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15 条记录 (耗时 0.039 秒)

    Polishing apparatus
    4.
    发明申请
    Polishing apparatus 有权
    抛光设备

    公开(公告)号：US20050159082A1

    公开(公告)日：2005-07-21

    申请号：US11078495

    申请日：2005-03-14

    申请人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Nobuyuki Takada ,  Satoshi Wakabayashi ,  Kenichiro Saito ,  Masahiko Sekimoto ,  Takuji Hayama ,  Daisuke Koga

    发明人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Nobuyuki Takada ,  Satoshi Wakabayashi ,  Kenichiro Saito ,  Masahiko Sekimoto ,  Takuji Hayama ,  Daisuke Koga

    IPC分类号： B24B37/04 ,  H01L21/306 ,  B24B49/00

    CPC分类号： B24B37/345 ,  B24B37/042 ,  H01L21/30625

    摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by said top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces.

    摘要翻译： 抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。 抛光装置包括具有抛光表面的转台，用于保持工件的顶环，并将工件压靠抛光表面抛光工件，用于清洁抛光工件的至少三个清洁装置和用于传送抛光工件的转印结构 在至少三个清洁装置之间。 抛光装置还包括旋转输送器，其设置在可由所述顶环接近的位置，并且具有从旋转运送器的旋转中心定位在预定圆周上的多个部分，用于保持工件。

    Polishing apparatus
    7.
    发明申请
    Polishing apparatus 失效

    公开(公告)号：US20070087663A1

    公开(公告)日：2007-04-19

    申请号：US11602336

    申请日：2006-11-21

    申请人： Takuji Hayama ,  Masafumi Inoue ,  Kunihiko Sakurai

    发明人： Takuji Hayama ,  Masafumi Inoue ,  Kunihiko Sakurai

    IPC分类号： B24B51/00 ,  B24B49/00

    CPC分类号： B24B47/22 ,  B24B37/30 ,  B24B49/16 ,  H01L21/30625

    摘要： A polishing apparatus has a polishing table (12) with a polishing surface (10) attached thereon, and a top ring (20) for pressing a workpiece (W) against the polishing surface (10). The top ring (20) has a housing (40) and a retainer ring (44) vertically movable in the housing (40) for holding an outer circumferential edge of the workpiece (W). The polishing apparatus includes a vertically moving mechanism operable to vertically move the top ring (20), a bracket (28) vertically movable together with the top ring (20), a stopper (32) adjustable in vertical position to prevent downward movement of the bracket (28), and a sensor (36) for detecting a distance between the stopper (32) and the bracket (28). The polishing apparatus also includes a control unit (34) operable to adjust the stopper (32) in vertical position when the retainer ring (44) is brought into contact with the polishing surface (10) while a lower surface of the housing (40) of the top ring (20) is located at a predetermined height from the polishing surface (10) so that the distance between the stopper (32) and the bracket (28) is equal to a difference between a height of the lower surface of the housing (40) from the polishing surface (10) at the time of polishing and the predetermined height.

    Polishing apparatus
    8.
    发明授权
    Polishing apparatus 失效
    抛光设备

    公开(公告)号：US07270594B2

    公开(公告)日：2007-09-18

    申请号：US11602336

    申请日：2006-11-21

    申请人： Takuji Hayama ,  Masafumi Inoue ,  Kunihiko Sakurai

    发明人： Takuji Hayama ,  Masafumi Inoue ,  Kunihiko Sakurai

    IPC分类号： B24B49/00

    CPC分类号： B24B47/22 ,  B24B37/30 ,  B24B49/16 ,  H01L21/30625

    摘要： A polishing apparatus has a polishing table (12) with a polishing surface (10) attached thereon, and a top ring (20) for pressing a workpiece (W) against the polishing surface (10). The top ring (20) has a housing (40) and a retainer ring (44) vertically movable in the housing (40) for holding an outer circumferential edge of the workpiece (W). The polishing apparatus includes a vertically moving mechanism operable to vertically move the top ring (20), a bracket (28) vertically movable together with the top ring (20), a stopper (32) adjustable in vertical position to prevent downward movement of the bracket (28), and a sensor (36) for detecting a distance between the stopper (32) and the bracket (28). The polishing apparatus also includes a control unit (34) operable to adjust the stopper (32) in vertical position when the retainer ring (44) is brought into contact with the polishing surface (10) while a lower surface of the housing (40) of the top ring (20) is located at a predetermined height from the polishing surface (10) so that the distance between the stopper (32) and the bracket (28) is equal to a difference between a height of the lower surface of the housing (40) from the polishing surface (10) at the time of polishing and the predetermined height.

