公开(公告)号：US20060112546A1

公开(公告)日：2006-06-01

申请号：US11288203

申请日：2005-11-29

申请人： Ko Onodera ,  Satoshi Kurimoto ,  Yoji Tozawa ,  Seiichi Nakagawa

发明人： Ko Onodera ,  Satoshi Kurimoto ,  Yoji Tozawa ,  Seiichi Nakagawa

IPC分类号： B05D5/12

CPC分类号： H01L23/4828 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/0781 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49169 ,  Y10T29/49204 ,  Y10T29/49213 ,  Y10T29/49222 ,  Y10T29/49224

摘要： The object of the invention is to provide a method of forming an external electrode of an electronic component whereby the external electrode can be formed in a stable fashion. In order to achieve this object, a method of fonning an external electrode according to the present invention includes: a step of forming an electrode portion 301a on a side face 30a of a chip 30 constituting an electronic component by applying a conductive paste 20 from a direction facing this side face 30a; a step of forming an electrode portion 301b on a side face 30b of the chip 30 facing the side face 30a by applying the conductive paste 20 from a direction facing this side face 30b; a step of forming an electrode portion 301c so as to connect the electrode portion 301a and electrode portion 301b on the bottom face of the chip 30 respectively adjacent to the side face 30a and the side face 30b; and a step of forming an external electrode 301 comprising the electrode portion 301a, electrode portion 301b and electrode portion 301c by drying this chip 30.

摘要翻译： 本发明的目的是提供一种形成电子部件的外部电极的方法，由此能够以稳定的方式形成外部电极。 为了实现该目的，根据本发明的外部电极的制造方法包括：通过施加导电膏20在构成电子部件的芯片30的侧面30a上形成电极部分301a的步骤 从面向该侧面30a的方向; 通过从面向该侧面30b的方向施加导电膏20，在面向侧面30a的芯片30的侧面30b上形成电极部分301b的步骤; 形成电极部分301c以将电极部分301a和电极部分301b连接在分别与侧面30a和侧面30b相邻的芯片30的底面上的步骤; 以及通过干燥该芯片30形成包括电极部分301a，电极部分301b和电极部分301c的外部电极301的步骤。

公开(公告)号：US07458151B2

公开(公告)日：2008-12-02

申请号：US11288203

申请日：2005-11-29

申请人： Ko Onodera ,  Satoshi Kurimoto ,  Yoji Tozawa ,  Seiichi Nakagawa

发明人： Ko Onodera ,  Satoshi Kurimoto ,  Yoji Tozawa ,  Seiichi Nakagawa

IPC分类号： H01R43/00 ,  H05K3/30 ,  H01G2/20

CPC分类号： H01L23/4828 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/0781 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49169 ,  Y10T29/49204 ,  Y10T29/49213 ,  Y10T29/49222 ,  Y10T29/49224

摘要： The object of the invention is to provide a method of forming an external electrode of an electronic component whereby the external electrode can be formed in a stable fashion. In order to achieve this object, a method of forming an external electrode according to the present invention includes: a step of forming an electrode portion 301a on a side face 30a of a chip 30 constituting an electronic component by applying a conductive paste 20 from a direction facing this side face 30a; a step of forming an electrode portion 301b on a side face 30b of the chip 30 facing the side face 30a by applying the conductive paste 20 from a direction facing this side face 30b; a step of forming an electrode portion 301c so as to connect the electrode portion 301a and electrode portion 301b on the bottom face of the chip 30 respectively adjacent to the side face 30a and the side face 30b; and a step of forming an external electrode 301 comprising the electrode portion 301a, electrode portion 301b and electrode portion 301c by drying this chip 30.

