Method and apparatus for analyzing composition of defects
    1.
    发明授权
    Method and apparatus for analyzing composition of defects 有权
    分析缺陷组成的方法和装置

    公开(公告)号:US06870169B2

    公开(公告)日:2005-03-22

    申请号:US10735575

    申请日:2003-12-11

    CPC分类号: G06T7/0004 G06T2207/30148

    摘要: In order to be able to detect an irradiation position of an electron beam matching a defect position and conduct composition analysis of a defect with high precision and high efficiency, in the present invention, when a composition analysis target defect is selected and irradiation conditions of the electron beam are set for EDX analysis, a low-resolution reference image of low resolution is acquired using the electron beam at a defect corresponding position corresponding to the position of this defect on a chip in the vicinity of a target chip including defects, and a low-resolution defect image of the same low resolution is next acquired at the defect position of the target chip. Then, by comparing these low-resolution images, the defect position is acquired, the electron beam is slanted and irradiated on this defect position to acquire a composition spectrum of the defect.

    摘要翻译: 为了能够检测匹配缺陷位置的电子束的照射位置并且以高精度和高效率进行缺陷的组成分析,在本发明中,当选择组成分析目标缺陷并且 电子束被设置用于EDX分析,使用电子束在与包括缺陷的目标芯片附近的芯片上的该缺陷的位置相对应的缺陷对应位置处采集低分辨率的低分辨率参考图像,并且 接下来在目标芯片的缺陷位置获取相同低分辨率的低分辨率缺陷图像。 然后,通过比较这些低分辨率图像,获取缺陷位置,电子束被倾斜并照射在该缺陷位置以获得缺陷的组成谱。

    Method and apparatus for inspecting defects in a semiconductor wafer
    3.
    发明授权
    Method and apparatus for inspecting defects in a semiconductor wafer 失效
    用于检查半导体晶片中的缺陷的方法和装置

    公开(公告)号:US06792367B2

    公开(公告)日:2004-09-14

    申请号:US10115815

    申请日:2002-03-28

    IPC分类号: G06F1900

    摘要: In a wafer inspection and sampling system, wafer defects are detected and stored in a data store as defect data. Information is also provided, representative of clusters of defects on the wafer. A statistically based sampling of the defects is made to obtain a set of sampled defects. Subsequent detailed inspection and analysis of the sampled defects produces additional data which facilitate an understanding of process errors.

    摘要翻译: 在晶片检查和采样系统中,晶片缺陷被检测并存储在数据存储器中作为缺陷数据。 还提供了信息,代表晶片上的缺陷簇。 进行基于统计学的缺陷采样,以获得一组采样缺陷。 随后对采样缺陷的详细检查和分析会产生额外的数据,有助于了解过程错误。

    Method and apparatus for analyzing defect information
    4.
    发明授权
    Method and apparatus for analyzing defect information 失效
    用于分析缺陷信息的方法和装置

    公开(公告)号:US06741941B2

    公开(公告)日:2004-05-25

    申请号:US10449528

    申请日:2003-05-29

    IPC分类号: G06F1900

    CPC分类号: H01L21/67253

    摘要: To efficiently extract identification of apparatuses causing problems in a thin-film device manufacturing process, candidates for the problem-generating manufacturing apparatus are extracted by evaluating data obtained in relation to produced inspections and data indicating the states of the manufacturing apparatus, with respect to products that enable efficient extraction of problem-generated apparatuses in a thin-film devise manufacturing process. This facilitates inferring the identification of the problem-generating apparatus.

    摘要翻译: 为了有效地提取在薄膜器件制造过程中导致问题的装置的识别,通过对与产生的检查获得的数据和指示制造装置的状态的数据相关的产品,提取问题产生制造装置的候选 这能够在薄膜设计制造过程中有效地提取问题产生的装置。 这有助于推断问题产生装置的识别。

    Method for observing specimen and device therefor
    6.
    发明授权
    Method for observing specimen and device therefor 有权
    观察标本及其装置的方法

    公开(公告)号:US06756589B1

    公开(公告)日:2004-06-29

    申请号:US09743560

    申请日:2001-01-09

    IPC分类号: H01L2166

    摘要: During closer inspection with a local defect area being magnified, it is desirable to reduce image acquisition time by making the number of stage moves as few as possible so that a defect can be observed efficiently. To accomplish this, the invention offers a method of observing samples characterized by: acquiring a reference sample image not including any defect on a sample by capturing an image of the sample, based on the information on the defect developed on the sample and detected by an inspection apparatus; adjusting the position of the sample so that the defect will fall within the field of view of image capture, based on the above information; acquiring a defective sample image including the defect on the sample by capturing an image of the sample in the adjusted position; locating the defect on the defective sample image by comparing the reference sample image and the defective sample image; acquiring a magnified image of the defect by capturing a magnified view of the local area where the located defect exists within the field of view of image capture; and displaying the magnified image of the defect on a screen.

