公开(公告)号：US5258426A

公开(公告)日：1993-11-02

申请号：US484676

申请日：1990-02-20

申请人： Ken Uchida ,  Shinetsu Fujieda ,  Michiya Higashi ,  Hiroshi Shimozawa ,  Akira Yoshizumi

发明人： Ken Uchida ,  Shinetsu Fujieda ,  Michiya Higashi ,  Hiroshi Shimozawa ,  Akira Yoshizumi

IPC分类号： C08K3/36 ,  C08G59/00 ,  C08G59/40 ,  C08K5/56 ,  C08L63/00 ,  C08L79/08 ,  H01L23/29 ,  H01L23/31

CPC分类号： H01L23/293 ,  H01L23/295 ,  H01L2924/0002 ,  Y10T428/31511 ,  Y10T428/31721

摘要： A semiconductor device encapsulant contains (a) a thermosetting resin for providing a cured product having a glass transition temperature of not less than 190.degree. C., (b) a filler consisting of a fused silica, (c) a modifier consisting of an MBS or ABS, (d) a modifier consisting of a silicone rubber or a silicone gel, and (e) a lubricant containing a metal chelate compound.

公开(公告)号：US5346743A

公开(公告)日：1994-09-13

申请号：US28696

申请日：1993-03-08

申请人： Ken Uchida ,  Michiya Higashi ,  Shinetsu Fujieda

发明人： Ken Uchida ,  Michiya Higashi ,  Shinetsu Fujieda

IPC分类号： C08G59/32 ,  C08G59/68 ,  C08L63/00 ,  H01B3/40 ,  H01L23/29

CPC分类号： H01L23/293 ,  C08G59/3218 ,  C08G59/686 ,  C08L63/00 ,  H01B3/40 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/1433 ,  H01L2924/181 ,  Y10T428/239

摘要： According to a first embodiment of the present invention, there is provided a resin encapsulation type semiconductor device, comprising a semiconductor element and an epoxy resin composition used as an encapsulating resin, the composition containing as essential components:(a) an epoxy resin represented by formula (I) given below: ##STR1## where R.sup.1, R.sup.2, R.sup.3, and R.sup.4 are hydrogen or an alkyl group respectively, and n.gtoreq.0,(b) a phenolic resin curing agent,(c) an imidazole compound, and(d) triphenyl phosphate.In the first embodiment of the present invention, a heat resistance skeletal structure is formed by the epoxy resin (a) and the phenolic resin curing agent (b) in the epoxy resin composition after cured, leading to an improved resistance to heat and to an improved package crack resistance. Further, the combination of the imidazole compound (c) used as a curing catalyst and triphenyl phosphate (d) permits ensuring a high reliability in terms of the humidity resistance and also permits improving the resistance to the external contamination.

摘要翻译： 根据本发明的第一实施例，提供一种树脂封装型半导体器件，其包含半导体元件和用作封装树脂的环氧树脂组合物，该组合物含有作为必要成分的组合物：（a）由 式（I）：其中R1，R2，R3和R4分别是氢或烷基，n≥0，（b）酚醛树脂固化剂，（c） 咪唑化合物和（d）磷酸三苯酯。 在本发明的第一实施方案中，环氧树脂组合物中的环氧树脂（a）和酚醛树脂固化剂（b）在固化后形成耐热骨架结构，导致耐热性提高 提高包装抗裂性。 此外，用作固化催化剂的咪唑化合物（c）和磷酸三苯酯（d）的组合可以确保在耐湿性方面的高可靠性，并且还可以改善对外部污染的抵抗力。

公开(公告)号：US4719255A

公开(公告)日：1988-01-12

申请号：US760770

申请日：1985-07-31

申请人： Akira Yoshizumi ,  Hisayuki Hirai ,  Kazutaka Matsumoto ,  Shinetsu Fujieda ,  Michiya Higashi

发明人： Akira Yoshizumi ,  Hisayuki Hirai ,  Kazutaka Matsumoto ,  Shinetsu Fujieda ,  Michiya Higashi

IPC分类号： C08L63/00 ,  H01B3/40

CPC分类号： H01B3/40 ,  C08L63/00

摘要： An epoxy resin composition for encapsulation of semiconductor device comprises the components (a), (b), (c) and at least one of the components (d) and (e) as shown below:(a) 100 parts by weight of an epoxy resin having at least 2 epoxy groups in one molecule;(b) 8 to 65 parts by weight of a novolak type phenolic resin with an ortho ratio less than 50%;(c) 1.2 to 40 parts by weight of a polyvinyl acetal compound;(d) 0.8 to 30 parts by weight of a silicone oil; and(e) 4 to 80 parts by weight of a rubber-modified phenolic resin.The described epoxy resins composition for encapsulation of semiconductor devices can retain its high glass transition temperature in the cured product and also has low modulus of elasticity, as well as excellent humidity resistance and thermal shock resistance.

