公开(公告)号：US08918620B2

公开(公告)日：2014-12-23

申请号：US13159853

申请日：2011-06-14

申请人： Tadashi Matsumura ,  Masahiro Yoshida ,  Kenji Uchiyama

发明人： Tadashi Matsumura ,  Masahiro Yoshida ,  Kenji Uchiyama

IPC分类号： G06F12/00 ,  G06F3/06 ,  G06F13/10

CPC分类号： G06F3/06 ,  G06F3/0611 ,  G06F3/0622 ,  G06F3/0625 ,  G06F3/0635 ,  G06F3/0653 ,  G06F3/0689 ,  G06F11/3485 ,  G06F12/00 ,  G06F13/10 ,  G06F2201/81 ,  G06F2201/815 ,  G06F2201/88 ,  Y02D10/154 ,  Y02D10/34

摘要： A storage control apparatus includes a controller configured to control to convert an access to logical volume into an access to associated RAID group in response to an access to the corresponding virtual volume on the basis of access conversion information, monitor frequency of access to each of logical volumes, select a logical volume on the basis of the monitored frequency of access, move data stored in a RAID group corresponding to the selected logical volume to a different RAID group corresponding to a logical volume to be a data shift destination, and update the access conversion information to convert access to the RAID group corresponding to the selected logical volume into access to the different RAID group.

摘要翻译： 存储控制装置包括：控制器，其被配置为响应于基于访问转换信息访问对应的虚拟卷而控制将对逻辑卷的访问转换为对相关联的RAID组的访问，监视对逻辑 卷，基于所监视的访问频率选择逻辑卷，将存储在与所选逻辑卷对应的RAID组中的数据移动到与要作为数据移位目的地的逻辑卷对应的不同RAID组，并更新访问 转换信息，将对应于所选逻辑卷的RAID组的访问转换为访问不同的RAID组。

公开(公告)号：US08614041B2

公开(公告)日：2013-12-24

申请号：US12519819

申请日：2007-12-18

申请人： Hiroshi Matsuoka ,  Kazuya Sakata ,  Hiroyuki Takei ,  Kenji Uchiyama ,  Ichiro Sasaki

发明人： Hiroshi Matsuoka ,  Kazuya Sakata ,  Hiroyuki Takei ,  Kenji Uchiyama ,  Ichiro Sasaki

IPC分类号： G03G9/08

CPC分类号： G03G9/08711 ,  G03G9/081 ,  G03G9/0821 ,  G03G9/08722 ,  G03G9/0874 ,  G03G9/08795

摘要： Disclosed is a toner for electrophotography containing at least a binder resin. This toner for electrophotography is characterized in that (a) the tetrahydrofuran (THF) soluble content in the toner has a first peak in the molecular weight region of not less than 2,000 but less than 5,000 and a second peak in the molecular weight region of not less than 100,000 but less than 200,000 in the chromatogram obtained by gel permeation chromatography (GPC); (b) the binder resin contains at least a carboxyl group-containing vinyl resin (C) and a glycidyl group-containing vinyl resin (E); and (c) the mass ratio of the styrene monomer to the acrylic monomer in the binder resin, namely (S/A), is not less than 4.6 but less than 8.5.

摘要翻译： 公开了至少含有粘合剂树脂的用于电子照相的调色剂。 该电子照相用调色剂的特征在于，（a）调色剂中的四氢呋喃（THF）可溶成分的分子量区域的第一峰为2000以上且小于5000，在不分子量区域的第二峰 通过凝胶渗透色谱（GPC）获得的色谱图中小于100,000但小于200,000; （b）粘合剂树脂至少含有含羧基的乙烯基树脂（C）和含缩水甘油基的乙烯基树脂（E）; 和（c）粘合剂树脂中苯乙烯单体与丙烯酸类单体的质量比即（S / A）不小于4.6但小于8.5。

公开(公告)号：US20100209837A1

公开(公告)日：2010-08-19

申请号：US12675362

申请日：2008-08-27

申请人： Hiroshi Matsuoka ,  Kazuya Sakata ,  Hiroyuki Takei ,  Kenji Uchiyama ,  Ichirou Sasaki

发明人： Hiroshi Matsuoka ,  Kazuya Sakata ,  Hiroyuki Takei ,  Kenji Uchiyama ,  Ichirou Sasaki

