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公开(公告)号：US20150296307A1
公开(公告)日：2015-10-15
申请号：US14669843
申请日：2015-03-26
Applicant: Knowles Electronics, LLC.
Inventor： Ning Shao , Eric J. Lautenschlager
CPC classification number: H04R19/016 , H04R19/005 , H04R19/04 , H04R2201/003
Abstract: A microelectromechanical system (MEMS) die includes a back plate and a diaphragm assembly. The back plate includes a first back plate portion including a first electrode and a second back plate portion including a second electrode, both electrodes being integrated on a mechanical supporting layer. The diaphragm assembly includes a first diaphragm disposed proximate to and in spaced apart relation from the first back plate portion, with the first diaphragm defining an opening therethrough. The diaphragm assembly also includes a second diaphragm disposed proximate to and in spaced apart relation from the second back plate portion, the second diaphragm disposed within the opening and separated from the first diaphragm by a ring-shaped void. The diaphragm assembly also includes a connection portion connecting the first diaphragm and the second diaphragm and extending through the ring-shaped void.
Abstract translation: 微机电系统（MEMS）模具包括背板和隔膜组件。 背板包括第一背板部分，其包括第一电极和包括第二电极的第二背板部分，两个电极整合在机械支撑层上。 隔膜组件包括靠近第一后板部分并且与第一后板部分间隔开的第一隔膜，第一隔膜限定穿过其中的开口。 隔膜组件还包括邻近第二背板部分设置并且与第二背板部分隔开的第二隔膜，第二隔膜设置在开口内并与第一隔膜分隔开环形空隙。 膜片组件还包括连接第一膜片和第二膜片并延伸穿过环形空隙的连接部分。
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公开(公告)号：US20130160547A1
公开(公告)日：2013-06-27
申请号：US13705722
申请日：2012-12-05
Applicant: KNOWLES ELECTRONICS, LLC
Inventor： Sung Bok Lee , Eric J. Lautenschlager
IPC: G01P15/125
CPC classification number: G01P15/125 , G01C9/06 , G01C9/14 , G01C2009/062 , G01P2015/0822 , G01P2015/0857 , H04R3/00 , H04R19/005 , H04R19/04 , H04R31/00 , H04R2307/025
Abstract: An acoustic sensor includes a back plate; at least one back plate electrode coupled to the back plate; a proof of mass with the proof of mass elastically coupled to the back plate; and a proof of mass electrode coupled to the proof of mass. Movement of the sensor causes a capacitance between the proof of mass electrode and the at least one back plate electrode to vary and the capacitance represents a magnitude of the movement of the sensor.
Abstract translation: 声传感器包括背板; 耦合到所述背板的至少一个背板电极; 质量证明，弹性联接到背板的质量证明; 以及与质量证明相结合的质量电极证明。 传感器的移动导致质量电极和至少一个背板电极之间的电容变化，并且电容表示传感器运动的大小。
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公开(公告)号：US20160353212A1
公开(公告)日：2016-12-01
申请号：US15163586
申请日：2016-05-24
Applicant: Knowles Electronics, LLC
Inventor： Eric J. Lautenschlager , Sandra F. Vos
CPC classification number: H03H11/04 , H04R1/04 , H04R19/005 , H04R2201/029
Abstract: Microphone devices are disclosed. The microphone device includes a base, a lid, a side wall between the base and the lid, and a MEMS die. The side wall includes a first portion with a first width and a second portion with a second width disposed under the first portion. The first width is less than the second width such that a shoulder is formed on the second portion. The MEMS die is supported on the shoulder. The MEMS die includes a diaphragm and a back plate.
Abstract translation: 公开了麦克风装置。 麦克风装置包括底座，盖子，基座和盖子之间的侧壁以及MEMS模具。 侧壁包括具有第一宽度的第一部分和设置在第一部分下方的具有第二宽度的第二部分。 第一宽度小于第二宽度，使得在第二部分上形成肩部。 MEMS模具支撑在肩上。 MEMS管芯包括隔膜和背板。
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公开(公告)号：US09329199B2
公开(公告)日：2016-05-03
申请号：US13705722
申请日：2012-12-05
Applicant: Knowles Electronics, LLC
Inventor： Sung Bok Lee , Eric J. Lautenschlager
CPC classification number: G01P15/125 , G01C9/06 , G01C9/14 , G01C2009/062 , G01P2015/0822 , G01P2015/0857 , H04R3/00 , H04R19/005 , H04R19/04 , H04R31/00 , H04R2307/025
Abstract: An acoustic sensor includes a back plate; at least one back plate electrode coupled to the back plate; a proof of mass with the proof of mass elastically coupled to the back plate; and a proof of mass electrode coupled to the proof of mass. Movement of the sensor causes a capacitance between the proof of mass electrode and the at least one back plate electrode to vary and the capacitance represents a magnitude of the movement of the sensor.
Abstract translation: 声传感器包括背板; 耦合到所述背板的至少一个背板电极; 质量证明，弹性联接到背板的质量证明; 以及与质量证明相结合的质量电极证明。 传感器的移动导致质量电极和至少一个背板电极之间的电容变化，并且电容表示传感器运动的大小。
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5.发明申请
公开(公告)号：US20160283045A1
公开(公告)日：2016-09-29
申请号：US15081608
申请日：2016-03-25
Applicant: Knowles Electronics, LLC
Inventor： Eric J. Lautenschlager
IPC: G06F3/0481
CPC classification number: G06F3/0481 , G06F3/041 , G06F2203/04101
Abstract: Apparatuses and methods directed to adjusting a visual characteristic of a user interface. Ultrasonic detection times are received from a first ultrasonic transceiver, a second ultrasonic transceiver, and a fourth ultrasonic transceiver. A height of a feature above the user interface is determined from the first ultrasonic detection time, the second ultrasonic detection time, and the third ultrasonic detection time. If the height of the feature is less than a predetermined threshold a visual characteristic of the user interface is adjusted.