摘要翻译： 用于半导体器件封装的环氧树脂组合物包括如下所示的组分（a），（b），（c）和组分（d）和（e）中的至少一种：（a）100重量份的 一个分子中具有至少2个环氧基团的环氧树脂; （b）8〜65重量份邻位比小于50％的酚醛清漆型酚醛树脂; （c）1.2〜40重量份的聚乙烯醇缩醛化合物; （d）0.8〜30重量份的硅油; 和（e）4至80重量份的橡胶改性酚醛树脂。 所述用于半导体器件封装的环氧树脂组合物可以在固化产物中保持其高的玻璃化转变温度，并且还具有低的弹性模量以及优异的耐湿性和耐热冲击性。

公开(公告)号：US5272377A

公开(公告)日：1993-12-21

申请号：US785812

申请日：1991-10-31

申请人： Hiroshi Shimozawa ,  Shinetsu Fujieda ,  Michiya Higashi ,  Akira Yoshizumi

发明人： Hiroshi Shimozawa ,  Shinetsu Fujieda ,  Michiya Higashi ,  Akira Yoshizumi

IPC分类号： C08L61/06 ,  C08K5/14 ,  C08K5/5313 ,  C08L35/00 ,  C08L61/04 ,  C08L79/08 ,  H01B3/30 ,  H01L23/29 ,  H01L23/31 ,  H01L23/28

CPC分类号： H01L23/293 ,  C08K5/14 ,  C08K5/5313 ,  C08L79/085 ,  H01B3/306 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/1433

摘要： The device characteristics is in containing a maleimide resin with a content of 0.2 weight percent of less of an organic acid, a phenolic resin, and a combination of a basic catalyst and a peroxide as a curing catalyst. In addition, additives as a mold release agent such as a polyethylene wax and an inorganic filler are contained. The maleimide resin composition is prepared in such a manner that a part of the phenolic resin is preblended with the curing catalyst in advance of other components, while the remainder of the phenolic resin is added to the maleimide resin to prepolymerize, and then, the preblend and the prepolyer are blended the other components. The maleimide resin composition has excellent moldability by improvement of curing characteristics through combined use of a basic catalyst and a peroxide as a curing agent. Besides, a resin encapsulated semiconductor device manufactured by encapsulating a semiconductor element with the resin composition has excellent heat resistance and moisture-resistance reliability.

摘要翻译： 该装置的特征在于含有0.2重量％以下的有机酸，酚醛树脂，碱性催化剂和过氧化物的组合的马来酰亚胺树脂作为固化催化剂。 此外，含有作为脱模剂的添加剂如聚乙烯蜡和无机填料。 马来酰亚胺树脂组合物的制备方法是将一部分酚醛树脂与其它组分预先与固化催化剂预混合，同时将剩余的酚醛树脂加入到马来酰亚胺树脂中进行预聚合，然后将预混物 并将预分散器与其它组分混合。 马来酰亚胺树脂组合物通过组合使用碱性催化剂和作为固化剂的过氧化物来改善固化特性，具有优异的成型性。 此外，通过用树脂组合物封装半导体元件制造的树脂封装的半导体器件具有优异的耐热性和耐湿可靠性。

公开(公告)号：US5068267A

公开(公告)日：1991-11-26

申请号：US405533

申请日：1989-09-12

申请人： Ken Uchida ,  Michiya Higashi ,  Naoko Kihara ,  Hiroshi Shimozawa ,  Akira Yoshizumo

发明人： Ken Uchida ,  Michiya Higashi ,  Naoko Kihara ,  Hiroshi Shimozawa ,  Akira Yoshizumo

IPC分类号： C08L61/06 ,  C08G59/00 ,  C08G59/32 ,  C08G59/62 ,  C08L61/04 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31

CPC分类号： H01L23/293 ,  C08G59/3218 ,  C08L63/00 ,  H01L2924/0002

摘要： An encapsulant consisting of an epoxy resin composition and suitably used to encapsulate a semiconductor device which is to be surface-mounted contains(a) an epoxy resin,(b) a rubber-modified phenolic resin comprising a phenolic resin, and a methylmethacrylate-butadiene-styrene copolymer and a thermosetting silicon rubber dispersed in said phenolic resin,(c) a curing accelerator, and(d) a silica powder.