    摘要翻译: 在局部缺陷区域放大的仔细检查中,期望通过使台数移动尽可能少地减少图像获取时间,从而可以有效地观察到缺陷。 为了实现这一点,本发明提供了一种观察样本的方法,其特征在于:基于在样品上形成的缺陷的信息,通过采集样本的检测信息来获取样本上不包括任何缺陷的参考样本图像, 检验仪器; 基于上述信息,调整样本的位置使得缺陷落入图像捕获视野内; 通过在调整位置拍摄样本的图像来获取包含样本上的缺陷的缺陷样本图像; 通过比较参考样本图像和有缺陷的样本图像来定位缺陷样本图像上的缺陷; 通过在图像捕获视野内捕获定位缺陷的局部区域的放大视图来获取缺陷的放大图像; 并在屏幕上显示缺陷的放大图像。

    Method and its apparatus for inspecting a specimen
    7.
    发明授权
    Method and its apparatus for inspecting a specimen 有权
    检测样本的方法及其装置

    公开(公告)号:US06553323B1

    公开(公告)日:2003-04-22

    申请号:US09661182

    申请日:2000-09-13

    IPC分类号: G01B528

    摘要: The present invention improves inspection efficiency in detailed inspections of defects performed based on inspection information from a defect inspection. Particles and defects are detected by a defect inspection device 1. If the cause of the particles and defects are to be determined by performing a detailed inspection with a details inspection device 3 using an SEM or the like, attributes are determined on the particles and defects detected by the defects inspection device 1 before the detailed inspection is performed. The attributes are determined with an attribute inspection device using an optical microscope or the like. Based on these attributes, the defects and particles are separated into those that require detailed inspection and those that do not require detailed inspection or that cannot be inspected in detail. A details inspection device 3 is used to inspect the particles and defects requiring detailed inspection.

    摘要翻译: 本发明基于来自缺陷检查的检查信息进行的缺陷的详细检查,提高了检查效率。 通过缺陷检查装置1检测颗粒和缺陷。如果通过使用SEM等的细节检查装置3进行详细检查来确定颗粒和缺陷的原因,则根据颗粒和缺陷确定属性 在执行详细检查之前由缺陷检查装置1检测到。 属性由使用光学显微镜等的属性检查装置确定。 基于这些属性,缺陷和颗粒被分成需要详细检查的那些和不需要详细检查或者不能被详细检查的那些。 细节检查装置3用于检查需要详细检查的颗粒和缺陷。

    Inspecting method, inspecting system, and method for manufacturing electronic devices
    8.
    发明授权
    Inspecting method, inspecting system, and method for manufacturing electronic devices 有权
    检查方法,检查系统和电子设备制造方法

    公开(公告)号:US08428336B2

    公开(公告)日:2013-04-23

    申请号:US11431709

    申请日:2006-05-11

    IPC分类号: G06K9/00

    摘要: A method for classifying defects, including: calculating feature quantifies of defect image which is obtained by imaging a defect on a sample; classifying the defect image into a classified category by using information on the calculated feature quantities; displaying the classified defect image in a region on a display screen which is defined to the classified category; adding information on the classified category to the displayed defect image; transferring the displayed defect image which is added the information on the classified category to one of the other categories and displaying the transferred defect image in a region on the display screen which is defined to the one of the other categories; and changing information on the category.

    摘要翻译: 一种用于对缺陷进行分类的方法,包括:通过对样品上的缺陷进行成像而获得的缺陷图像的特征量化计算; 通过使用关于计算的特征量的信息将缺陷图像分类成分类的类别; 在分类的类别的显示屏幕上的区域中显示分类的缺陷图像; 将分类类别的信息添加到所显示的缺陷图像; 将所述分类类别中的信息添加到所述其他类别中的所显示的缺陷图像,并且将所传送的缺陷图像显示在所述显示屏幕上定义为所述其他类别之一的区域中; 并更改关于该类别的信息。

    Defect image classifying method and apparatus and a semiconductor device manufacturing process based on the method and apparatus
    10.
    发明授权
    Defect image classifying method and apparatus and a semiconductor device manufacturing process based on the method and apparatus 有权
    基于该方法和装置的缺陷图像分类方法和装置以及半导体器件制造方法

    公开(公告)号:US07356177B2

    公开(公告)日:2008-04-08

    申请号:US11506310

    申请日:2006-08-17

    IPC分类号: G06K9/00

    CPC分类号: G06T7/001 G06T2207/30148

    摘要: According to the present invention, techniques including a method and apparatus for classifying and displaying images are provided. In an embodiment of the present invention a defect image classification method using inspected objects is provided. The method includes defect images obtained from at least one inspected object. Next a set of defect images is classified into a specified category, which has a feature. The defect images are arranged for display according to the feature and then displayed. The arranging of the defect images may also be based on an evaluation value for each defect image. Another embodiment provides a defect image classification method using inspected objects. Defect images are obtained from at least one inspected object. Next the defect images are classified into a plurality of categories and at least two information items for example, a defect distribution diagram showing locations of defects in the inspected object, information associated with a category of the plurality of categories, and a defect size distribution, are displayed.

    摘要翻译: 根据本发明,提供包括用于分类和显示图像的方法和装置的技术。 在本发明的一个实施例中,提供了使用检查对象的缺陷图像分类方法。 该方法包括从至少一个检查对象获得的缺陷图像。 接下来,一组缺陷图像被分类为具有特征的指定类别。 故障图像根据特征进行显示,然后显示。 缺陷图像的布置也可以基于每个缺陷图像的评估值。 另一实施例提供使用检查对象的缺陷图像分类方法。 从至少一个检查对象获得缺陷图像。 接下来,将缺陷图像分为多个类别和至少两个信息项,例如,示出被检查对象中的缺陷的位置的缺陷分布图,与多个类别的类别相关联的信息以及缺陷尺寸分布, 被显示。