公开(公告)号：US20060087020A1

公开(公告)日：2006-04-27

申请号：US11254379

申请日：2005-10-20

申请人： Koichi Hirano ,  Seiichi Nakatani ,  Tsukasa Shiraishi ,  Yoshitake Hayashi

发明人： Koichi Hirano ,  Seiichi Nakatani ,  Tsukasa Shiraishi ,  Yoshitake Hayashi

IPC分类号： H01L23/02

CPC分类号： H01L23/5389 ,  H01L21/563 ,  H01L23/3121 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/1627 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/20752 ,  H01L2224/0401

摘要： In a semiconductor device, circuit boards are connected electrically to each other by via-conductors that penetrate sheet members, semiconductor elements arranged between substrates are contained in element-containing portions formed on the sheet members, and a low-elastic material whose elastic modulus is lower than the elastic modulus of the thermosetting resin composition of the sheet members is filled in the space between the semiconductor elements contained in the element-containing portions and the substrates opposing surfaces opposite to the mounting surfaces of the semiconductor elements. Thereby, a semiconductor device resistant to warping and deformation and having a high mounting reliability is provided.

摘要翻译： 在半导体装置中，电路板通过贯穿片状部件的通孔导体相互电连接，设置在基板之间的半导体元件容纳在形成在片状部件上的元件容纳部中，弹性模量为 低于片状部件的热固性树脂组合物的弹性模量填充在包含在元件容纳部分中的半导体元件与与半导体元件的安装表面相对的相对表面的基板之间的空间中。 因此，提供了耐翘曲变形并且具有高安装可靠性的半导体器件。

公开(公告)号：US07488895B2

公开(公告)日：2009-02-10

申请号：US10573717

申请日：2004-09-27

申请人： Yoshitake Hayashi ,  Masayoshi Koyama ,  Satoru Yuhaku ,  Kazuo Otani ,  Susumu Matsuoka ,  Yasushi Taniguchi ,  Seiichi Nakatani

发明人： Yoshitake Hayashi ,  Masayoshi Koyama ,  Satoru Yuhaku ,  Kazuo Otani ,  Susumu Matsuoka ,  Yasushi Taniguchi ,  Seiichi Nakatani

IPC分类号： H05K1/03

CPC分类号： H01L23/5389 ,  H01L21/4857 ,  H01L23/49833 ,  H01L23/5385 ,  H01L25/0657 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2924/0002 ,  H05K1/186 ,  H05K1/187 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/462 ,  H05K2201/10378 ,  H05K2203/0191 ,  Y10T29/49165 ,  H01L2924/00

摘要： A component built-in module of the present invention includes: a first wiring pattern; an electronic component mounted on the first wiring pattern; a second wiring pattern; an electrical insulating sheet with the electrical component built therein, the electrical insulating sheet being disposed between the first wiring pattern and the second wiring pattern; and a via conductor formed in a via hole penetrating through the electrical insulating sheet, the via conductor connecting electrically the first wiring pattern and the second wiring pattern. A side face of the via conductor defines a continuous line in an axis direction of the via conductor. Thus, a component built-in module having excellent reliability concerning electrical connection can be provided.

摘要翻译： 本发明的组件内置模块包括：第一布线图案; 安装在所述第一布线图案上的电子部件; 第二布线图案; 电气绝缘片，其中内置有电气部件，电绝缘片设置在第一布线图案和第二布线图案之间; 以及形成在穿过所述电绝缘片的通孔中的通孔导体，所述通孔导体电连接所述第一布线图案和所述第二布线图案。 通孔导体的侧面在通孔导体的轴线方向上形成连续的线。 因此，可以提供具有优异的电连接可靠性的组件内置模块。

公开(公告)号：US20070119617A1

公开(公告)日：2007-05-31

申请号：US10573717

申请日：2004-09-27

申请人： Yoshitake Hayashi ,  Masayoshi Koyama ,  Satoru Yuhaku ,  Kazuo Otani ,  Susumu Matsuoka ,  Seiichi Nakatani

发明人： Yoshitake Hayashi ,  Masayoshi Koyama ,  Satoru Yuhaku ,  Kazuo Otani ,  Susumu Matsuoka ,  Seiichi Nakatani

IPC分类号： H05K1/16

CPC分类号： H01L23/5389 ,  H01L21/4857 ,  H01L23/49833 ,  H01L23/5385 ,  H01L25/0657 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2924/0002 ,  H05K1/186 ,  H05K1/187 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/462 ,  H05K2201/10378 ,  H05K2203/0191 ,  Y10T29/49165 ,  H01L2924/00