IPC分类号： G03G9/087 ,  G03G9/09 ,  G03G9/08

CPC分类号： C08L25/14 ,  C08L53/025 ,  C08L91/06 ,  C08L2205/02 ,  C08L2205/035 ,  C09D125/14 ,  G03G9/08708 ,  G03G9/08722 ,  G03G9/08724 ,  G03G9/08788 ,  G03G9/08791 ,  G03G9/08795 ,  G03G9/08797 ,  C08L2666/04 ,  C08L2666/02

摘要： Provided is a binder resin for color toners which comprises at least a carboxyl group-containing vinyl resin (C), a glycidyl group-containing vinyl resin (E) and a reaction product thereof, wherein the storage modulus G′ at 160 degrees centigrade is not less than 20 and less than 800 Pa measured at a frequency of 6.28 rad/sec, the tetrahydrofuran (THF) soluble portion in the binder resin has a main peak in the molecular weight region of not less than 20,000 and less than 40,000 in the molecular weight distribution measured by gel permeation chromatography (GPC), and the binder resin contains at least one of releasing agents having a melting point of not lower than 60 and not higher than 120 degrees centigrade in an amount of not less than 3.5 and not more than 12 mass % based on 100 mass % of the total amount of the carboxyl group-containing vinyl resin (C), the glycidyl group-containing vinyl resin (E) and a reaction product thereof.

摘要翻译： 提供一种用于彩色调色剂的粘合剂树脂，其至少包含含羧基的乙烯基树脂（C），含缩水甘油基的乙烯基树脂（E）及其反应产物，其中160摄氏度的储能模量G' 在6.28rad / sec的频率下测定的不低于20和小于800Pa的粘合剂树脂中的四氢呋喃（THF）可溶部分在分子量区域中的主峰不小于20,000并且小于40,000 通过凝胶渗透色谱法（GPC）测定的分子量分布，粘合剂树脂含有熔点不低于60℃且不高于120℃的脱模剂中的至少一种，不低于3.5，而不是更多 基于含羧基的乙烯基树脂（C），含缩水甘油基的乙烯基树脂（E）和其反应产物的总量的100质量％为12质量％以上。

公开(公告)号：US07346410B2

公开(公告)日：2008-03-18

申请号：US11301758

申请日：2005-12-13

申请人： Kenji Uchiyama

发明人： Kenji Uchiyama

IPC分类号： G06F19/00

CPC分类号： G06Q10/04

摘要： A system for manufacturing an electronic device having a processing unit which includes a timer that processes a plurality of lots each having a plurality of work pieces and measuring in units of lots a processing time of the work pieces constituting the respective lots, an environmental information measurement module that measures environmental information corresponding to the processing time of the work pieces measured in units of lots, and a communication module for transmission and reception, and a work information management unit having a storage module which is provided to correspond to each lot, communicates with the communication module of the processing unit, and receives and stores the processing time and the environmental information of the work pieces of the lot.

摘要翻译： 一种具有处理单元的电子设备的制造方法，该处理单元包括：处理多个批次的定时器，每个批次具有多个工件，并且以批量为单位测量构成各批次的工件的处理时间;环境信息测量 模块，其测量与以批量为单位测量的工件的处理时间相对应的环境信息;以及通信模块，用于发送和接收，以及工作信息管理单元，具有设置成对应于每个批次的存储模块，与 处理单元的通信模块，并且接收并存储批次的工件的处理时间和环境信息。

公开(公告)号：US20060289309A1

公开(公告)日：2006-12-28

申请号：US11513680

申请日：2006-08-30

申请人： Takashi Fukuzawa ,  Jun Yamaguchi ,  Kenji Uchiyama ,  Akihiko Hattori

发明人： Takashi Fukuzawa ,  Jun Yamaguchi ,  Kenji Uchiyama ,  Akihiko Hattori

IPC分类号： C07K1/26

CPC分类号： F16K99/0017 ,  B01J19/0093 ,  B01J2219/00783 ,  B01J2219/00826 ,  B01J2219/00831 ,  B01J2219/00837 ,  B01J2219/0086 ,  B01J2219/00873 ,  B01J2219/00889 ,  B01J2219/00891 ,  B01J2219/00936 ,  B01L3/502738 ,  B01L2300/161 ,  B01L2400/0672 ,  B01L2400/0688 ,  F16K99/0001 ,  F16K99/0019 ,  F16K99/0036 ,  F16K2099/0074 ,  F16K2099/0076 ,  F16K2099/0084

摘要： A microchemical system is disclosed that is capable of controlling the flow of a sample solution flowing through a channel in a microchip. In the microchemical system 1, a microchip 7 has therein a T-shaped channel 4 comprised of a main channel 2, a sub-channel 3, and a merging portion 4 where the main channel 2 and the sub-channel 3 merge together. Panel heaters 8 and 9 are installed in a position such as to be able to heat the interior of the sub-channel 3. The sub-channel 3 and the merging portion are subjected to hydrophobic modification treatment. Water is supplied into the main channel 2, and air is supplied into the sub-channel 3.

