytic Capacitor 有权固体电解电容器和改进的固体电解电容器制造方法公开(公告)号：US20140340819A1
公开(公告)日：2014-11-20
申请号：US13896672
申请日：2013-05-17
Applicant: Kemet Electronics Corporation
Inventor： Hong Zhang , Qingping Chen , Randolph R. Hahn
CPC classification number: H01G9/0032 , H01G9/0036 , H01G9/012 , H01G9/028 , H01G9/15 , Y10T29/417
Abstract: An improved process for forming a capacitor, and improved capacitor formed thereby is described. The process includes: providing an anode comprising a dielectric thereon; applying a first layer of an intrinsically conducting polymer on the dielectric to form a capacitor precursor; applying at least one subsequent layer of an intrinsically conducting polymer on the first layer from a dispersion; and treating the capacitor precursor at a temperature of at least 50° C. no more than 200° C. at a relative humidity of at least 25% up to 100%, or fusing the layered structure by swelling the layered structure with a liquid and at least partially removing the liquid.
Abstract translation: 描述了一种用于形成电容器的改进方法以及由此形成的改进的电容器。 该方法包括：在其上提供包含电介质的阳极; 将第一层本征导电聚合物施加在电介质上以形成电容器前体; 从分散体在第一层上施加至少一个本征导电聚合物的后续层; 并且在至少50℃至不超过200℃的温度下处理电容器前体，相对湿度至少为25％至100％，或者通过用液体使层状结构溶胀而使层状结构熔融， 至少部分地去除液体。
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公开(公告)号：US09761347B2
公开(公告)日：2017-09-12
申请号：US15083381
申请日：2016-03-29
Applicant: KEMET Electronics Corporation
Inventor： Yaru Shi , Antony P. Chacko , Hong Zhang , Qingping Chen , Randolph S. Hahn , Lei Xu , Yang Jin , Zhen Wu
CPC classification number: H01B1/127 , H01G9/0032 , H01G9/0036 , H01G9/028 , H01G9/0425 , H01G9/15 , Y10T29/417
Abstract: A method for forming a capacitor, a capacitor formed thereby and an improved composition for a conductive coating are described. The method includes providing an anode, forming a dielectric on the anode and forming a cathode layer over the dielectric by applying an amine, a weak acid and a conductive polymer.
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7.发明申请Process to improve coverage and electrical performance of solid electrolytic capacitor 有权提高固体电解电容器覆盖和电性能的工艺公开(公告)号：US20160211082A1
公开(公告)日：2016-07-21
申请号：US15083381
申请日：2016-03-29
Applicant: KEMET Electronics Corporation
Inventor： Yaru Shi , Antony P. Chacko , Hong Zhang , Qingping Chen , Randolph S. Hahn , Lei Xu , Yang Jin , Zhen Wu
CPC classification number: H01B1/127 , H01G9/0032 , H01G9/0036 , H01G9/028 , H01G9/0425 , H01G9/15 , Y10T29/417
Abstract: A method for forming a capacitor, a capacitor formed thereby and an improved composition for a conductive coating are described. The method includes providing an anode, forming a dielectric on the anode and forming a cathode layer over the dielectric by applying an amine, a weak acid and a conductive polymer.
Abstract translation: 描述形成电容器的方法，由此形成的电容器和用于导电涂层的改进的组合物。 该方法包括提供阳极，在阳极上形成电介质并通过施加胺，弱酸和导电聚合物在电介质上形成阴极层。
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公开(公告)号：US10109428B2
公开(公告)日：2018-10-23
申请号：US15672000
申请日：2017-08-08
Applicant: KEMET Electronics Corporation
Inventor： Yaru Shi , Antony P. Chacko , Hong Zhang , Qingping Chen , Lei Xu , Yang Jin , Zhen Wu
IPC: H01G9/042 , H01G9/15 , C09D5/24 , H01G9/00 , H01G9/012 , H01G9/07 , H01G9/025 , H01G9/028 , H01G9/052
Abstract: A method for forming a capacitor, a capacitor formed thereby and an improved composition for a conductive coating are described. The method includes providing an anode, forming a dielectric on the anode and forming a cathode layer over the dielectric by applying a monoamine, a weak acid and a conductive polymer.
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