公开(公告)号：US4346516A

公开(公告)日：1982-08-31

申请号：US252214

申请日：1981-04-08

申请人： Kishio Yokouchi ,  Hiromi Ogawa ,  Hiromitsu Yokoyama ,  Nobuo Kamehara ,  Koichi Niwa ,  Kyohei Murakawa

发明人： Kishio Yokouchi ,  Hiromi Ogawa ,  Hiromitsu Yokoyama ,  Nobuo Kamehara ,  Koichi Niwa ,  Kyohei Murakawa

IPC分类号： H05K3/46 ,  H01L21/48 ,  H01L23/15 ,  H01L23/538 ,  H05K1/03 ,  H05K1/09 ,  H05K3/40 ,  H05K3/00 ,  H05K3/36

CPC分类号： H05K3/4046 ,  H01L21/486 ,  H01L21/4867 ,  H01L23/15 ,  H01L23/5384 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/1132 ,  H01L2224/11334 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/0382 ,  H05K2201/10234 ,  H05K2203/0195 ,  H05K3/4611 ,  H05K3/4629 ,  Y10T29/49153 ,  Y10T29/49694

摘要： A method of forming a ceramic circuit substrate allowing mounting of high integration density semiconductor elements. The method provides a multilayered ceramic circuit substrate having via holes formed with high accuracy and high integration density wiring patterns by forming metallic conductive balls to connect the conductive wiring patterns of upper and lower layers; a ball arranging plate having many holes placing on a green sheet uniformly in close contact; filling the holes of the plate with the embedding the conductive balls by pressure into the green sheet; and thereafter baking the green sheet individually or in a stacked layered arrangement.

摘要翻译： 一种形成陶瓷电路基板的方法，允许安装高集成度密度的半导体元件。 该方法通过形成金属导电球以连接上层和下层的导电布线图案，提供具有形成有高精度和高集成度的布线图案的通孔的多层陶瓷电路基板; 具有多个孔的球排列板，其均匀地放置在生片上; 通过压力将导电球嵌入生片中来填充板的孔; 然后单独地或以堆叠的层叠布置烘烤生片。

公开(公告)号：US4761325A

公开(公告)日：1988-08-02

申请号：US762310

申请日：1985-08-02

申请人： Kazuaki Kurihara ,  Nobuo Kamehara ,  Hiromitsu Yokoyama ,  Hiromi Ogawa ,  Kishio Yokouchi ,  Yoshihiko Imanaka ,  Koichi Niwa

发明人： Kazuaki Kurihara ,  Nobuo Kamehara ,  Hiromitsu Yokoyama ,  Hiromi Ogawa ,  Kishio Yokouchi ,  Yoshihiko Imanaka ,  Koichi Niwa

IPC分类号： C03C10/00 ,  C04B35/14 ,  C04B35/16 ,  C04B35/18 ,  C04B35/632 ,  H01L21/48 ,  H01L23/15 ,  H05K1/03 ,  H05K1/09 ,  H05K3/46 ,  B32B3/00

CPC分类号： H05K3/4667 ,  C03C10/0009 ,  H01L21/4857 ,  H01L21/4867 ,  H01L23/15 ,  H05K1/0306 ,  H05K3/46 ,  H05K3/4629 ,  C03C2214/04 ,  C03C2214/20 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/092 ,  H05K2203/086 ,  H05K2203/088 ,  H05K2203/1126 ,  H05K3/1291 ,  H05K3/4611 ,  Y10S428/901 ,  Y10T428/24322 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/252

摘要： A method for producing a multilayer ceramic circuit board including the steps of forming a multilayer structure consisting of patterns of copper-based paste and glass-ceramic layers, the glass-ceramic layers consisting of a mixture of 10 percent to 75 percent by weight of .alpha.-alumina, 20 percent to 60 percent by weight of crystallizable or noncrystallizable glass which can be sintered at a temperature lower than the melting point of copper, and 5 percent to 70 percent by weight of quartz glass, based on the total weight of the glass-ceramic, blended with a binder containing a thermally depolymerizable resin; prefiring the multilayer structure in an inert atmosphere containing water vapor, the partial pressure of which is 0.005 to 0.3 atmosphere, at a temperature where the thermally depolymerizable resin is eliminated; and firing the multilayer structure in an inert atmosphere containing no water vapor at a temperature below the melting point of copper so as to sinter the glass-ceramic.