摘要翻译： 本发明的目的是提供一种形成电子部件的外部电极的方法，由此能够以稳定的方式形成外部电极。 为了实现该目的，根据本发明的形成外部电极的方法包括：通过从导电膏20涂覆构成电子部件的芯片30的侧面30a上形成电极部分301a的步骤 朝向该侧面30a的方向; 通过从面向该侧面30b的方向施加导电膏20，在面向侧面30a的芯片30的侧面30b上形成电极部分301b的步骤; 形成电极部分301c以将电极部分301a和分别邻近侧面30a和侧面30b的芯片30的底面上的电极部分301b连接的步骤; 以及通过干燥该芯片30形成包括电极部分301a，电极部分301b和电极部分301c的外部电极301的步骤。

公开(公告)号：US07803421B2

公开(公告)日：2010-09-28

申请号：US11636622

申请日：2006-12-11

申请人： Ko Onodera ,  Satoshi Kurimoto ,  Yoji Tozawa ,  Shirou Ootsuki

发明人： Ko Onodera ,  Satoshi Kurimoto ,  Yoji Tozawa ,  Shirou Ootsuki

IPC分类号： B05D5/12 ,  B05D1/18 ,  H01G7/00

CPC分类号： H01G13/006 ,  H01L21/4867 ,  H01L23/49805 ,  H01L24/11 ,  H01L2224/1131 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01082 ,  H05K3/403 ,  Y10T29/43

摘要： An element forming an electronic component has a first face and a second face facing each other, and a third face adjacent to each of the first face and the second face. A method of forming an external electrode of the electronic component involves a pre-formation step, first to third formation steps, and an electrode formation step. The pre-formation step is to apply a conductive paste onto the third face and to evaporate at least a part of a liquid contained in the applied conductive paste, to form a precoat portion expected to become a part of a third electrode portion. The first formation step is to apply the conductive paste from a direction opposite to the first face, onto the first face to form a first electrode portion. The second formation step is to apply the conductive paste from a direction opposite to the second face, onto the second face to form a second electrode portion. The third formation step is to apply the conductive paste onto the third face so as to cover the precoat portion, to form the third electrode portion. The electrode formation step is to dry the element to form the external electrode consisting of the first electrode portion, the second electrode portion, and the third electrode portion. The first electrode portion, the second electrode portion, and the third electrode portion are formed so as to connect with each other.

摘要翻译： 形成电子部件的元件具有彼此相对的第一面和第二面以及与第一面和第二面中的每一个相邻的第三面。 形成电子部件的外部电极的方法包括预成形工序，第一〜第三形成工序以及电极形成工序。 预成形步骤是将导电浆料涂敷在第三面上，蒸发所涂敷的导电浆料中含有的液体的至少一部分，形成预期成为第三电极部分的一部分的预涂部分。 第一形成步骤是将导电膏从与第一面相反的方向涂覆到第一面上以形成第一电极部分。 第二形成步骤是将导电膏从与第二面相反的方向涂覆到第二面上以形成第二电极部分。 第三形成步骤是将导电膏涂覆到第三面以覆盖预涂部分，以形成第三电极部分。 电极形成步骤是干燥元件以形成由第一电极部分，第二电极部分和第三电极部分组成的外部电极。 第一电极部分，第二电极部分和第三电极部分形成为彼此连接。

公开(公告)号：US20100043221A1

公开(公告)日：2010-02-25

申请号：US12588613

申请日：2009-10-21

申请人： Ko Onodera ,  Satoshi Kurimoto ,  Yoji Tozawa ,  Shirou Ootsuki

发明人： Ko Onodera ,  Satoshi Kurimoto ,  Yoji Tozawa ,  Shirou Ootsuki

IPC分类号： H01R43/00

CPC分类号： H01G13/006 ,  Y10T29/49098 ,  Y10T29/49101 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155

摘要： A method of forming an external electrode of an electronic component involving: a paste preparation step, a removal step, an element preparation step, a contact step, and a formation step. A jig with a groove into which an element forming the electronic component can be inserted is prepared. A conductive paste is filled in the groove, and then removed, so as to leave the conductive paste along a first wall surface of the groove and remove the rest. Then, element immediately above the groove is located, and inserted into the groove and moved toward the first wall surface. Finally, the element is moved along the first wall surface and toward the aperture in a state in which the ridgeline of the element is kept in contact with the first wall surface, and moved away from the first wall surface so as to separate the ridgeline from the first wall surface.