摘要翻译： 公开了一种微化学系统，其能够控制流过微芯片中的通道的样品溶液的流动。 在微化学系统1中，微芯片7具有由主通道2，子通道3和合流部分4组成的T形通道4，主通道2和子通道3合并在一起。 面板加热器8和9安装在能够加热子通道3的内部的位置。 对子通道3和合流部进行疏水改性处理。 水被供应到主通道2中，并且空气被供应到子通道3中。

公开(公告)号：US20050056948A1

公开(公告)日：2005-03-17

申请号：US10955798

申请日：2004-09-30

申请人： Kenji Uchiyama

发明人： Kenji Uchiyama

IPC分类号： G02F1/1343 ,  G02F1/13 ,  G02F1/136 ,  H01L21/52 ,  H01L21/56 ,  H01L21/60 ,  H01L21/30

CPC分类号： H01L24/83 ,  G02F1/13452 ,  H01L21/563 ,  H01L24/28 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/73203 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2924/00

摘要： A semiconductor device connecting structure is provided for connecting a semiconductor IC to a substrate. A bonding layer is placed between the substrate and the semiconductor IC to accomplish adhesion therebetween. Sufficient heat and pressure are applied to the bonding layer to create spaces therein which deform during relative movement between the semiconductor IC and substrate thereby maintaining consistent electrical contact between the semiconductor contact bumps and electrodes on the substrate.

摘要翻译： 提供半导体器件连接结构用于将半导体IC连接到衬底。 在基板和半导体IC之间设置接合层以实现它们之间的粘合。 对结合层施加足够的热和压力以在半导体IC和衬底之间的相对运动期间产生空间，从而保持半导体接触凸块和衬底上的电极之间的一致的电接触。

公开(公告)号：US06357111B1

公开(公告)日：2002-03-19

申请号：US09202846

申请日：1998-12-18

申请人： Kenji Uchiyama

发明人： Kenji Uchiyama

IPC分类号： H01R900

CPC分类号： H01L24/83 ,  G02F1/13452 ,  H01L24/29 ,  H01L2224/29298 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/321 ,  H05K2201/10674 ,  H05K2201/10719 ,  H05K2201/10727 ,  H05K2203/013 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T29/49155 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： Conductive connection can be effected between electrodes arranged at a minute pitch. When joining an IC chip (36), which is a semiconductor device, to an external substrate (32a), conductive paste (41) is sprayed in particles to terminals (37) on the external substrate (32a) and the conductive paste (41) is put on the electrodes (37). Next, positioning of pads (38) of the IC chip (36) is effected with respect to the conductive paste (41) and, in this condition, the IC chip (36) and the substrate (32a) are glued to each other. Since the conductive paste (41) is sprayed in particles and printed on the electrodes (37), it is possible to correctly put the conductive paste (41) thereon even when the electrodes (37) are arranged at a minute pitch. Further, since conduction is effected between the pads (38) and the electrodes (37) through the conductive paste (41), the conduction state is stable. This conductive connection method is suitably applicable to the connection between substrate side electrodes formed on a substrate and element side electrodes formed on an electronic element mounted on the substrate in a variety of devices such as liquid crystal devices and electronic apparatuses.

摘要翻译： 可以在以分钟间距布置的电极之间实现导电连接。 当将作为半导体器件的IC芯片（36）连接到外部基板（32a）时，将导电浆料（41）以粒子的形式喷射到外部基板（32a）上的端子（37）和导电浆料（41） ）放在电极（37）上。 接下来，相对于导电膏（41）实现IC芯片（36）的焊盘（38）的定位，并且在这种状态下，IC芯片（36）和基板（32a）彼此胶合。 由于导电膏（41）以颗粒喷涂并印刷在电极（37）上，所以即使当电极（37）以微小间距排列时，也可以将导电膏（41）正确地放置在其上。 此外，由于通过导电膏（41）在焊盘（38）和电极（37）之间进行导通，所以导通状态稳定。 该导电连接方法适用于在液晶装置和电子设备等各种装置中形成于基板上的基板侧电极与安装在基板上的电子元件上形成的元件侧电极之间的连接。

