METHOD OF FABRICATING MOS TRANSISTOR AND MOS TRANSISTOR FABRICATED THEREBY
    1.
    发明申请
    METHOD OF FABRICATING MOS TRANSISTOR AND MOS TRANSISTOR FABRICATED THEREBY 审中-公开
    制造MOS晶体管和MOS晶体管的方法

    公开(公告)号:US20090085075A1

    公开(公告)日:2009-04-02

    申请号:US12196454

    申请日:2008-08-22

    摘要: A method of fabricating a MOS transistor, and a MOS transistor fabricated by the method. The method can include forming a gate pattern on a semiconductor substrate. The gate pattern can be formed by sequentially stacking a gate electrode and a capping layer pattern. The capping layer pattern is formed to have a lower capping layer pattern and an upper capping layer pattern. The lower capping layer pattern is formed to a smaller width than the upper capping layer pattern.

    摘要翻译: 一种制造MOS晶体管的方法和通过该方法制造的MOS晶体管。 该方法可以包括在半导体衬底上形成栅极图案。 栅极图案可以通过顺序堆叠栅电极和覆盖层图案来形成。 盖层图案形成为具有较低的封盖层图案和上覆盖层图案。 下盖层图案形成为比上盖层图案小的宽度。

    Methods of manufacturing a semiconductor device
    2.
    发明授权
    Methods of manufacturing a semiconductor device 有权
    制造半导体器件的方法

    公开(公告)号:US07981784B2

    公开(公告)日:2011-07-19

    申请号:US12381175

    申请日:2009-03-09

    IPC分类号: H01L21/00

    摘要: Isolation regions are formed on a substrate to define an active region. A gate electrode is formed on the active region. A spacer structure is formed on a sidewall of the gate electrode. A gate silicide layer is formed on the gate electrode and a source/drain silicide layer is formed on the active region adjacent to the gate electrode. An upper portion of the gate silicide layer and a portion of the spacer structure are simultaneously removed to form a spacer structure pattern and a gate silicide layer pattern. A stress layer is formed to cover the gate electrode and spacer structure pattern.

    摘要翻译: 隔离区形成在衬底上以限定有源区。 在有源区上形成栅电极。 间隔结构形成在栅电极的侧壁上。 在栅电极上形成栅极硅化物层,并且在与栅电极相邻的有源区上形成源极/漏极硅化物层。 栅极硅化物层的上部和间隔物结构的一部分被同时去除以形成间隔物结构图案和栅极硅化物层图案。 形成应力层以覆盖栅电极和间隔结构图案。

    Methods of manufcturing a semiconductor device
    3.
    发明申请
    Methods of manufcturing a semiconductor device 有权
    制造半导体器件的方法

    公开(公告)号:US20090227082A1

    公开(公告)日:2009-09-10

    申请号:US12381175

    申请日:2009-03-09

    IPC分类号: H01L21/76

    摘要: Isolation regions are formed on a substrate to define an active region. A gate electrode is formed on the active region. A spacer structure is formed on a sidewall of the gate electrode. A gate silicide layer is formed on the gate electrode and a source/drain silicide layer is formed on the active region adjacent to the gate electrode. An upper portion of the gate silicide layer and a portion of the spacer structure are simultaneously removed to form a spacer structure pattern and a gate silicide layer pattern. A stress layer is formed to cover the gate electrode and spacer structure pattern.

    摘要翻译: 隔离区形成在衬底上以限定有源区。 在有源区上形成栅电极。 间隔结构形成在栅电极的侧壁上。 在栅电极上形成栅极硅化物层,并且在与栅电极相邻的有源区上形成源极/漏极硅化物层。 栅极硅化物层的上部和间隔物结构的一部分被同时去除以形成间隔物结构图案和栅极硅化物层图案。 形成应力层以覆盖栅电极和间隔结构图案。

    Method of manufacturing transistor having metal silicide and method of manufacturing a semiconductor device using the same
    4.
    发明授权
    Method of manufacturing transistor having metal silicide and method of manufacturing a semiconductor device using the same 有权
    制造具有金属硅化物的晶体管的方法和使用其制造半导体器件的方法

    公开(公告)号:US07939452B2

    公开(公告)日:2011-05-10

    申请号:US12320604

    申请日:2009-01-30

    IPC分类号: H01L21/302 H01L21/461

    摘要: In a method of manufacturing a transistor and a method of manufacturing a semiconductor device using the same, the method may include forming a preliminary metal silicide pattern on a single-crystalline silicon substrate and on a polysilicon pattern, and partially etching the preliminary metal silicide pattern to form a first metal silicide pattern on the substrate and a second metal silicide pattern on the polysilicon pattern, the second metal silicide pattern having a line width the same as or smaller than that of the polysilicon pattern. The method may include the transistor having no metal silicide residue on the spacer. Accordingly, an operation failure due to the residue may be prevented or reduced.