    摘要翻译： 抛光装置具有安装有研磨面（10）的研磨台（12）和用于将工件（W）压靠在研磨面（10）上的顶环（20）。 顶环（20）具有壳体（40）和可在壳体（40）中垂直移动以用于保持工件（W）的外周边缘的保持环（44）。 所述抛光装置包括可垂直移动所述顶环（20）的垂直移动机构，与所述顶环（20）一起可垂直移动的托架（28）;可在垂直位置上调节的止动件（32），以防止所述顶环 支架（28）和用于检测止动件（32）和支架（28）之间的距离的传感器（36）。 抛光装置还包括控制单元（34），当保持环（44）与抛光表面（10）接触时，可操作以在垂直位置调节止动件（32），而壳体（40）的下表面 所述顶环（20）位于距所述研磨面（10）的预定高度处，使得所述止动件（32）与所述支架（28）之间的距离等于 在抛光时从抛光表面（10）的外壳（40）和预定的高度。

    Polishing apparatus
    9.
    发明授权
    Polishing apparatus 失效
    抛光设备

    公开(公告)号：US07156719B2

    公开(公告)日：2007-01-02

    申请号：US10530277

    申请日：2003-11-04

    申请人： Takuji Hayama ,  Masafumi Inoue ,  Kunihiko Sakurai

    发明人： Takuji Hayama ,  Masafumi Inoue ,  Kunihiko Sakurai

    IPC分类号： B24B49/00

    CPC分类号： B24B47/22 ,  B24B37/30 ,  B24B49/16 ,  H01L21/30625

    摘要： A polishing apparatus has a polishing table (12) with a polishing surface (10) attached thereon, and a top ring (20) for pressing a workpiece (W) against the polishing surface (10). The top ring (20) has a housing (40) and a retainer ring (44) vertically movable in the housing (40) for holding an outer circumferential edge of the workpiece (W). The polishing apparatus includes a vertically moving mechanism operable to vertically move the top ring (20), a bracket (28) vertically movable together with the top ring (20), a stopper (32) adjustable in vertical position to prevent downward movement of the bracket (28), and a sensor (36) for detecting a distance between the stopper (32) and the bracket (28). The polishing apparatus also includes a control unit (34) operable to adjust the stopper (32) in vertical position when the retainer ring (44) is brought into contact with the polishing surface (10) while a lower surface of the housing (40) of the top ring (20) is located, at a predetermined height from the polishing surface (10) so that the distance between the stopper (32) and the bracket (28) is equal to a difference between a height of the lower surface of the housing (40) from the polishing surface (10) at the time of polishing and the predetermined height.

    摘要翻译： 抛光装置具有安装有研磨面（10）的研磨台（12）和用于将工件（W）压靠在研磨面（10）上的顶环（20）。 顶环（20）具有壳体（40）和可在壳体（40）中垂直移动以用于保持工件（W）的外周边缘的保持环（44）。 所述抛光装置包括可垂直移动所述顶环（20）的垂直移动机构，与所述顶环（20）一起可垂直移动的托架（28）;可在垂直位置上调节的止动件（32），以防止所述顶环 支架（28）和用于检测止动件（32）和支架（28）之间的距离的传感器（36）。 抛光装置还包括控制单元（34），当保持环（44）与抛光表面（10）接触时，可操作以在垂直位置调节止动件（32），而壳体（40）的下表面 所述顶环（20）的距离与所述抛光表面（10）的预定高度相对应，使得所述止动件（32）和所述支架（28）之间的距离等于 在抛光时来自抛光表面（10）的壳体（40）和预定高度。

    Polishing apparatus
    10.
    发明申请
    Polishing apparatus 失效
    抛光设备

    公开(公告)号：US20060148382A1

    公开(公告)日：2006-07-06

    申请号：US10530277

    申请日：2003-11-04

    申请人： Takuji Hayama ,  Masafumi Inoue ,  Kunihiko Sakurai

    发明人： Takuji Hayama ,  Masafumi Inoue ,  Kunihiko Sakurai

    IPC分类号： B24B49/00

    CPC分类号： B24B47/22 ,  B24B37/30 ,  B24B49/16 ,  H01L21/30625

    摘要： A polishing apparatus has a polishing table (12) with a polishing surface (10) attached thereon, and a top ring (20) for pressing a workpiece (W) against the polishing surface (10). The top ring (20) has a housing (40) and a retainer ring (44) vertically movable in the housing (40) for holding an outer circumferential edge of the workpiece (W). The polishing apparatus includes a vertically moving mechanism operable to vertically move the top ring (20), a bracket (28) vertically movable together with the top ring (20), a stopper (32) adjustable in vertical position to prevent downward movement of the bracket (28), and a sensor (36) for detecting a distance between the stopper (32) and the bracket (28). The polishing apparatus also includes a control unit (34) operable to adjust the stopper (32) in vertical position based on the distance signal from the sensor (36).

    摘要翻译： 抛光装置具有安装有研磨面（10）的研磨台（12）和用于将工件（W）压靠在研磨面（10）上的顶环（20）。 顶环（20）具有壳体（40）和可在壳体（40）中垂直移动以用于保持工件（W）的外周边缘的保持环（44）。 所述抛光装置包括可垂直移动所述顶环（20）的垂直移动机构，与所述顶环（20）一起可垂直移动的托架（28）;可在垂直位置上调节的止动件（32），以防止所述顶环 支架（28）和用于检测止动件（32）和支架（28）之间的距离的传感器（36）。 抛光装置还包括控制单元（34），其可操作以基于来自传感器（36）的距离信号将止动器（32）调整到垂直位置。