公开(公告)号：US4642148A

公开(公告)日：1987-02-10

申请号：US738658

申请日：1985-05-28

申请人： Kazuaki Kurihara ,  Nobuo Kamehara ,  Hiromitsu Yokoyama ,  Hiromi Ogawa ,  Kishio Yokouchi ,  Yoshihiko Imanaka ,  Koichi Niwa

发明人： Kazuaki Kurihara ,  Nobuo Kamehara ,  Hiromitsu Yokoyama ,  Hiromi Ogawa ,  Kishio Yokouchi ,  Yoshihiko Imanaka ,  Koichi Niwa

IPC分类号： C03C10/00 ,  C04B35/14 ,  C04B35/16 ,  C04B35/18 ,  C04B35/632 ,  H01L21/48 ,  H01L23/15 ,  H05K1/03 ,  H05K1/09 ,  H05K3/46 ,  B32B31/06

CPC分类号： H05K3/4667 ,  C03C10/0009 ,  H01L21/4857 ,  H01L21/4867 ,  H01L23/15 ,  H05K1/0306 ,  H05K3/46 ,  H05K3/4629 ,  C03C2214/04 ,  C03C2214/20 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/092 ,  H05K2203/086 ,  H05K2203/088 ,  H05K2203/1126 ,  H05K3/1291 ,  H05K3/4611 ,  Y10S428/901 ,  Y10T428/24322 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/252

摘要： A method for producing a multilayer ceramic circuit board including the steps of forming a multilayer structure consisting of patterns of copper-based paste and glass-ceramic layers, the glass-ceramic layers consisting of a mixture of 10 percent to 75 percent by weight of .alpha.-alumina, 20 percent to 60 percent by weight of crystallizable or noncrystallizable glass which can be sintered at a temperature lower than the melting point of copper, and 5 percent to 70 percent by weight of quartz glass, based on the total weight of the glass-ceramic, blended with a binder containing a thermally depolymerizable resin; prefiring the multilayer structure in an inert atmosphere containing water vapor, the partial pressure of which is 0.005 to 0.3 atmosphere, at a temperature where the thermally depolymerizable resin is eliminated; and firing the multilayer structure in an inert atmosphere containing no water vapor at a temperature below the melting point of copper so as to sinter the glass-ceramic.

摘要翻译： 一种制造多层陶瓷电路板的方法，包括以下步骤：形成由铜基糊料和玻璃 - 陶瓷层的图案组成的多层结构，所述玻璃陶瓷层由10％至75％重量的α - 氧化铝，20％至60％重量的可结晶或不可结晶的玻璃，其可以在低于铜的熔点的温度下烧结，以及5％至70％重量的石英玻璃，基于玻璃的总重量 - 陶瓷，与含有可热解聚树脂的粘合剂共混; 在除去热可解聚树脂的温度下，在分压为0.005〜0.3个大气压的含有水蒸气的惰性气氛中预热多层结构体; 在低于铜熔点的温度下，在不含水蒸气的惰性气氛中烧成多层结构，烧结玻璃陶瓷。

公开(公告)号：US4313026A

公开(公告)日：1982-01-26

申请号：US88467

申请日：1979-10-26

申请人： Seiichi Yamada ,  Nobuo Kamehara ,  Kaoru Hashimoto ,  Hiromitsu Yokoyama ,  Koichi Niwa ,  Kyohei Murakawa

发明人： Seiichi Yamada ,  Nobuo Kamehara ,  Kaoru Hashimoto ,  Hiromitsu Yokoyama ,  Koichi Niwa ,  Kyohei Murakawa

IPC分类号： B32B15/04 ,  H01L23/15 ,  H01L23/538 ,  H05K1/03 ,  H05K3/46

CPC分类号： H05K3/4664 ,  H01L23/15 ,  H01L23/5383 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011

摘要： A multilayer circuit board (10) for putting semiconductor devices thereon consists of conductor layers (6, 60, 61, 62, 63) made of a metal selected from the group consisting of Au, Ag, Cu and an alloy thereof, insulating material (2, 7) made of glass-ceramic and an alumina sintered plate (1). The glass-ceramic is comprised of borosilicate glass and alumina and has a low dielectric constant and a thermal expansion coefficient approaching that of the semiconductor devices. The alumina sintered plate (1) is placed between the ground and supply voltage conductor layers (62, 63) and the signal conductor layers (60).