    摘要翻译: 在制造晶体管的方法和使用其制造半导体器件的方法中,该方法可以包括在单晶硅衬底和多晶硅图案上形成初步金属硅化物图案,并且部分蚀刻初步金属硅化物图案 在衬底上形成第一金属硅化物图案,在多晶硅图案上形成第二金属硅化物图案,第二金属硅化物图案的线宽与多晶硅图案的线宽相同或更小。 该方法可以包括在间隔物上没有金属硅化物残留物的晶体管。 因此,可以防止或减少由残留物引起的操作故障。

    Method of manufacturing transistor having metal silicide and method of manufacturing a semiconductor device using the same
    5.
    发明申请
    Method of manufacturing transistor having metal silicide and method of manufacturing a semiconductor device using the same 有权
    制造具有金属硅化物的晶体管的方法和使用其制造半导体器件的方法

    公开(公告)号:US20090203182A1

    公开(公告)日:2009-08-13

    申请号:US12320604

    申请日:2009-01-30

    摘要: In a method of manufacturing a transistor and a method of manufacturing a semiconductor device using the same, the method may include forming a preliminary metal silicide pattern on a single-crystalline silicon substrate and on a polysilicon pattern, and partially etching the preliminary metal silicide pattern to form a first metal silicide pattern on the substrate and a second metal silicide pattern on the polysilicon pattern, the second metal silicide pattern having a line width the same as or smaller than that of the polysilicon pattern. The method may include the transistor having no metal silicide residue on the spacer. Accordingly, an operation failure due to the residue may be prevented or reduced.

    摘要翻译: 在制造晶体管的方法和使用其制造半导体器件的方法中,该方法可以包括在单晶硅衬底和多晶硅图案上形成初步金属硅化物图案,并且部分蚀刻初步金属硅化物图案 在衬底上形成第一金属硅化物图案,在多晶硅图案上形成第二金属硅化物图案,第二金属硅化物图案的线宽与多晶硅图案的线宽相同或更小。 该方法可以包括在间隔物上没有金属硅化物残留物的晶体管。 因此,可以防止或减少由残留物引起的操作故障。

    METHODS OF FABRICATING SEMICONDUCTOR DEVICES INCLUDING SELECTIVELY REACTING REACTANT GASES
    6.
    发明申请
    METHODS OF FABRICATING SEMICONDUCTOR DEVICES INCLUDING SELECTIVELY REACTING REACTANT GASES 审中-公开
    制备包含选择性反应性气体的半导体器件的方法

    公开(公告)号:US20080113517A1

    公开(公告)日:2008-05-15

    申请号:US11757642

    申请日:2007-06-04

    IPC分类号: H01L21/302

    CPC分类号: H01L21/0273 H01L21/3086

    摘要: A method of fabricating semiconductor devices with improved critical dimension (CD) uniformity is provided. The methods include forming photoresist patterns on an etching target layer, forming polymer layers on photoresist patterns on an etching target layer by selectively reacting a reactant gas with the photoresist patterns to provide different thicknesses of the polymer layers according to the position of the photoresist patterns, and etching the etching target layer using the photoresist patterns and the polymer layers as an etch mask.

    摘要翻译: 提供了一种制造具有改进的临界尺寸(CD)均匀性的半导体器件的方法。 所述方法包括在蚀刻目标层上形成光致抗蚀剂图案,通过选择性地使反应物气体与光致抗蚀剂图案反应,根据光致抗蚀剂图案的位置提供不同厚度的聚合物层,在蚀刻目标层上的光刻胶图案上形成聚合物层, 并使用光致抗蚀剂图案和聚合物层作为蚀刻掩模蚀刻蚀刻目标层。

    METHOD OF FABRICATING A SEMICONDUCTOR DEVICE
    7.
    发明申请
    METHOD OF FABRICATING A SEMICONDUCTOR DEVICE 审中-公开
    制造半导体器件的方法

    公开(公告)号:US20120164807A1

    公开(公告)日:2012-06-28

    申请号:US13408311

    申请日:2012-02-29

    IPC分类号: H01L21/336

    摘要: A semiconductor device and process of fabricating the same, the semiconductor device including a semiconductor substrate, a gate insulating layer on the semiconductor substrate, a gate electrode having sidewalls, on the gate insulating layer, first spacers on the sidewalls of the gate electrode, a source/drain region in the semiconductor substrate, aligned with the sidewalls, a silicide layer on the gate electrode, a silicide layer on the source/drain region, and second spacers covering the first spacers and end parts of a surface of the silicide layer on the source drain region.

    摘要翻译: 一种半导体器件及其制造方法,半导体器件包括半导体衬底,半导体衬底上的栅极绝缘层,具有侧壁的栅电极,栅极绝缘层,栅电极的侧壁上的第一间隔物, 源极/漏极区域,与侧壁对准,栅极上的硅化物层,源极/漏极区域上的硅化物层,以及覆盖第一间隔物和硅化物层的表面的端部的第二间隔物, 源极漏极区域。

    Semiconductor device and associated methods
    8.
    发明申请
    Semiconductor device and associated methods 审中-公开
    半导体器件及相关方法

    公开(公告)号:US20090256214A1

    公开(公告)日:2009-10-15

    申请号:US12385574

    申请日:2009-04-13

    IPC分类号: H01L29/78

    摘要: A semiconductor device and process of fabricating the same, the semiconductor device including a semiconductor substrate, a gate insulating layer on the semiconductor substrate, a gate electrode having sidewalls, on the gate insulating layer, first spacers on the sidewalls of the gate electrode, a source/drain region in the semiconductor substrate, aligned with the sidewalls, a silicide layer on the gate electrode, a silicide layer on the source/drain region, and second spacers covering the first spacers and end parts of a surface of the silicide layer on the source drain region.

    摘要翻译: 一种半导体器件及其制造方法,半导体器件包括半导体衬底,半导体衬底上的栅极绝缘层,具有侧壁的栅电极,栅极绝缘层,栅电极的侧壁上的第一间隔物, 源极/漏极区域,与侧壁对准,栅极上的硅化物层,源极/漏极区域上的硅化物层,以及覆盖第一间隔物和硅化物层的表面的端部的第二间隔物, 源极漏极区域。