摘要翻译： 一种形成电子部件的外部电极的方法，包括：糊剂制备步骤，去除步骤，元件制备步骤，接触步骤和形成步骤。 准备具有可插入形成电子部件的元件的槽的夹具。 将导电浆料填充在凹槽中，然后除去，以便沿沟槽的第一壁表面离开导电膏，并将其余部分除去。 然后，立即在凹槽上方的元件被定位并且插入凹槽中并朝向第一壁表面移动。 最后，元件在元件的棱线与第一壁表面保持接触的状态下沿着第一壁表面移动并朝向孔径移动，并且从第一壁表面移开，以将棱线与第一壁表面分开 第一个墙面。

公开(公告)号：US07673382B2

公开(公告)日：2010-03-09

申请号：US11641911

申请日：2006-12-20

申请人： Ko Onodera ,  Satoshi Kurimoto ,  Yoji Tozawa ,  Shirou Ootsuki

发明人： Ko Onodera ,  Satoshi Kurimoto ,  Yoji Tozawa ,  Shirou Ootsuki

IPC分类号： H01C17/28

CPC分类号： H01G13/006 ,  Y10T29/49098 ,  Y10T29/49101 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155

摘要： A method of forming an external electrode of an electronic component involving: a paste preparation step, a removal step, an element preparation step, a contact step, and a formation step. A jig with a groove into which an element forming the electronic component can be inserted is prepared. A conductive paste is filled in the groove, and then removed, so as to leave the conductive paste along a first wall surface of the groove and remove the rest. Then, element immediately above the groove is located, and inserted into the groove and moved toward the first wall surface. Finally, the element is moved along the first wall surface and toward the aperture in a state in which the ridgeline of the element is kept in contact with the first wall surface, and moved away from the first wall surface so as to separate the ridgeline from the first wall surface.

公开(公告)号：US08291585B2

公开(公告)日：2012-10-23

申请号：US12195772

申请日：2008-08-21

申请人： Ko Onodera ,  Satoshi Kurimoto ,  Hisayuki Abe ,  Taketo Sasaki ,  Yoji Tozawa ,  Osamu Hirose

发明人： Ko Onodera ,  Satoshi Kurimoto ,  Hisayuki Abe ,  Taketo Sasaki ,  Yoji Tozawa ,  Osamu Hirose

IPC分类号： H01R9/00 ,  H05K3/00

CPC分类号： H01G4/2325 ,  H01G4/30 ,  Y10T29/417 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49149 ,  Y10T29/49155

摘要： A chip element in the form of a substantially rectangular parallelepiped having end surfaces and side surfaces is formed (step of forming chip element). An electrically conductive green sheet is formed (step of forming electrically conductive green sheet). An electrically conductive paste is applied to the end surfaces of the chip element (step of application electrically conductive paste). A chip element is formed in which the electrically conductive green sheet is attached to the end surface via the electrically conductive paste applied to the end surface of the chip element (step of attaching electrically conductive sheet). In the step of attaching, the end surface of the electrically conductive green sheet on the side of the side surfaces is positioned on the outside of the side surfaces, and the electrically conductive paste applied to the end surface is pressed out into a space between the electrically conductive green sheet and ridge portions.

摘要翻译： 形成具有端面和侧面的大致长方体形状的芯片元件（形成芯片元件的步骤）。 形成导电性生片（形成导电性生片的工序）。 在芯片元件的端面施加导电性糊剂（涂敷导电糊剂的步骤）。 形成芯片元件，其中导电生片通过施加到芯片元件的端面上的导电膏（附着导电片的步骤）附着到端表面。 在安装的步骤中，导电性生片在侧面侧的端面位于侧面的外侧，并且施加到端面的导电糊被压出到 导电生片和脊部。