公开(公告)号：US5536970A

公开(公告)日：1996-07-16

申请号：US330215

申请日：1994-10-27

申请人： Michiya Higashi ,  Cao M. Thai

发明人： Michiya Higashi ,  Cao M. Thai

IPC分类号： H01L21/52 ,  H01L23/29 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L23/28

CPC分类号： H01L23/293 ,  H01L23/3135 ,  H01L23/49513 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83194 ,  H01L2224/83855 ,  H01L2224/8388 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2924/351

摘要： A resin-encapsulated semiconductor device having a semiconductor chip mounted on a die pad with a die bonding portion interposed, a lead arranged in a periphery of the die pad and electrically connected with a bonding pad portion of the semiconductor chip, and an encapsulating resin layer which encapsulates the semiconductor chip so that a part of the lead is guided to the outside, wherein an adhesive resin layer is interposed at least either between the die pad and the die bonding portion is described, or between the semiconductor chip and the die bonding portion.

摘要翻译： 一种树脂封装的半导体器件，其具有安装在芯片焊盘上的半导体芯片，芯片接合部分插入，引线布置在芯片焊盘的周围并与半导体芯片的焊盘部分电连接，封装树脂层 其将半导体芯片封装，使得引线的一部分被引导到外部，其中粘合树脂层被插入在芯片焊盘和芯片接合部分之间的至少之间，或者在半导体芯片和芯片接合部分之间 。

公开(公告)号：US5057457A

公开(公告)日：1991-10-15

申请号：US580542

申请日：1990-09-11

申请人： Syouichi Miyahara ,  Keiji Kamasaki ,  Michiya Higashi

发明人： Syouichi Miyahara ,  Keiji Kamasaki ,  Michiya Higashi

IPC分类号： H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L25/065

CPC分类号： H01L23/293 ,  H01L21/56 ,  H01L23/3135 ,  H01L25/0652 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/181

摘要： In multimold semiconductor devices, semiconductor chips are mounted on a lead frame and bonded with wire, sealed by an inner resin, and further enclosed by an outer resin. In particular, wax to be added to the inner resin is at least one compound selected from the group consisting of ester group, fatty acid based, fatty acid metallic salt based, fatty alcohol, polyhydric alcohol, and fatty acid amide compounds. In the semiconductor devices sealed by the inner resin including wax thus defined, since the adhesion strength between the inner and outer resins can be increased, peeling resistance between the two and the moisture resistance can be improved markedly and cracks after dip soldering can be perfectly eliminated, without effecting any conventional inner resin treatment such as honing, burning, after-curing, etc.

公开(公告)号：US4719502A

公开(公告)日：1988-01-12

申请号：US892436

申请日：1986-08-04

申请人： Hirotoshi Ikeya ,  Michiya Higashi

发明人： Hirotoshi Ikeya ,  Michiya Higashi

IPC分类号： C08G59/00 ,  C08G59/62 ,  C08G59/68 ,  C08K5/00 ,  C08K5/23 ,  C08K5/50 ,  C08L63/00 ,  H01L23/02 ,  H01L23/28 ,  H01L23/29 ,  H01L23/31 ,  H01L23/544 ,  H01L23/30

CPC分类号： H01L23/544 ,  C08G59/621 ,  C08G59/688 ,  C08K5/0041 ,  C08K5/50 ,  H01L23/293 ,  H01L23/295 ,  H01L2223/54406 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/48091 ,  Y10T428/239

摘要： An epoxy resin composition for sealing, and a resin-sealed type semiconductor device in which this composition is used, of outstanding heat cycle resistance, humidity resistance and laser marking characteristics, can be obtained by using a combination of an organic phosphine compound and a metal complex dye. The epoxy resin composition, characterized in that it consists of epoxy resin, a curing agent having at least 2 phenolic hydroxyl groups per molecule, an organic phosphine compound and a metal complex dye; and to a resin-sealed type semiconductor device characterized in that it is sealed with this composition.