摘要： A component built-in module of the present invention includes: a first wiring pattern; an electronic component mounted on the first wiring pattern; a second wiring pattern; an electrical insulating sheet with the electrical component built therein, the electrical insulating sheet being disposed between the first wiring pattern and the second wiring pattern; and a via conductor formed in a via hole penetrating through the electrical insulating sheet, the via conductor connecting electrically the first wiring pattern and the second wiring pattern. A side face of the via conductor defines a continuous line in an axis direction of the via conductor. Thus, a component built-in module having excellent reliability concerning electrical connection can be provided.

摘要翻译： 本发明的组件内置模块包括：第一布线图案; 安装在所述第一布线图案上的电子部件; 第二布线图案; 电气绝缘片，其中内置有电气部件，电绝缘片设置在第一布线图案和第二布线图案之间; 以及形成在穿过所述电绝缘片的通孔中的通孔导体，所述通孔导体电连接所述第一布线图案和所述第二布线图案。 通孔导体的侧面在通孔导体的轴线方向上形成连续的线。 因此，可以提供具有优异的电连接可靠性的组件内置模块。

公开(公告)号：US07737367B2

公开(公告)日：2010-06-15

申请号：US11338771

申请日：2006-01-25

申请人： Masayoshi Koyama ,  Yoshitake Hayashi ,  Kazuo Otani

发明人： Masayoshi Koyama ,  Yoshitake Hayashi ,  Kazuo Otani

IPC分类号： H01R12/04 ,  H05K1/11

CPC分类号： H05K3/4614 ,  H05K3/0035 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0376 ,  H05K2201/0394 ,  H05K2201/0969 ,  H05K2203/0278 ,  H05K2203/0554 ,  H05K2203/1453 ,  Y10T29/49165

摘要： Holes having the same diameter as via holes are formed in predetermined positions in advance when forming wiring patterns on releasable carriers. The carriers with the wiring patterns are bonded on an insulating material, and a laser beam is irradiated from the side of the carrier using the holes in the wiring pattern as a laser mask to form via holes in the insulating material. The via holes and the holes in the carrier are then filled with a conductive paste. With the holes in the carrier that are matched in position with the via holes, lands in the conductor layers are precisely positioned relative to the via holes. A multilayer circuit board thus produced has lower electrical connection resistance and excellent mountability with improved performances. Also a manufacturing method thereof is achieved.

摘要翻译： 当在可拆卸的载体上形成布线图案时，预先形成具有与通孔相同直径的孔。 具有布线图案的载体被接合在绝缘材料上，并且使用布线图案中的孔作为激光掩模从载体的侧面照射激光束，以在绝缘材料中形成通孔。 通孔和载体中的孔然后用导电浆料填充。 通过载体中与通孔的位置匹配的孔，导体层中的焊盘相对于通孔精确定位。 由此制造的多层电路板具有较低的电连接电阻和优异的安装性能，并具有改进的性能。 也可以实现其制造方法。

公开(公告)号：US20060191715A1

公开(公告)日：2006-08-31

申请号：US11338771

申请日：2006-01-25

申请人： Masayoshi Koyama ,  Yoshitake Hayashi ,  Kazuo Otani

发明人： Masayoshi Koyama ,  Yoshitake Hayashi ,  Kazuo Otani

IPC分类号： H05K1/11 ,  H05K3/40

CPC分类号： H05K3/4614 ,  H05K3/0035 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0376 ,  H05K2201/0394 ,  H05K2201/0969 ,  H05K2203/0278 ,  H05K2203/0554 ,  H05K2203/1453 ,  Y10T29/49165

摘要： Holes having the same diameter as via holes are formed in predetermined positions in advance when forming wiring patterns on releasable carriers. The carriers with the wiring patterns are bonded on an insulating material, and a laser beam is irradiated from the side of the carrier using the holes in the wiring pattern as a laser mask to form via holes in the insulating material. The via holes and the holes in the carrier are then filled with a conductive paste. With the holes in the carrier that are matched in position with the via holes, lands in the conductor layers are precisely positioned relative to the via holes. A multilayer circuit board thus produced has lower electrical connection resistance and excellent mountability with improved performances. Also a manufacturing method thereof is achieved.