公开(公告)号：US08181340B2

公开(公告)日：2012-05-22

申请号：US12588613

申请日：2009-10-21

申请人： Ko Onodera ,  Satoshi Kurimoto ,  Yoji Tozawa ,  Shirou Ootsuki

发明人： Ko Onodera ,  Satoshi Kurimoto ,  Yoji Tozawa ,  Shirou Ootsuki

IPC分类号： H05K3/02 ,  H05K3/10

CPC分类号： H01G13/006 ,  Y10T29/49098 ,  Y10T29/49101 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155

摘要： A method of forming an external electrode of an electronic component involving: a paste preparation step, a removal step, an element preparation step, a contact step, and a formation step. A jig with a groove into which an element forming the electronic component can be inserted is prepared. A conductive paste is filled in the groove, and then removed, so as to leave the conductive paste along a first wall surface of the groove and remove the rest. Then, element immediately above the groove is located, and inserted into the groove and moved toward the first wall surface. Finally, the element is moved along the first wall surface and toward the aperture in a state in which the ridgeline of the element is kept in contact with the first wall surface, and moved away from the first wall surface so as to separate the ridgeline from the first wall surface.

摘要翻译： 一种形成电子部件的外部电极的方法，包括：糊剂制备步骤，去除步骤，元件制备步骤，接触步骤和形成步骤。 准备具有可插入形成电子部件的元件的槽的夹具。 将导电浆料填充在凹槽中，然后除去，以便沿沟槽的第一壁表面离开导电膏，并将其余部分除去。 然后，立即在凹槽上方的元件被定位并且插入凹槽中并朝向第一壁表面移动。 最后，元件在元件的棱线与第一壁表面保持接触的状态下沿着第一壁表面移动并朝向孔径移动，并且从第一壁表面移开，以将棱线与第一壁表面分开 第一个墙面。

公开(公告)号：US20090053853A1

公开(公告)日：2009-02-26

申请号：US12195772

申请日：2008-08-21

申请人： Ko Onodera ,  Satoshi Kurimoto ,  Hisayuki Abe ,  Taketo Sasaki ,  Yoji Tozawa ,  Osamu Hirose

发明人： Ko Onodera ,  Satoshi Kurimoto ,  Hisayuki Abe ,  Taketo Sasaki ,  Yoji Tozawa ,  Osamu Hirose

IPC分类号： H01R43/00 ,  H01L21/00

CPC分类号： H01G4/2325 ,  H01G4/30 ,  Y10T29/417 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49149 ,  Y10T29/49155

摘要： A chip element in the form of a substantially rectangular parallelepiped having end surfaces and side surfaces is formed (step of forming chip element). An electrically conductive green sheet is formed (step of forming electrically conductive green sheet). An electrically conductive paste is applied to the end surfaces of the chip element (step of application electrically conductive paste). A chip element is formed in which the electrically conductive green sheet is attached to the end surface via the electrically conductive paste applied to the end surface of the chip element (step of attaching electrically conductive sheet). In the step of attaching, the end surface of the electrically conductive green sheet on the side of the side surfaces is positioned on the outside of the side surfaces, and the electrically conductive paste applied to the end surface is pressed out into a space between the electrically conductive green sheet and ridge portions.

摘要翻译： 形成具有端面和侧面的大致长方体形状的芯片元件（形成芯片元件的步骤）。 形成导电性生片（形成导电性生片的工序）。 在芯片元件的端面施加导电性糊剂（涂敷导电糊剂的步骤）。 形成芯片元件，其中导电生片通过施加到芯片元件的端面上的导电膏（附着导电片的步骤）附着到端表面。 在安装的步骤中，导电性生片在侧面侧的端面位于侧面的外侧，并且施加到端面的导电糊被压出到 导电生片和脊部。

公开(公告)号：US20070227649A1

公开(公告)日：2007-10-04

申请号：US11715979

申请日：2007-03-09

申请人： Ko Onodera ,  Katsufumi Sato ,  Satoshi Kurimoto ,  Yoji Tozawa ,  Hiroshi Uemura

发明人： Ko Onodera ,  Katsufumi Sato ,  Satoshi Kurimoto ,  Yoji Tozawa ,  Hiroshi Uemura

