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    Optical device and method for manufacturing same
    1.
    发明授权
    Optical device and method for manufacturing same 有权
    光学装置及其制造方法

    公开(公告)号：US08921879B2

    公开(公告)日：2014-12-30

    申请号：US13583559

    申请日：2011-03-30

    申请人： Ki Myung Nam ,  Tae-Hwan Song ,  Young-Chul Jun

    发明人： Ki Myung Nam ,  Tae-Hwan Song ,  Young-Chul Jun

    IPC分类号： H01L33/00 ,  H05K1/05 ,  H01L25/075 ,  H01L33/62

    CPC分类号： H01L25/0753 ,  H01L24/73 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2933/0075 ,  H05K1/05 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： The present invention relates to an optical device and a method for manufacturing the same. The technical object of the invention is to realize a surface emitting body which allows heat generated from a light-emitting chip to be easily dissipated, eliminates the need for an additional wiring layer, and allows a singular light emitting chips or a plurality of light emitting chips to be arranged in series, in parallel, or in series-parallel. The present invention discloses an optical device comprising: a substrate; a plurality of light emitting chips disposed on the substrate; a plurality of conductive wires which electrically connect the substrate with the light emitting chips such that the plurality of light emitting chips are connected to each other in series, in parallel or in series-parallel; and a protective layer which covers the plurality of light emitting chips and the plurality of conductive wires on the substrate.

    摘要翻译： 本发明涉及一种光学装置及其制造方法。 本发明的技术目的是实现一种表面发射体，其使得能够容易地消散从发光芯片产生的热量，消除了对附加布线层的需要，并且允许单个发光芯片或多个发光 芯片串联布置，并联或并联布置。 本发明公开了一种光学装置，包括：基板; 设置在所述基板上的多个发光芯片; 多个导线，其将所述基板与所述发光芯片电连接，使得所述多个发光芯片串联并联或并联连接; 以及覆盖基板上的多个发光芯片和多个导线的保护层。

    Substrate for Optical Device
    3.
    发明申请
    Substrate for Optical Device 审中-公开
    光学元件基板

    公开(公告)号：US20140177242A1

    公开(公告)日：2014-06-26

    申请号：US14232593

    申请日：2012-07-11

    申请人： Ki Myung Nam ,  Young Chul Jun ,  Tae Hwan Song

    发明人： Ki Myung Nam ,  Young Chul Jun ,  Tae Hwan Song

    IPC分类号： H01L33/64

    CPC分类号： H01L33/647 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L33/644 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/48505 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/181 ,  H05K1/0204 ,  H05K2201/10106 ,  H05K2201/10416 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

    摘要： The present invention relates to a substrate for an optical device, which is configured to connect an optical element substrate and an electrode substrate in a fitting manner, and simultaneously, to form one or more bridge pads which are insulated from the optical element substrate by a horizontal insulating layer, on the optical element substrate. The substrate for an optical device according to a first aspect of the present invention comprises: an optical element substrate which is made of a metal plate and contains a plurality of optical elements therein; a pair of electrode substrates which are made of an insulating material to form a conductive layer on at least a portion of the upper surface thereof, are connected to both side surfaces of the optical element substrate, respectively, and are wire-bonded to the electrodes of the optical elements; and a fitting means which is formed on the side surfaces of the electrode substrate and the optical element substrate to fit the optical element substrate and the electrode substrate. The substrate for an optical device according to a second aspect of the present invention comprises: an optical element substrate which is made of a metal plate and contains a plurality of optical elements therein; a pair of electrode substrates which are made of a metal material to be connected to both side surfaces of the optical element substrate, respectively, and are wire-bonded to the electrodes of the optical elements; a fitting means which is formed on the side surfaces of the electrode substrate and the optical element substrate to fit the optical element substrate and the electrode substrate; and a fitting-type vertical insulating layer which is interposed between the optical element substrate and the electrode substrate so as to be connected to the fitting means.

    摘要翻译： 光学元件用基板技术领域本发明涉及一种用于光学元件的基板，其被配置为以配合的方式连接光学元件基板和电极基板，并且同时形成一个或多个与光学元件基板绝缘的桥接焊盘 水平绝缘层，在光学元件基板上。 根据本发明第一方面的用于光学器件的衬底包括：光学元件衬底，其由金属板制成并且在其中包含多个光学元件; 分别在光学元件基板的两个侧表面上分别连接由绝缘材料制成的一对电极基板，以在其上表面的至少一部分上形成导电层，并将其导线接合到电极 的光学元件; 以及形成在电极基板和光学元件基板的侧面上以配合光学元件基板和电极基板的嵌合装置。 根据本发明第二方面的用于光学器件的衬底包括：光学元件衬底，其由金属板制成并且在其中包含多个光学元件; 由金属材料制成的一对电极基片，分别与光学元件基板的两个侧面连接，并且被引线接合到光学元件的电极上; 形成在电极基板和光学元件基板的侧面上以配合光学元件基板和电极基板的嵌合装置; 以及插入在所述光学元件基板和所述电极基板之间的嵌合型垂直绝缘层，以便连接到所述装配装置。

    SUBSTRATE FOR AN OPTICAL DEVICE, AN OPTICAL DEVICE PACKAGE COMPRISING THE SAME AND A PRODUCTION METHOD FOR THE SAME
    6.
    发明申请
    SUBSTRATE FOR AN OPTICAL DEVICE, AN OPTICAL DEVICE PACKAGE COMPRISING THE SAME AND A PRODUCTION METHOD FOR THE SAME 审中-公开
    用于光学装置的基板，包括该光学装置的光学装置包装及其制造方法

    公开(公告)号：US20110278624A1

    公开(公告)日：2011-11-17

    申请号：US13146337

    申请日：2009-12-29

    申请人： Ki Myung Nam

    发明人： Ki Myung Nam

    IPC分类号： H01L33/60 ,  H01L33/48

    CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L33/642 ,  H01L2224/48091 ,  H05K1/053 ,  H05K1/183 ,  H05K3/244 ,  H05K3/3436 ,  H05K2201/10106 ,  H01L2924/00014

    摘要： The present invention relates to a substrate for an optical device, to an optical device package comprising the same and to a production method for the same. According to the present invention, the substrate for an optical device, the optical device package comprising the same and the production method for the same may comprise: a metal substrate; a first anodized layer which is formed on the top surface of the metal substrate and insulates the metal substrate; and a first and a second electrode formed insulated from each other on the top of the first anodized layer.

    摘要翻译： 本发明涉及一种用于光学器件的基板，涉及包括该光学器件的光学器件封装及其制造方法。 根据本发明，用于光学器件的基板，包括该光学元件的光学器件封装及其制造方法可以包括：金属基板; 第一阳极氧化层，其形成在所述金属基板的顶表面上并使所述金属基板绝缘; 以及在第一阳极氧化层的顶部彼此绝缘的第一和第二电极。