摘要翻译： 用于将半导体器件放置在其上的多层电路板（10）由选自Au，Ag，Cu及其合金的金属制成的导体层（6,60,61,62,63），绝缘材料（ 2，7）由玻璃陶瓷和氧化铝烧结板（1）制成。 玻璃陶瓷由硼硅酸盐玻璃和氧化铝组成，并且具有接近半导体器件的低介电常数和热膨胀系数。 氧化铝烧结板（1）放置在接地电源电压导体层（62,63）和信号导体层（60）之间。

公开(公告)号：US5015314A

公开(公告)日：1991-05-14

申请号：US469739

申请日：1990-01-19

申请人： Hitoshi Suzuki ,  Hiromitsu Yokoyama ,  Mineharu Tsukada ,  Hiromi Ogawa ,  Nobuo Kamehara ,  Koichi Niwa

发明人： Hitoshi Suzuki ,  Hiromitsu Yokoyama ,  Mineharu Tsukada ,  Hiromi Ogawa ,  Nobuo Kamehara ,  Koichi Niwa

IPC分类号： H05K3/12 ,  H01B1/16 ,  H05K1/09 ,  H05K3/46

CPC分类号： H05K1/092 ,  H01B1/16

摘要： A method for producing a ceramic circuit board comprising the steps of (i) forming a conductor portion of the ceramic circuit board by printing a conductive paste composition on a ceramic base plate for the circuit board and then (ii) firing the ceramic base plate and the conductive paste composition together, wherein a copper-base composition comprising a copper powder and 0.5 to 5 parts by weight, based on 100 parts by weight of copper powder, of at least one organo metallic compound capable of forming an inorganic compound or compounds, respectively, when fired in an inert atmosphere, is used as the conductive paste composition.The combined use of isopropyl tridodecylbenzene sulfonyl titanate and isopropyl triisostearoyl titanate greatly improve the flowability of the copper-base conductive paste composition.

公开(公告)号：US5349499A

公开(公告)日：1994-09-20

申请号：US53452

申请日：1993-04-28

申请人： Mitsutaka Yamada ,  Kishio Yokouchi ,  Nobuo Kamehara ,  Koichi Niwa

发明人： Mitsutaka Yamada ,  Kishio Yokouchi ,  Nobuo Kamehara ,  Koichi Niwa

IPC分类号： H01L23/427 ,  H05K7/20

CPC分类号： H01L23/427 ,  H01L2924/0002

摘要： A coolant for cooling a semiconductor element by direct immersion, cooling, which has an improved cooling capability, is disclosed. The coolant comprises a low boiling point fluorocarbon having a boiling point of 30.degree. C. to 100.degree. C. and a high boiling point fluorocarbon having a boiling point higher than that of the low boiling point fluorocarbon by at least 100.degree. C.; an amount of the high boiling point fluorocarbon being less than 20% by volume, based on the volume of the low boiling point fluorocarbon.

摘要翻译： 公开了一种用于通过直接浸入，冷却来冷却半导体元件的冷却剂，其具有改进的冷却能力。 冷却剂包括沸点为30℃至100℃的低沸点碳氟化合物和沸点高于低沸点碳氟化合物的沸点至少为100℃的高沸点碳氟化合物; 基于低沸点碳氟化合物的体积，高沸点碳氟化合物的量小于20体积％。

公开(公告)号：US06193905B1

公开(公告)日：2001-02-27

申请号：US08380312

申请日：1995-01-30

申请人： Mitsutaka Yamada ,  Kishio Yokouchi ,  Nobuo Kamehara ,  Koichi Niwa

发明人： Mitsutaka Yamada ,  Kishio Yokouchi ,  Nobuo Kamehara ,  Koichi Niwa

IPC分类号： C09K504

CPC分类号： H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A coolant for cooling a semiconductor element by direct immersion, cooling, which has an improved cooling capability, is disclosed. The coolant comprises a low boiling point fluorocarbon having a boiling point of 30° C. to 100° C. and a high boiling point fluorocarbon having a boiling point higher than that of the low boiling point fluorocarbon by at least 100° C.; an amount of the high boiling point fluorocarbon being less than 20% by volume, based on the volume of the low boiling point fluorocarbon.

摘要翻译： 公开了一种用于通过直接浸入，冷却来冷却半导体元件的冷却剂，其具有改进的冷却能力。 冷却剂包括沸点为30℃至100℃的低沸点碳氟化合物和沸点高于低沸点碳氟化合物的沸点至少为100℃的高沸点碳氟化合物; 基于低沸点碳氟化合物的体积，高沸点碳氟化合物的量小于20体积％。

公开(公告)号：US5593526A

公开(公告)日：1997-01-14

申请号：US316376

申请日：1994-09-30

申请人： Kishio Yokouchi ,  Hiroshi Kamezaki ,  Masato Wakamura ,  Nobuo Kamehara ,  Koichi Niwa

发明人： Kishio Yokouchi ,  Hiroshi Kamezaki ,  Masato Wakamura ,  Nobuo Kamehara ,  Koichi Niwa