IPC分类号： B32B37/12 ,  B32B38/00

CPC分类号： H01G13/006 ,  H01C17/006 ,  H01C17/28 ,  H01G4/232 ,  Y10T156/17

摘要： A method and device for forming external electrodes on opposing surfaces of an electronic chip. A plurality of chips are arrayed on a plate and held at a first end faces by a silicon rubber provided on the plate. The plate is brought close to a coating bed so that second end faces of the chips are immersed in an electrically conductive paste formed on the coating bed. The second end faces of the chips are coated with the conductive paste which forms first electrodes after drying step. Subsequently, the plate is inverted and brought toward a sheet with a foamable and releasable adhesive layer for allowing the chips to be pressed against the foamable and releasable adhesive and held thereby. The chips are transferred from the plate to the sheet. Next, second electrodes are formed on the first end faces. After the first and second end faces are formed with electrodes, the sheet is heated, causing the foamable and releasable adhesive in the sheet to foam and lose its adhesive strength to remove the components from the sheet by their own weight.

摘要翻译： 一种用于在电子芯片的相对表面上形成外部电极的方法和装置。 多个芯片排列在板上，并通过设置在板上的硅橡胶在第一端面处保持。 使板靠近涂层床，使得芯片的第二端面浸入形成在涂层上的导电浆料中。 芯片的第二端面涂覆有在干燥步骤后形成第一电极的导电浆料。 随后，将板倒置并带有具有可发泡和可释放的粘合剂层的片材，以允许片材被压靠在可发泡和可剥离的粘合剂上并由其保持。 芯片从板材转移到纸张。 接下来，在第一端面上形成第二电极。 在第一和第二端面形成电极之后，片材被加热，使得片材中的可发泡和可释放的粘合剂发泡并失去其粘合强度，以通过其自身重量从片材中除去组分。

公开(公告)号：US20070166465A1

公开(公告)日：2007-07-19

申请号：US11641911

申请日：2006-12-20

申请人： Ko Onodera ,  Satoshi Kurimoto ,  Yoji Tozawa ,  Shirou Ootsuki

发明人： Ko Onodera ,  Satoshi Kurimoto ,  Yoji Tozawa ,  Shirou Ootsuki

IPC分类号： B05D3/12

CPC分类号： H01G13/006 ,  Y10T29/49098 ,  Y10T29/49101 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155

摘要： A method of forming an external electrode of an electronic component involves a paste preparation step, a removal step, an element preparation step, a contact step, and a formation step. The first step is to prepare a jig with a groove into which an element forming the electronic component can be inserted. The groove of the jig includes at least a first wall surface inclined outward in a direction from an interior toward an aperture. The paste preparation step is to fill a conductive paste in the groove. The removal step is to remove the filled conductive paste so as to leave the conductive paste along the first wall surface and remove the rest. The ealement preparation step is to locate the element immediately above the groove. The contact step is to insert the element into the groove and to move the element toward the first wall surface to bring a ridgeline of the element into contact with the first wall surface. The formation step is to move the element along the first wall surface and toward the aperture in a state in which the ridgeline of the element is kept in contact with the first wall surface, and to move the element away from the first wall surface so as to separate the ridgeline from the first wall surface.

摘要翻译： 形成电子部件的外部电极的方法包括糊剂制备步骤，去除步骤，元件制备步骤，接触步骤和形成步骤。 第一步是制备具有槽的夹具，其中可以插入形成电子部件的元件。 夹具的凹槽至少包括从内部朝向孔向外倾斜的第一壁面。 糊剂制备步骤是填充凹槽中的导电膏。 去除步骤是去除填充的导电浆料，以便沿着第一壁表面留下导电浆料并除去其余部分。 造纸步骤是在凹槽正上方定位元件。 接触步骤是将元件插入槽中并将元件移向第一壁表面以使元件的脊线与第一壁表面接触。 形成步骤是在元件的棱线与第一壁表面保持接触的状态下沿着第一壁表面移动元件并朝向孔径移动，并且使元件从第一壁表面移开，以便 将脊线与第一个墙壁表面分开。