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公开(公告)号:US5990418A
公开(公告)日:1999-11-23
申请号:US902556
申请日:1997-07-29
申请人: Kevin G. Bivona , Jeffrey T. Coffin , Stephen S. Drofitz, Jr. , Lewis S. Goldmann , Mario J. Interrante , Sushumna Iruvanti , Raed A. Sherif
发明人: Kevin G. Bivona , Jeffrey T. Coffin , Stephen S. Drofitz, Jr. , Lewis S. Goldmann , Mario J. Interrante , Sushumna Iruvanti , Raed A. Sherif
CPC分类号: H01L23/562 , H01L23/16 , H01L23/42 , H01L2224/16 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/15311 , H01L2924/16152 , H01L2924/16251
摘要: A device and method for hermetically sealing an integrated circuit chip between a substrate and a lid while providing effective dissipation of heat generated by the integrated circuit chip. The device includes an integrated circuit chip, carrier substrate, interface coolant, and a lid. The integrated circuit chip is attached to the top of the carrier substrate. The interface coolant is disposed on the top of the integrated circuit chip and the lid is placed on top of the carrier substrate/integrated circuit chip combination and contacts the interface coolant. The interface coolant provides a thermal path for conducting heat from the integrated circuit chip to the lid. The substrate is attached to a circuit board by a ceramic ball grid array (CBGA) or a ceramic column grid array (CCGA).
摘要翻译: 一种用于在集成电路芯片产生的热量的有效耗散的同时在衬底和盖子之间气密密封集成电路芯片的装置和方法。 该装置包括集成电路芯片,载体基板,界面冷却剂和盖子。 集成电路芯片附着到载体衬底的顶部。 接口冷却剂设置在集成电路芯片的顶部,并且盖子被放置在载体基板/集成电路芯片组合的顶部上并且接触界面冷却剂。 界面冷却剂提供用于将热量从集成电路芯片传导到盖子的热路径。 衬底通过陶瓷球栅阵列(CBGA)或陶瓷柱栅阵列(CCGA)连接到电路板。