公开(公告)号：US06356333B1

公开(公告)日：2002-03-12

申请号：US09448552

申请日：1999-11-23

申请人： Kenji Uchiyama

发明人： Kenji Uchiyama

IPC分类号： G02F11345

CPC分类号： H01L24/83 ,  G02F1/13452 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/73204 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/189 ,  H05K3/323 ,  H05K3/341 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/0401

摘要： A conductive adhesive which can withstand exposure to high temperature during a solder reflow process comprises an adhesive resin and a plurality of conductive particles mixed in the adhesive resin. The conductive particles each include a core formed of a synthetic resin and a conductive material coated around the core. The cores are each formed of a material having a thermal deformation temperature higher than that of the adhesive resin, and more preferably formed of a material having a thermal deformation temperature (18.6 kg/cm2) higher than 120° C. as measured according to the measuring method defined in the ASTM standard D648, and still more preferably formed of a material selected from the group consisting of polyphenylene oxide, polysulfone, polycarbonate, polyacetal, and polyethylene terephthalate.

摘要翻译： 在回流焊接过程中可承受高温暴露的导电粘合剂包括粘合树脂和粘合树脂中混合的多个导电颗粒。 导电颗粒各自包括由合成树脂形成的芯和围绕芯部涂覆的导电材料。 芯部由热变形温度高于粘合剂树脂的材料形成，更优选由热变形温度（18.6kg / cm 2）高于120℃的材料形成，如根据 测定方法在ASTM标准D648中定义，并且还更优选由选自聚苯醚，聚砜，聚碳酸酯，聚缩醛和聚对苯二甲酸乙二醇酯的材料形成。

公开(公告)号：US06265770B1

公开(公告)日：2001-07-24

申请号：US09275372

申请日：1999-03-24

申请人： Kenji Uchiyama

发明人： Kenji Uchiyama

IPC分类号： H01L2304

CPC分类号： H01L24/29 ,  G02F1/13452 ,  H01L23/4985 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/29444 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/361 ,  H01L2224/29298 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： A mounting structure of a semiconductor chip including a semiconductor chip 6 with a plurality of bumps 16, and a circuit substrate 3 with a plurality of output wires 11 and input terminals 12. In the press-bonding process, ACF 4 is used to join the semiconductor chip 6 and the circuit substrate 3 together so as to allow electrical conduction between the bumps 16 and the land parts of, for example, the output wires 11. A plurality of transfixion holes 10 are formed so as to be spread out in an area of the circuit board 3 surrounded by the land parts of the wires 11 and the terminals 12, and the excess ACF 4, present during the press-bonding, is allowed to escape through the transfixion holes 10, thereby preventing generation of a large internal stress in the ACF 4. This allows the IC 6 to be joined more reliably.

摘要翻译： 包括具有多个凸块16的半导体芯片6和具有多个输出导线11和输入端子12的电路基板3的半导体芯片的安装结构。在压接过程中，ACF4用于连接 半导体芯片6和电路基板3在一起，以便允许凸块16与例如输出导线11的凸台部分之间的导电。多个贯穿孔10被形成为扩展到区域 由导线11和端子12的接地部分围绕的电路板3和压接期间存在的过量ACF 4被允许通过贯穿孔10逸出，从而防止产生大的内应力 在ACF 4中。这允许IC 6更可靠地连接。

公开(公告)号：US06222281B1

公开(公告)日：2001-04-24

申请号：US09286513

申请日：1999-04-06

申请人： Kenji Uchiyama

发明人： Kenji Uchiyama

IPC分类号： H01L2348

CPC分类号： H01L24/83 ,  H01L24/13 ,  H01L24/14 ,  H01L24/29 ,  H01L2224/13016 ,  H01L2224/14051 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2924/00

摘要： An IC chip includes a built-in semiconductor and a plurality of bumps exposed to the exterior and provided on a surface, the bumps being pressed and bonded to a substrate or the like using an ACF (Aniosotropic Conductive Film). With respect to at least one of the bumps among the plurality of bumps, the height H of the outer portion is determined to be larger than the height H of the inner portion. When the ACF is pressed by the IC chip, conductive particles in the ACF are prevented from outwardly escaping from the bump by the high outer portion. Therefore, a greater number of conductive particles can be trapped around the bump.

摘要翻译： IC芯片包括内置半导体和暴露于外部并设置在表面上的多个凸块，凸块使用ACF（一个一维不透性导电膜）被压制和粘合到基板等上。 关于多个凸块中的至少一个凸块，外部的高度H被确定为大于内部的高度H. 当ACF被IC芯片按压时，ACF中的导电颗粒被高外部部分防止从凸块向外逸出。 因此，可以将更多数量的导电颗粒捕获在凸块周围。