摘要翻译： 当在可拆卸的载体上形成布线图案时，预先形成具有与通孔相同直径的孔。 具有布线图案的载体被接合在绝缘材料上，并且使用布线图案中的孔作为激光掩模从载体的侧面照射激光束，以在绝缘材料中形成通孔。 通孔和载体中的孔然后用导电浆料填充。 通过载体中与通孔的位置匹配的孔，导体层中的焊盘相对于通孔精确定位。 由此制造的多层电路板具有较低的电连接电阻和优异的安装性能，并具有改进的性能。 也可以实现其制造方法。

公开(公告)号：US06898850B2

公开(公告)日：2005-05-31

申请号：US10634089

申请日：2003-08-04

申请人： Hideo Kanzawa ,  Satoru Yuuhaku ,  Yoshitake Hayashi

发明人： Hideo Kanzawa ,  Satoru Yuuhaku ,  Yoshitake Hayashi

IPC分类号： H01L21/48 ,  H01L25/10 ,  H05K1/18 ,  H05K3/20 ,  B23P13/00

CPC分类号： H05K3/205 ,  H01L21/4867 ,  H01L25/105 ,  H01L2224/73204 ,  H01L2225/1035 ,  H05K1/185 ,  H05K1/187 ,  H05K3/207 ,  H05K2203/0568 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T29/49165

摘要： A method of manufacturing a circuit board by forming a circuit pattern in a short process and capable of performing pattern transfer with stability. The manufacturing method includes a step of superposing on a carrier a resist layer in which a circuit pattern is formed and which is formed of a conductor or an insulator, a step of filling the circuit pattern with an electroconductive material, a step of removing the resist layer from the carrier, and a step of transferring the electroconductive material filled in the circuit pattern into an electrical insulating material.

摘要翻译： 一种通过在短时间内形成电路图案并且能够稳定地执行图案转印来制造电路板的方法。 该制造方法包括在载体上叠加其中形成电路图案并由导体或绝缘体形成的抗蚀剂层的步骤，用导电材料填充电路图案的步骤，除去抗蚀剂的步骤 层，以及将填充在电路图案中的导电材料转印到电绝缘材料中的步骤。

公开(公告)号：US20120293965A1

公开(公告)日：2012-11-22

申请号：US13472591

申请日：2012-05-16

申请人： Shozo OCHI ,  Yoshitake Hayashi ,  Kazuo Ohtani ,  Yosuke Maeba

发明人： Shozo OCHI ,  Yoshitake Hayashi ,  Kazuo Ohtani ,  Yosuke Maeba

IPC分类号： H05K7/00 ,  H05K13/04

CPC分类号： H01L21/56 ,  H01L21/4857 ,  H01L23/3107 ,  H01L23/5389 ,  H01L2924/0002 ,  H05K1/186 ,  H05K3/4069 ,  H05K3/4638 ,  H05K3/4697 ,  H01L2924/00

摘要： A manufacturing method for a component built-in module, including: forming, in a sheet member including resin, a via hole filled up with a conductive paste, a cavity in which an electronic component is to be built, and an adjustment space; and performing a heat press allowing the sheet member to abut against a substrate on which the electronic component has been mounted, wherein the adjustment space is formed so that a flow vector of the resin in a neighborhood of the via hole during the heat press, which is directed toward the electronic component, is cancelled by a flow vector of the resin in a neighborhood of the via hole during the heat press, which is directed toward the adjustment space.

摘要翻译： 一种组件内置模块的制造方法，包括：在包括树脂的片材构件中形成填充有导电浆料的通孔，其中将构建电子部件的空腔和调节空间; 并且进行热压机，使片材与其上安装有电子部件的基板抵接，其中调节空间被形成为在热压机过程中通孔周围的树脂的流动矢量， 被引导到电子部件，被热冲压时的通孔附近的树脂的流动矢量抵消，该朝向调节空间。

公开(公告)号：US4633032A

公开(公告)日：1986-12-30

申请号：US701192

申请日：1985-02-13

申请人： Hikofumi Oido ,  Yoshitake Hayashi ,  Minoru Yamamoto

发明人： Hikofumi Oido ,  Yoshitake Hayashi ,  Minoru Yamamoto

IPC分类号： H01L31/04 ,  H01L31/02 ,  H01L31/042 ,  H01L31/048 ,  H01L31/18 ,  H01L31/00

CPC分类号： H01L31/048 ,  H01L31/1828 ,  Y02E10/543

摘要： A package configuration of a solar cell has a glass substrate having a solar cell element formed on the surface opposite to the light-receiving surface thereof, a backplate disposed across an empty space from the surface of the glass substrate opposite to the light receiving surface thereof, a frame connecting the glass substrate and the backplate to each other along the peripheries thereof, a sealing resin layer sealed inside the peripheries of the backplate and the frame so as to isolate the empty space from the atmosphere, a layer of desiccant disposed inside the backplate so as to adsorb moisture penetrating into the empty space, and conductor wires for externally collecting electric energy generated by the solar cell element.

