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25 条记录 (耗时 0.031 秒)

    Circuit devices and fabrication Method of the same
    8.
    发明授权
    Circuit devices and fabrication Method of the same 失效
    电路器件及其制造方法相同

    公开(公告)号：US5822850A

    公开(公告)日：1998-10-20

    申请号：US577324

    申请日：1995-12-22

    申请人： Hiroshi Odaira ,  Eiji Imamura ,  Yusuke Wada ,  Yasushi Arai ,  Kenji Sasaoka ,  Takahiro Mori ,  Fumitoshi Ikegaya ,  Sadao Kowatari

    发明人： Hiroshi Odaira ,  Eiji Imamura ,  Yusuke Wada ,  Yasushi Arai ,  Kenji Sasaoka ,  Takahiro Mori ,  Fumitoshi Ikegaya ,  Sadao Kowatari

    IPC分类号： H05K1/09 ,  H05K3/40 ,  H05K3/46 ,  H05K3/02

    CPC分类号： H05K3/4647 ,  H05K3/4069 ,  H05K3/4614 ,  H05K1/095 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2203/1189 ,  H05K3/4652 ,  Y10T29/31 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/5153 ,  Y10T29/5171

    摘要： A supporting member or first synthetic resin sheet with conductive bumps disposed at predetermined positions are superposed on a second synthetic resin sheet under the condition that the resin component of the second synthetic resin sheet is plastic deformed or the temperature thereof exceeds a glass transition temperature so that the conductive bumps are pierced into the second synthetic resin sheet. In other words, the conductive bumps are pierced vertically into the second synthetic resin sheet so as to form through-type conducive lead portions exposed to the first (supporting substrate) and second synthetic resin sheets. The through-type conductive lead portions are used to electrically connect electric devices and circuit and to connect wiring pattern layers. The conductive bumps can be precisely and densely formed and disposed by printing method or plating method. The conductive bumps can be pushed and pierced into the second synthetic resin sheet. Moreover, the conductive bumps can be properly electrically connected to an opposed conductive layer. Thus, the circuit component provides high reliability and contributes to high yield and fabrication efficiency.

    摘要翻译： 在第二合成树脂片上的第二合成树脂片的树脂成分塑性变形或其温度超过玻璃化转变温度的条件下，将叠置在规定位置上的导电性凸起的支撑部件或第一合成树脂片叠置在第二合成树脂片上， 导电凸块被穿入第二合成树脂片。 换句话说，导电凸块被垂直地刺入第二合成树脂片中，以形成暴露于第一（支撑基底）和第二合成树脂片的通孔型导电部分。 贯通型导电引线部分用于电气连接电气设备和电路，并连接布线图案层。 导电凸块可以通过印刷方法或电镀方式精确且密集地形成和布置。 可以将导电凸块推入并穿入第二合成树脂片。 此外，导电凸块可以适当地电连接到相对的导电层。 因此，电路组件提供高可靠性并且有助于高产量和制造效率。

    Circuit devices and fabrication method of the same
    9.
    发明授权
    Circuit devices and fabrication method of the same 失效
    电路器件及其制造方法相同

    公开(公告)号：US5600103A

    公开(公告)日：1997-02-04

    申请号：US204994

    申请日：1994-03-02

    申请人： Hiroshi Odaira ,  Eiji Imamura ,  Yusuke Wada ,  Yasushi Arai ,  Kenji Sasaoka ,  Takahiro Mori ,  Fumitoshi Ikegaya ,  Sadao Kowatari

    发明人： Hiroshi Odaira ,  Eiji Imamura ,  Yusuke Wada ,  Yasushi Arai ,  Kenji Sasaoka ,  Takahiro Mori ,  Fumitoshi Ikegaya ,  Sadao Kowatari

    IPC分类号： H05K1/09 ,  H05K3/40 ,  H05K3/46 ,  H05K1/00

    CPC分类号： H05K3/4647 ,  H05K3/4069 ,  H05K3/4614 ,  H05K1/095 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2203/1189 ,  H05K3/4652 ,  Y10T29/31 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/5153 ,  Y10T29/5171

