公开(公告)号：US20120230721A1

公开(公告)日：2012-09-13

申请号：US13195649

申请日：2011-08-01

申请人： Kosuke YAMADA ,  Yuki NAGAMORI

发明人： Kosuke YAMADA ,  Yuki NAGAMORI

IPC分类号： G03G15/02

CPC分类号： G03G15/0184 ,  G03G15/0291 ,  G03G21/1661

摘要： A cleaning device includes a cleaning member provided at a first side of a curved grid electrode plate that is curved in a short-side direction, the cleaning member being pressed against the curved grid electrode plate to clean the first side thereof; a receiving member provided at a second side of the curved grid electrode plate, the receiving member receiving a pressing load applied by the cleaning member; and a moving unit that moves the cleaning member and the receiving member in a long-side direction of the curved grid electrode plate. The cleaning member and the receiving member are formed such that a pressure based on the load that is applied to an end portion of the curved grid electrode plate in the short-side direction is higher than that applied to a central portion of the curved grid electrode plate in the short-side direction.

摘要翻译： 一种清洁装置，包括：设置在弯曲的栅格电极板的沿短边方向弯曲的第一侧的清洁构件，所述清洁构件被压靠在所述弯曲的栅极电极板上以清洁其第一侧; 接收构件，设置在所述弯曲栅极电极板的第二侧，所述接收构件接收由所述清洁构件施加的按压负载; 以及移动单元，其使所述清洁构件和所述接收构件在所述弯曲栅极电极板的长边方向上移动。 清洁部件和接收部件形成为使得基于施加到弯曲栅极电极板的短边方向的端部的负载的压力高于施加到弯曲栅极电极的中心部分的压力 板在短边方向。

公开(公告)号：US20090256668A1

公开(公告)日：2009-10-15

申请号：US12486477

申请日：2009-06-17

申请人： Takashi NOMA ,  Jun SASAKI ,  Kosuke YAMADA

发明人： Takashi NOMA ,  Jun SASAKI ,  Kosuke YAMADA

IPC分类号： H01F5/00

CPC分类号： H01F17/0013 ,  H01F38/10 ,  H01G4/40

摘要： A multilayer electronic component that can suppress the formation of projections and depressions on a surface, and an electronic component unit including the multilayer electronic component, are provided. In the multilayer electronic component, coil electrodes (8) having a shape of ring-shaped wiring with a part removed therefrom are electrically connected to each other to constitute a coil (L). Magnetic layers (4) are stacked together with the plurality of coil electrodes (8). The coil electrodes (8a, 8c, 8e) having a radius r1 and the coil electrodes (8b, 8d) having a radius r2 that is smaller than the radius r1 may be alternately arranged in a stacking direction.

摘要翻译： 提供了能够抑制表面上的凹凸形成的多层电子部件和包括该多层电子部件的电子部件单元。 在多层电子部件中，具有从其去除部分的环状布线形状的线圈电极（8）彼此电连接以构成线圈（L）。 磁性层（4）与多个线圈电极（8）堆叠在一起。 具有半径r1的线圈电极（8a，8c，8e）和半径r2小于半径r1的线圈电极（8b，8d）可以沿堆叠方向交替排列。

公开(公告)号：US20110018130A1

公开(公告)日：2011-01-27

申请号：US12833083

申请日：2010-07-09

申请人： Kosuke YAMADA ,  Noboru KATO

发明人： Kosuke YAMADA ,  Noboru KATO

IPC分类号： H01L23/485

CPC分类号： H01L24/06 ,  H01L23/3114 ,  H01L23/3192 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/0603 ,  H01L2224/06131 ,  H01L2224/06179 ,  H01L2224/06505 ,  H01L2224/14 ,  H01L2224/1403 ,  H01L2224/14505 ,  H01L2224/16 ,  H01L2224/81191 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3511

摘要： A semiconductor package is provided with a functionally necessary minimum number of components with which stress concentrated on specific solder bumps is reduced and ruptures of the bumps are prevented even when stress caused by physical bending or a difference in thermal expansion coefficient is applied to the package. The semiconductor package includes a tabular die and bonding pads arranged on a mounting surface of the die. A passivation layer and a protective film are provided on the mounting surface such that central areas of the bonding pads are open. Under-bump metals (UBMs) connected to the bonding pads are provided in the openings, and solder bumps are provided on the surfaces of the UBMs. The diameter of the UBMs provided at corners of the die is less than that of the UBM provided at the approximate center of the die so that the elastic modulus of the UBMs provided at the corners is small.

摘要翻译： 半导体封装设置有功能上必需的最小数量的组件，其中集中在特定焊料凸块上的应力被减小，并且即使当由物理弯曲引起的应力或热膨胀系数的差异施加到封装时，也可以防止凸块的破裂。 半导体封装包括布置在管芯的安装表面上的片状管芯和焊盘。 在安装表面上设置钝化层和保护膜，使得焊盘的中心区域是开放的。 连接到接合焊盘的凹凸下金属（UBM）设置在开口中，并且在UBM的表面上设置焊料凸块。 设置在模具角落处的UBM的直径小于设置在模具的大致中心处的UBM的直径，使得设置在拐角处的UBM的弹性模量小。

公开(公告)号：US20120195660A1

公开(公告)日：2012-08-02

申请号：US13207838

申请日：2011-08-11

申请人： Kosuke YAMADA

发明人： Kosuke YAMADA

IPC分类号： G03G21/00

CPC分类号： G03G21/0005

摘要： An image carrier unit includes an image carrier that carries a toner image developed with a developer containing a toner on a surface thereof before the toner image is transferred to a transfer member in a transfer region; a supply section that supplies a lubricant containing a fluorocarbon resin to a surface of the image carrier such that the weight fraction of the fluorocarbon resin contained in the lubricant supplied after a period of time has elapsed since a predetermined point in time is higher than the weight fraction of the fluorocarbon resin contained in the lubricant supplied at the predetermined point in time; and a removing member that is disposed in contact with the surface of the image carrier and that removes the developer remaining without being transferred to the transfer member from the surface of the image carrier.

摘要翻译： 图像载体单元包括：图像载体，其在将调色剂图像转印到转印区域中的转印构件之前，在其表面上携带用含有调色剂的显影剂显影的调色剂图像; 供给部，其将含有碳氟树脂的润滑剂供给到图像载体的表面，使得从规定的时间点经过一段时间后供给的润滑剂中所含的氟碳树脂的重量分数高于重量 在预定时间点供应的润滑剂中所含的氟碳树脂的分数; 以及去除构件，其设置成与图像载体的表面接触，并且除去从图像载体的表面转移到转印构件的剩余的显影剂。