摘要翻译： 太阳能电池的封装结构具有在与其受光面相反的表面上形成有太阳能电池元件的玻璃基板，从玻璃基板的与其受光面相反的表面的空白空间配置的背板 ，将玻璃基板和背板沿着其周边彼此连接的框架，密封树脂层，密封在背板和框架的周边内部，以将空间与大气隔离，设置在内部的干燥剂层 背板，以吸附渗透到空间的水分，以及用于外部收集由太阳能电池元件产生的电能的导线。

公开(公告)号：US08745859B2

公开(公告)日：2014-06-10

申请号：US13472591

申请日：2012-05-16

申请人： Shozo Ochi ,  Yoshitake Hayashi ,  Kazuo Ohtani ,  Yosuke Maeba

发明人： Shozo Ochi ,  Yoshitake Hayashi ,  Kazuo Ohtani ,  Yosuke Maeba

IPC分类号： H05K1/02

CPC分类号： H01L21/56 ,  H01L21/4857 ,  H01L23/3107 ,  H01L23/5389 ,  H01L2924/0002 ,  H05K1/186 ,  H05K3/4069 ,  H05K3/4638 ,  H05K3/4697 ,  H01L2924/00

摘要： A manufacturing method for a component built-in module, including: forming, in a sheet member including resin, a via hole filled up with a conductive paste, a cavity in which an electronic component is to be built, and an adjustment space; and performing a heat press allowing the sheet member to abut against a substrate on which the electronic component has been mounted, wherein the adjustment space is formed so that a flow vector of the resin in a neighborhood of the via hole during the heat press, which is directed toward the electronic component, is cancelled by a flow vector of the resin in a neighborhood of the via hole during the heat press, which is directed toward the adjustment space.

摘要翻译： 一种组件内置模块的制造方法，包括：在包括树脂的片材构件中形成填充有导电浆料的通孔，其中将构建电子部件的空腔和调节空间; 并且进行热压机，使片材与其上安装有电子部件的基板抵接，其中调节空间被形成为在热压机过程中通孔周围的树脂的流动矢量， 被引导到电子部件，被热冲压时的通孔附近的树脂的流动矢量抵消，该朝向调节空间。

公开(公告)号：US06613180B2

公开(公告)日：2003-09-02

申请号：US10114089

申请日：2002-04-01

申请人： Yoshitaka Sunagawa ,  Yoshitake Hayashi ,  Masayoshi Koyama ,  Yoshihiro Tomura ,  Toshiyuki Kojima ,  Osamu Shibata ,  Ryuichi Saito

发明人： Yoshitaka Sunagawa ,  Yoshitake Hayashi ,  Masayoshi Koyama ,  Yoshihiro Tomura ,  Toshiyuki Kojima ,  Osamu Shibata ,  Ryuichi Saito

IPC分类号： B32B3100

CPC分类号： H01L21/67132 ,  H01L21/50 ,  H01L21/563 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75315 ,  H01L2224/7598 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/3025 ,  Y10T156/1089 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for fabricating a semiconductor-mounting body having at least one semiconductor device mounted on a substrate and a sealing resin set in the gap between the substrate and the semiconductor device, has a first step of setting a flexibly deformable sheet on a face of the semiconductor device not facing the substrate; and a second step of generating an air-pressure difference between the side where the semiconductor device is not present and the side where the semiconductor device is present on the basis of the sheet so that the air pressure at the side where the semiconductor device is not present becomes higher than the side where the semiconductor device is present and pressurizing the semiconductor device by the sheet after the first step.

摘要翻译： 一种制造半导体安装体的方法，其具有安装在基板上的至少一个半导体器件和设置在基板和半导体器件之间的间隙中的密封树脂，具有将柔性可变形薄片设置在半导体的表面上的第一步骤 设备不面向基板; 以及基于片材在半导体器件不存在的一侧和存在半导体器件的一侧之间产生气压差的第二步骤，使得半导体器件不存在的一侧的空气压力 变得高于存在半导体器件的一侧并且在第一步骤之后通过片材对半导体器件加压。