摘要翻译： 通过使用有机膦化合物和金属的组合，可以获得密封用环氧树脂组合物和使用该组合物的树脂密封型半导体装置，具有优异的耐热循环性，耐湿性和激光标记特性 复合染料。 环氧树脂组合物，其特征在于，其由环氧树脂，每分子具有至少2个酚羟基的固化剂，有机膦化合物和金属络合染料组成; 以及树脂密封型半导体器件，其特征在于用该组合物密封。

公开(公告)号：US5145889A

公开(公告)日：1992-09-08

申请号：US442551

申请日：1989-11-28

申请人： Yusuke Wada ,  Michiya Higashi

发明人： Yusuke Wada ,  Michiya Higashi

IPC分类号： H01L23/29 ,  C08G59/42 ,  C08G59/68 ,  C08K5/54 ,  H01B3/40 ,  H01L23/31

CPC分类号： H01B3/40 ,  C08G59/42 ,  C08K5/5406 ,  H01L2224/48091 ,  H01L2224/48247

摘要： A light-emitting diode device includes a light-emitting diode chip, lead-frames respectively connected to an anode and a cathode of the light-emitting diode chip, an encapsulant for encapsulating the light-emitting diode chip and the lead-frames, and a buffer layer, formed between the encapsulant, on the one hand, and the light-emitting diode chip and the lead-frames, on the other, for reducing the stress acting from the encapsulant onto the light-emitting diode chip and the lead-frames. This device can be minimized degradation of quality caused by this stress, and maintained high product quality for a long period of time. An encapsulating epoxy resin composition contains 100 parts by weight of an epoxy resin, 70 to 140 parts by weight of a curing agent including an acid anhydride, 0.5 to 4.0 parts by weight of a curing accelerator including an onium or diazabicycloalkene salt, and 0.1 to 5.0 parts by weight of a thiophosphite. This resin composition can be suitably used as an encapsulant for LED devices.

摘要翻译： 发光二极管装置包括发光二极管芯片，分别连接到发光二极管芯片的阳极和阴极的引线框架，用于封装发光二极管芯片和引线框架的密封剂，以及 一方面形成在密封剂与发光二极管芯片和引线框架之间的缓冲层，用于减小从密封剂作用到发光二极管芯片和引线框架上的应力， 框架。 该设备可以最小化这种应力引起的质量下降，并保持较长的产品质量。 包封环氧树脂组合物包含100重量份的环氧树脂，70至140重量份的包含酸酐的固化剂，0.5至4.0重量份的包含鎓或二氮杂双环烯烃的固化促进剂和0.1至 5.0重量份的硫代亚磷酸酯。 该树脂组合物可以适合用作LED器件的密封剂。

公开(公告)号：US4710796A

公开(公告)日：1987-12-01

申请号：US739920

申请日：1985-05-31

申请人： Hirotoshi Ikeya ,  Michiya Higashi

发明人： Hirotoshi Ikeya ,  Michiya Higashi

IPC分类号： C08G59/00 ,  C08G59/40 ,  C08G59/62 ,  C08G59/68 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31 ,  H01L23/28

CPC分类号： H01L23/295 ,  H01L23/293 ,  H01L2224/48247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/1301 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T428/23 ,  Y10T428/239

摘要： A resin encapsulation type semiconductor device having a semiconductor element and a resinous encapsulating material for encapsulating said semiconductor element therein, said resinous encapsulating material comprising a cured product of an epoxy resin composition for encapsulation of semiconductor, comprising:(a) 100 parts by weight of an epoxy resin;(b) 5 to 500 parts by weight of a curing agent having at least two phenolic hydroxyl groups in one molecule;(c) 0.01 to 20 parts by weight of an organic phosphine compound; and(d) 0.1 to 100 parts by weight of at least one antimony oxide selected from the group consisting of diantimony tetroxide, hexaantimony tridecaoxide and diantimony pentoxide high reliability in terms of thermal cycle resistance, humidity resistance and the like.

摘要翻译： 一种树脂封装型半导体器件，其具有半导体元件和用于将所述半导体元件封装在其中的树脂封装材料，所述树脂封装材料包括用于半导体封装的环氧树脂组合物的固化产物，其包含：（a）100重量份的 环氧树脂; （b）在一分子中具有至少两个酚羟基的固化剂5至500重量份; （c）0.01〜20重量份的有机膦化合物; 和（d）从耐热循环性，耐湿性等方面考虑，选自二氧化二锑，四氧化锑，五氧化二锑等至少一种氧化锑0.1〜100重量份。