Modular belt carrier for electronic components
    1.
    发明授权
    Modular belt carrier for electronic components 失效
    用于电子元件的模块化皮带载体

    公开(公告)号:US07066314B2

    公开(公告)日:2006-06-27

    申请号:US10642052

    申请日:2003-08-15

    IPC分类号: B65G15/64 B05C13/00

    摘要: Replaceable component carriers (40) are adapted to be freely floating in belt apertures (74) and have alignment features (160), such as conical holes (170), mated to features (162), such as tapered pins (184), in processing stations to temporarily hold a carrier (40) and its components (10), such as resistors, in a fixed position during various processes, such as termination. The carriers (40) include a rigid substructure (50) and a more elastic coating (60) to provide receiving holes (46) that can be adapted to hold particular components (10). The carriers (40) can be replaced without removing the belt (72), whenever differently shaped holes (46) are desired or become too worn to reliably handle components (10), thereby reducing damage risk, replacement cost, and operational down time of the belt (72).

    摘要翻译: 可更换部件托架(40)适于自由地浮动在带孔(74)中并且具有对准特征(160),例如锥形孔(170),配合到特征(162),例如锥形销(184), 处理站在诸如终止的各种处理期间将载体(40)及其组件(10)例如电阻器保持在固定位置。 载体(40)包括刚性基础结构(50)和更具弹性的涂层(60),以提供适于保持特定部件(10)的接纳孔(46)。 每当需要不同形状的孔(46)或变得太磨损而不能可靠地处理部件(10)时,可以更换托架(40)而不移除带(72),从而降低损坏风险,重置成本和运行停机时间 皮带(72)。

    Loading and extraction of modular belt carriers of electronic components
    2.
    发明授权
    Loading and extraction of modular belt carriers of electronic components 失效
    装载和提取电子元件的模块化传送带

    公开(公告)号:US07243776B2

    公开(公告)日:2007-07-17

    申请号:US10989904

    申请日:2004-11-15

    IPC分类号: B65G15/64 B05C13/00

    摘要: Replaceable component carriers (40) are adapted to be freely floating in belt apertures (74) and have alignment features (160), such as conical holes (170), mated to features (162), such as tapered pins (184), in processing stations to temporarily hold a carrier (40) and its components (10), such as resistors, in a fixed position during various processes, such as termination. The carriers (40) include a rigid substructure (50) and a more elastic coating (60) to provide receiving holes (46) that can be adapted to hold particular components (10). The carriers (40) can be replaced without removing the belt (72), whenever differently shaped holes (46) are desired or become too worn to reliably handle components (10), thereby reducing damage risk, replacement cost, and operational down time of the belt (72).

    摘要翻译: 可更换部件托架(40)适于自由地浮动在带孔(74)中并且具有对准特征(160),例如锥形孔(170),配合到特征(162),例如锥形销(184), 处理站在诸如终止的各种处理期间将载体(40)及其组件(10)例如电阻器保持在固定位置。 载体(40)包括刚性基础结构(50)和更具弹性的涂层(60),以提供适于保持特定部件(10)的接纳孔(46)。 每当需要不同形状的孔(46)或变得太磨损而不能可靠地处理部件(10)时,可以更换托架(40)而不移除带(72),从而降低损坏风险,重置成本和运行停机时间 皮带(72)。

    Methods and apparatus for rotationally accessed tester interface
    3.
    发明授权
    Methods and apparatus for rotationally accessed tester interface 有权
    用于旋转访问的测试仪接口的方法和装置

    公开(公告)号:US07498800B1

    公开(公告)日:2009-03-03

    申请号:US11880093

    申请日:2007-07-18

    IPC分类号: G01R31/28

    CPC分类号: G01R1/0416 G01R31/2831

    摘要: A wafer/wafer translator pair in the attached state, with the wafer translator extending beyond the outer circumference of the wafer, is disposed on a rotation stage. At least one surface of the edge-extended wafer translator, in a peripheral annular region, provides contact pads electrically coupled to corresponding pads on the wafer, and a caliper-style contact block, operable to move perpendicularly the edge-extended wafer translator is positioned such the contact pads of the annular region may be electrically engaged with the contact block. After electrical communication between the wafer and the contact block, the contact block moves to a disengagement position, the rotation stage rotates the wafer/wafer translator pair to a new position and the contact block may then move into engagement with different contact pads in the annular region.

    摘要翻译: 在晶片/晶片转换器对中,晶片平移器延伸超过晶片的外圆周,被安置在旋转平台上。 边缘延伸晶片转换器的至少一个表面在外围环形区域中提供电耦合到晶片上的相应焊盘的接触垫,并且卡钳式接触块可操作以垂直移动边缘延伸晶片转换器 这样环形区域的接触垫可以与接触块电接合。 在晶片和接触块之间的电气连通之后,接触块移动到分离位置,旋转台将晶片/晶片转换器对旋转到新的位置,接触块然后可以移动成与环形的不同接触垫接合 地区。