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    HERMETIC FEEDTHROUGH
    1.
    发明申请
    HERMETIC FEEDTHROUGH 有权

    公开(公告)号：US20130032378A1

    公开(公告)日：2013-02-07

    申请号：US13564475

    申请日：2012-08-01

    申请人： Kengo Morioka ,  Arne Knudsen ,  Shingo Satou ,  Hidekazu Otomaru ,  Andrew Thom ,  Hiroshi Makino ,  Markus Reiterer ,  Gordon Munns ,  Thomas Miltich ,  Joyce Yamamoto ,  Takahito Hirata

    发明人： Kengo Morioka ,  Arne Knudsen ,  Shingo Satou ,  Hidekazu Otomaru ,  Andrew Thom ,  Hiroshi Makino ,  Markus Reiterer ,  Gordon Munns ,  Thomas Miltich ,  Joyce Yamamoto ,  Takahito Hirata

    IPC分类号： H01B17/26 ,  B32B38/00 ,  B05D3/02

    CPC分类号： A61N1/3754

    摘要： A hermetic feedthrough for an implantable medical device includes a sheet having a hole, where the sheet includes a ceramic comprising alumina. The feedthrough also includes a second material substantially filling the hole, where the second material includes a platinum powder mixture and an alumina additive. The platinum powder mixture includes a first platinum powder having a median particle size of between approximately 3 and 10 micrometers and a second platinum powder that is coarser than the first platinum powder and has a median particle size of between approximately 5 and 20 micrometers. The platinum powder mixture includes between approximately 50 and 80 percent by weight of the first platinum powder and between approximately 20 and 50 percent by weight of the second platinum powder. The first and second materials have a co-fired bond therebetween that hermetically seals the hole.

    摘要翻译： 用于可植入医疗装置的密封馈通包括具有孔的片，其中片包括包含氧化铝的陶瓷。 馈通还包括基本上填充孔的第二材料，其中第二材料包括铂粉末混合物和氧化铝添加剂。 铂粉末混合物包括中值粒径在约3微米至10微米之间的第一铂粉末和比第一铂粉末粗的第二铂粉末，其中位粒度在约5微米至20微米之间。 铂粉末混合物包含第一铂粉末的约50至80重量％和第二铂粉末的约20至50重量％。 第一和第二材料之间具有共烧结，密封该孔。

    Hermetic feedthrough
    2.
    发明授权
    Hermetic feedthrough 有权
    气质馈通

    公开(公告)号：US08872035B2

    公开(公告)日：2014-10-28

    申请号：US13564475

    申请日：2012-08-01

    申请人： Kengo Morioka ,  Arne Knudsen ,  Shingo Satou ,  Hidekazu Otomaru ,  Andrew Thom ,  Hiroshi Makino ,  Markus Reiterer ,  Gordon Munns ,  Thomas Miltich ,  Joyce Yamamoto ,  Takahito Hirata

    发明人： Kengo Morioka ,  Arne Knudsen ,  Shingo Satou ,  Hidekazu Otomaru ,  Andrew Thom ,  Hiroshi Makino ,  Markus Reiterer ,  Gordon Munns ,  Thomas Miltich ,  Joyce Yamamoto ,  Takahito Hirata

    IPC分类号： H01B17/26 ,  B05D3/02 ,  A61N1/375

    CPC分类号： A61N1/3754

    摘要： A hermetic feedthrough for an implantable medical device includes a sheet having a hole, where the sheet includes a ceramic comprising alumina. The feedthrough also includes a second material substantially filling the hole, where the second material includes a platinum powder mixture and an alumina additive. The platinum powder mixture includes a first platinum powder having a median particle size of between approximately 3 and 10 micrometers and a second platinum powder that is coarser than the first platinum powder and has a median particle size of between approximately 5 and 20 micrometers. The platinum powder mixture includes between approximately 50 and 80 percent by weight of the first platinum powder and between approximately 20 and 50 percent by weight of the second platinum powder. The first and second materials have a co-fired bond therebetween that hermetically seals the hole.

    摘要翻译： 用于可植入医疗装置的密封馈通包括具有孔的片，其中片包括包含氧化铝的陶瓷。 馈通还包括基本上填充孔的第二材料，其中第二材料包括铂粉末混合物和氧化铝添加剂。 铂粉末混合物包括中值粒径在约3微米至10微米之间的第一铂粉末和比第一铂粉末粗的第二铂粉末，其中位粒度在约5微米至20微米之间。 铂粉末混合物包含第一铂粉末的约50至80重量％和第二铂粉末的约20至50重量％。 第一和第二材料之间具有共烧结，密封该孔。