摘要:
A system comprises a first maintenance interval storage for storing a first maintenance interval of each component which is not related to an actual utilization of an apparatus, a second maintenance interval storage storing a second maintenance interval of each component which is related to the actual utilization of the apparatus, a maintenance demander for demanding maintenance of some component based on the passing of the first maintenance interval of this component; and a maintenance interval prolonger for judging the second maintenance interval has passed or not based on the passing of the first maintenance interval, and when the second maintenance interval has not yet passed, suspending the demand for maintenance by the maintenance demander and prolonging the first maintenance interval. Consequently, it becomes possible to manage a maintenance timing of each component and give notice thereof on the side of the apparatus composed of a plurality of components.
摘要:
A substrate processing method for forming a resist film on a wafer with a base film being formed, and performing an exposure processing and a developing processing for the resist film to thereby form a desired resist pattern, has a base reflected light analyzing step of radiating a light of the same wavelength as an exposure light radiated during the exposure processing to the base film and analyzing a reflected light, before forming the resist film, and a processing condition control step of controlling at least one of a resist film forming condition and an exposure processing condition, based on the analysis of the reflected light. The method makes it possible to control a line width of a resist pattern with high precision.
摘要:
A transfer flow is produced in accordance with a process recipe of a process to be carried out. In the transfer flow, a type of modules listed in accordance with a substrate transfer order is associated with a necessary staying time from when the substrate is transferred into a module by a substrate transfer unit to when the substrate is ready to be transferred back to the substrate transfer unit after the corresponding process is finished. A cycle limiting time is determined to be the longest necessary transfer cycle time among those obtained by dividing the necessary staying time by the number of the modules mounted in the coater/developer. The number of the modules to be used is determined to be a value obtained by dividing the necessary staying time by the cycle limiting time or a nearest integer to which the value is raised.
摘要:
A transfer flow is produced in accordance with a process recipe of a process to be carried out. In the transfer flow, a type of modules listed in accordance with a substrate transfer order is associated with a necessary staying time from when the substrate is transferred into a module by a substrate transfer unit to when the substrate is ready to be transferred back to the substrate transfer unit after the corresponding process is finished. A cycle limiting time is determined to be the longest necessary transfer cycle time among those obtained by dividing the necessary staying time by the number of the modules mounted in the coater/developer. The number of the modules to be used is determined to be a value obtained by dividing the necessary staying time by the cycle limiting time or a nearest integer to which the value is raised.
摘要:
The present invention is a substrate processing method comprising the steps of successively extracting unprocessed wafers from a cassette, successively conveying the extracted wafers to a plurality of processing units, causing the processing units to process the wafers in parallel, and returning the processed wafers to a cassette. A process completion prediction time at which processes for one lot are completed is calculated and displayed corresponding to a process recipe that has been set to a plurality of wafers for at least one lot. Corresponding to the process completion prediction time, a cassette that contains a plurality of unprocessed wafers for one lot is accepted. A cassette that contains a plurality of processed wafers for one lot is returned.
摘要:
A transfer flow is produced in accordance with a process recipe of a process to be carried out. In the transfer flow, a type of modules listed in accordance with a substrate transfer order is associated with a necessary staying time from when the substrate is transferred into a module by a substrate transfer unit to when the substrate is ready to be transferred back to the substrate transfer unit after the corresponding process is finished. A cycle limiting time is determined to be the longest necessary transfer cycle time among those obtained by dividing the necessary staying time by the number of the modules mounted in the coater/developer. The number of the modules to be used is determined to be a value obtained by dividing the necessary staying time by the cycle limiting time or a nearest integer to which the value is raised.
摘要:
A system for successively extracting unprocessed substrates from a cassette, successively conveying the extracted substrates to a plurality of processing units, causing the processing units to process the substrates, and successively returning processed substrates to a cassette is disclosed. In the system, corresponding to a recipe that contains process conditions for each of at least one lot, a process start prediction time at which processes of each lot start and a process completion prediction time at which processes for each lot are completed are calculated for at least two processes. Corresponding to the process start prediction time and the process completion prediction time, at least one of optimum processing units that optimize processes for each lot is selected for each lot.
摘要:
A wafer processing apparatus includes a common path, extending in a Y-axis direction, in which one wafer or a plurality of wafers are conveyed, a plurality of process units stacked on both sides of the common path to constitute multi-stage structures, a main handler moved in the common path in the Y-axis direction and rotated about a Z axis at an angle &thgr; to load/unload the wafer into/from the process units, an arm section arranged to move in the main handler in the Z-axis direction, a plurality of holding arms arranged in the arm section to constitute a multi-stage structure so as to respectively hold the wafers, each holding arm being advanced and retreated on an X-Y plane from the arm section, an optical sensor, arranged in the arm section, for detecting a holding state of the wafer in each of the plurality of holding arms, and a controller for controlling an operation of the main handler, an operation of the arm section, and operations of the plurality of holding arms on the basis of a detection result from the optical sensor, wherein the controller advances or retreats each holding arm while operating at least one of the main handler and the arm section, and causes the optical sensor to detect the holding state of the wafer by each holding arm before the holding arm reaches a corresponding one of the process units.
摘要翻译:晶片处理装置包括在Y轴方向上延伸的公共路径,其中一个晶片或多个晶片被输送,多个处理单元堆叠在公共路径的两侧以构成多级结构, 主处理器沿着Y轴方向在公共路径中移动并且以角度θ围绕Z轴旋转以将晶片装载/卸载到处理单元中/从加工单元中卸载晶片,臂部分布置成在Z轴方向上移动到主处理器中, 多个保持臂,布置在所述臂部中,以构成多个阶段结构,以分别保持晶片,每个保持臂从臂部在XY平面上前进和后退;光学传感器,布置在 臂部,用于检测多个保持臂中的每一个中的晶片的保持状态;以及控制器,用于控制主处理器的操作,臂部的操作以及多个保持臂的操作 bas 具有来自光学传感器的检测结果,其中控制器在操作主处理器和臂部分中的至少一个的同时前进或后退每个保持臂,并且使得光学传感器通过每个保持臂检测晶片的保持状态 在握持臂到达相应的一个处理单元之前。
摘要:
An apparatus for subjecting a plurality of wafers to coating and heating treatments, including a coating section for subjecting the wafers to a coating treatment one by one, a heating section for subjecting wafers which have undergone the coating treatment to a heating treatment all together, and an interface section arranged between the coating section and the heating section. The wafers are heat-treated in the heat treatment section while the wafers are stacked at intervals in a vertical direction in a boat. The wafers which have undergone the coating treatment are loaded into the boat by a conveying member in the interface section. The conveying member and the boat are surrounded by a surrounding space formed by a casing at the interface section. A circulation line is combined with an air supply and exhaust system, for circulating air in the surrounding space. A dehumidifier is arranged on the circulation line for dehumidifying air in the circulation line to provide localized dehumidification of the surrounding space formed by the casing.
摘要:
A substrate-processing system has several processing units, a loading/unloading section for transferring wafers to be processed to each unit and taking out processed wafers from each unit and a sub-arm mechanism for receiving/transferring the substrates from/to the loading/unloading section and transferring the substrates one by one to each unit. The processing units and the sub-arm mechanism are controlled by a controller so that each unit processes the substrates one by one in accordance with a one-cycle time that is the maximum period among periods t1/m to tn/m obtained by dividing periods t1 to tn by the number “m” of identical units of each processing unit. The controller sets a pre-waiting time (before processing) for each processing unit.