公开(公告)号：US20070111381A1

公开(公告)日：2007-05-17

申请号：US11621904

申请日：2007-01-10

申请人： Kengo IWATA ,  Koji Sato

发明人： Kengo IWATA ,  Koji Sato

IPC分类号： H01L21/00

CPC分类号： H01L24/11 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H05K3/3478 ,  H05K2201/0224 ,  H05K2203/041 ,  H05K2203/121 ,  H01L2224/29099

摘要： The present invention provides a solder ball that has solved the problem of micro-adhesion and, moreover, has solved both of the problems of micro-adhesion and wetting properties, and a method for preventing the micro-adhesion of solder balls. That is, the present invention provides a solder ball obtained by solidification and spheroidization in a gas phase and having metal soap molecules, preferably a metal soap molecules film of 3 nm or less in thickness, adsorbed on its surface. As the metal soap, there can be used, for example, calcium stearate, magnesium stearate or barium stearate. The present invention is preferably applied to solder balls with a diameter of 400 μm or less. The present invention also provides a method for preventing the micro-adhesion of solder balls which comprises immersing solder balls obtained by solidification and spheroidization in a gas phase, in a solution containing a metal soap dispersed therein, preferably, a solution containing a metal soap dispersed therein to a concentration of less than 5 ppm; taking out the solder balls from the solution; vaporizing the solvent on the surfaces of the solder balls; and then drying the surfaces. The drying is preferably conducted in an atmosphere having a relative humidity RH≦40%.

摘要翻译： 本发明提供了一种解决微粘附问题的焊球，并且还解决了微粘附性和润湿性的两个问题，以及防止焊球微粘附的方法。 也就是说，本发明提供一种在气相中凝固和球化获得的焊料球，并且具有吸附在其表面上的金属皂分子，优选厚度为3nm以下的金属皂分子膜。 作为金属皂，可以使用例如硬脂酸钙，硬脂酸镁或硬脂酸钡。 本发明优选应用于直径为400μm以下的焊球。 本发明还提供了一种防止焊锡球的微粘附的方法，其包括将通过固化和球化获得的焊球浸入气相中，在其中分散有金属皂的溶液中，优选将含有分散的金属皂的溶液 其浓度小于5ppm; 从溶液中取出焊球; 汽化锡球表面的溶剂; 然后干燥表面。 干燥优选在相对湿度RH <= 40％的气氛中进行。