    摘要： A supporting member or first synthetic resin sheet with conductive bumps disposed at predetermined positions are superposed on a second synthetic resin sheet under the condition that the resin component of the second synthetic resin sheet is plastic deformed or the temperature thereof exceeds a glass transition temperature so that the conductive bumps are pierced into the second synthetic resin sheet. In other words, the conductive bumps are pierced vertically into the second synthetic resin sheet so as to form through-type conducive lead portions exposed to the first (supporting substrate) and second synthetic resin sheets. The through-type conductive lead portions are used to electrically connect electric devices and circuit and to connect wiring pattern layers. The conductive bumps can be precisely and densely formed and disposed by printing method or plating method. The conductive bumps can be pushed and pierced into the second synthetic resin sheet. Moreover, the conductive bumps can be properly electrically Connected to an opposed conductive layer. Thus, the circuit component provides high reliability and contributes to high yield and fabrication efficiency.

    摘要翻译： 在第二合成树脂片上的第二合成树脂片的树脂成分塑性变形或其温度超过玻璃化转变温度的条件下，将叠置在规定位置上的导电性凸起的支撑部件或第一合成树脂片叠置在第二合成树脂片上， 导电凸块被穿入第二合成树脂片。 换句话说，导电凸块被垂直地刺入第二合成树脂片中，以形成暴露于第一（支撑基底）和第二合成树脂片的通孔型导电部分。 贯通型导电引线部分用于电气连接电气设备和电路，并连接布线图案层。 导电凸块可以通过印刷方法或电镀方式精确且密集地形成和布置。 可以将导电凸块推入并穿入第二合成树脂片。 此外，导电凸块可以适当地电连接到相对的导电层。 因此，电路组件提供高可靠性并且有助于高产量和制造效率。

    Semiconductor package and printed wiring board for semiconductor package
    10.
    发明授权
    Semiconductor package and printed wiring board for semiconductor package 失效
    用于半导体封装的半导体封装和印刷电路板

    公开(公告)号：US06534873B1

    公开(公告)日：2003-03-18

    申请号：US09655785

    申请日：2000-09-06

    申请人： Yoshizumi Sato ,  Kenji Sasaoka

    发明人： Yoshizumi Sato ,  Kenji Sasaoka

    IPC分类号： H01L2348

    CPC分类号： H01L23/49838 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2224/45099 ,  H01L2224/05599

    摘要： A ground pattern (12) and power supply pattern (13) which are formed on the surface of a printed wiring board (10) are connected to a ground layer (21) and power supply layer (22) formed as the internal layers via bumps (24a, 24b). The ground pattern (12) need not be connected to the ground layer (21) by uniformly plating the inner side surface of a cavity (43), contributing to an increase in yield and a decrease in cost. When a power supply pattern (13) is to be connected to a power supply layer (22) using through holes, the power supply pattern (13) must be spaced apart from signal pins (14) detouring the region where the through holes are to be formed. However, the distance between the power supply pattern and the signal pins can.be reduced by using bumps. The distance between a semiconductor chip (41) and the signal pins (14) can be reduced to improve the electrical characteristics.

    摘要翻译： 形成在印刷电路板（10）的表面上的接地图案（12）和电源图案（13）通过凸块连接到形成为内层的接地层（21）和电源层（22） （24a，24b）。 接地图案（12）不需要通过均匀地电镀空腔（43）的内侧表面而连接到接地层（21），有助于提高产量并降低成本。 当使用通孔将电源图案（13）连接到电源层（22）时，电源模式（13）必须与通孔所在区域的信号引脚（14）间隔开， 形成。 然而，通过使用凸块来减小电源图案和信号引脚之间的距离。 可以减小半导体芯片（41）和信号引脚（14）之间的距离，以改善电气特性。