Abstract translation: 旨在调整用户界面的视觉特征的装置和方法。 从第一超声波收发器，第二超声波收发器和第四超声波收发器接收超声检测时间。 从第一超声波检测时间，第二超声波检测时间和第三超声波检测时间确定用户界面上方的特征的高度。 如果特征的高度小于预定阈值，则调整用户界面的视觉特征。
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公开(公告)号：US20150365770A1
公开(公告)日：2015-12-17
申请号：US14728056
申请日：2015-06-02
Applicant: Knowles Electronics, LLC
Inventor： Eric J. Lautenschlager
CPC classification number: H04R23/008 , H04R19/005 , H04R19/04
Abstract: A micro electro mechanical system (MEMS) microphone includes a lid, at least one wall coupled to the lid, a substrate, and a MEMS die. The substrate is coupled to the at least one wall and a port extending through the substrate. The MEMS die is disposed on the substrate, and the MEMS die including a movable diaphragm and back plate. The optical sub-assembly is coupled to the lid, and the optical sub-assembly is configured and arranged to sense a position of the diaphragm.
Abstract translation: 微机电系统（MEMS）麦克风包括盖，连接到盖的至少一个壁，基底和MEMS管芯。 衬底耦合到至少一个壁和延伸穿过衬底的端口。 MEMS管芯设置在基板上，MEMS管芯包括可动隔膜和背板。 光学子组件联接到盖子，并且光学子组件被配置和布置成感测隔膜的位置。
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公开(公告)号：US20150296306A1
公开(公告)日：2015-10-15
申请号：US14669766
申请日：2015-03-26
Applicant: Knowles Electronics, LLC.
Inventor： Ning Shao , Eric J. Lautenschlager
IPC: H04R23/00
CPC classification number: H04R19/005 , H01L2224/48091 , H01L2224/48137 , H01L2924/16152 , H04R3/005 , H04R2201/003 , H01L2924/00014
Abstract: A microelectromechanical system (MEMS) die includes a substrate, an insulation layer disposed adjacent to the substrate, a diaphragm connected to the insulation layer, and a back plate connected to the insulation layer. The back plate is disposed in spaced relation to the diaphragm. The insulation layer is positioned between the substrate and the diaphragm and back plate to electrically isolate the substrate from the diaphragm and the back plate.
Abstract translation: 微机电系统（MEMS）管芯包括衬底，邻近衬底设置的绝缘层，连接到绝缘层的隔膜以及连接到绝缘层的背板。 背板与隔膜隔开设置。 绝缘层位于基板和隔膜和背板之间，以将基板与隔膜和背板电隔离。
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公开(公告)号：US20150296305A1
公开(公告)日：2015-10-15
申请号：US14669655
申请日：2015-03-26
Applicant: Knowles Electronics, LLC
Inventor： Ning Shao , Eric J. Lautenschlager
IPC: H04R23/00
CPC classification number: H04R19/016 , H04R19/005 , H04R2201/003
Abstract: An electrode apparatus of a back plate that is used in a microelectromechanical system (MEMS) microphone is disposed in spaced proximity to a diaphragm. The electrode apparatus includes a support layer and a conductive layer that is arranged in proximity to the support layer. At least one of a shape, a dimension, or a sizing of the conductive layer is matched to one or more of a sensitivity of the diaphragm, an operation of the diaphragm, or a movement of the diaphragm.
Abstract translation: 在微机电系统（MEMS）麦克风中使用的背板的电极装置设置成与隔膜间隔开。 电极装置包括支撑层和布置在支撑层附近的导电层。 导电层的形状，尺寸或尺寸中的至少一个与隔膜的灵敏度，隔膜的操作或隔膜的移动中的一个或多个匹配。
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公开(公告)号：US20130343580A1
公开(公告)日：2013-12-26
申请号：US13911696
申请日：2013-06-06
Applicant: Knowles Electronics, LLC
Inventor： Eric J. Lautenschlager , Peter V. Loeppert
IPC: H04R1/00
CPC classification number: H04R1/00 , H04R19/005 , H04R2201/003
Abstract: An acoustic microphone includes a back plate, a diaphragm, and a microelectromechanical system (MEMS) structure that is coupled to the back plate and the diaphragm. The MEMS structure is disposed on a substrate. The back plate includes a first layer and a second layer that are disposed in generally parallel relation to each other. The first layer including a first opening with a first sizing and the second layer including a second opening with a second sizing. The first sizing is different from the second sizing. The first opening and the second opening form a channel through the back plate.
Abstract translation: 声学麦克风包括背板，隔膜和耦合到背板和隔膜的微机电系统（MEMS）结构。 MEMS结构设置在基板上。 背板包括彼此大致平行地设置的第一层和第二层。 第一层包括具有第一施胶的第一开口，第二层包括具有第二施胶的第二开口。 第一种尺寸与第二种尺码不同。 第一开口和第二开口形成通过背板的通道。