IPC分类号： C04B38/08 ,  C04B35/16 ,  H01L23/15 ,  H05K1/03 ,  H05K3/46 ,  C04B37/00

CPC分类号： H01L23/15 ,  H05K1/0306 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K2201/0209 ,  H05K3/4629 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/25 ,  Y10T428/2996

摘要： A process for producing a multi-layer wiring board having alternate layers of a glass ceramic material and conductor patterns. The glass ceramic layers are made up of a glass ceramic material including a glass matrix and ceramic particles dispersed in the matrix. The glass ceramic layers are caused to contain hollow or porous silica glass spheres dispersed in the glass ceramic material. The hollow or porous silica glass spheres are covered with a ceramic coating layer containing alumina as a constituent element. Such a structure prevents crystallization of the silica spheres and avoids the resultant rapid increase in the the thermal expansion coefficient of the glass ceramic layers. The structure provided by the process of the invention also precudes the formation of pores in the surfaces of the glass ceramic layers.

摘要翻译： 一种制造具有玻璃陶瓷材料和导体图案的交替层的多层布线板的方法。 玻璃陶瓷层由玻璃基体和分散在基质中的陶瓷粒子组成的玻璃陶瓷材料构成。 使玻璃陶瓷层含有分散在玻璃陶瓷材料中的中空或多孔石英玻璃球。 中空或多孔二氧化硅玻璃球被包含氧化铝作为构成元素的陶瓷涂层覆盖。 这种结构防止了二氧化硅球的结晶，避免了玻璃陶瓷层的热膨胀系数的迅速增加。 本发明方法提供的结构还预示了在玻璃陶瓷层的表面中形成孔隙。

公开(公告)号：US5275889A

公开(公告)日：1994-01-04

申请号：US763248

申请日：1991-09-20

申请人： Kishio Yokouchi ,  Hiroshi Kamezaki ,  Masato Wakamura ,  Nobuo Kamehara ,  Koichi Niwa

发明人： Kishio Yokouchi ,  Hiroshi Kamezaki ,  Masato Wakamura ,  Nobuo Kamehara ,  Koichi Niwa

IPC分类号： C04B38/08 ,  C04B35/16 ,  H01L23/15 ,  H05K1/03 ,  H05K3/46 ,  B32B9/00

CPC分类号： H01L23/15 ,  H05K1/0306 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K2201/0209 ,  H05K3/4629 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/25 ,  Y10T428/2996

摘要： A laminated multi-layer wiring board comprising alternate layers of a glass ceramic material and conductor pattern. The glass ceramic layers are made of a glass ceramic comprising glass and dispersed ceramic particles. The glass ceramic layers further contain hollow or porous silica glass spheres dispersed in the glass ceramic. The hollow or porous silica glass spheres are covered with a ceramic coating layer containing aluminum as a constituent element. Such a structure prevents crystallization of the silica spheres and the resultant rapid increase in the thermal expansion coefficient of the glass ceramic layer. The structure also procludes the formation of pores in the surfaces of the spheres.

摘要翻译： 一种叠层多层布线板，包括玻璃陶瓷材料和导体图案的交替层。 玻璃陶瓷层由包含玻璃和分散的陶瓷颗粒的玻璃陶瓷制成。 玻璃陶瓷层还包含分散在玻璃陶瓷中的中空或多孔石英玻璃球。 中空或多孔二氧化硅玻璃球被包含铝作为构成元素的陶瓷涂层覆盖。 这种结构防止了二氧化硅球的结晶，并且导致玻璃陶瓷层的热膨胀系数的快速增加。 该结构还促使在球体表面形成孔隙。

公开(公告)号：US5038571A

公开(公告)日：1991-08-13

申请号：US437710

申请日：1989-11-17

申请人： Kishio Yokouchi ,  Mitsutaka Yamada ,  Nobuo Kamehara ,  Koichi Niwa

发明人： Kishio Yokouchi ,  Mitsutaka Yamada ,  Nobuo Kamehara ,  Koichi Niwa

IPC分类号： C09K5/04 ,  F25D3/10 ,  H01L23/44

CPC分类号： C09K5/045 ,  C09K5/04 ,  H01L23/445 ,  C09K2205/128 ,  F25D3/10 ,  H01L2924/0002

摘要： A coolant for use in cryogenic devices of closed cycle system which comprises a mixture of a liquid nitrogen and a fluorocarbon of the formula: C.sub.n F.sub.2n+2, wherein n is an integer of 2 to 4. The coolant, when used to cool heat generating semiconductor devices and other devices to a cryogenic temperature, exhibits an increased heat flux and thus an increased cooling capability, in addition to a simple and small structure of the cooling system, and a prevention of environmental pollution.