Semiconductor light emitting device and method for fabricating same
    1.
    发明申请
    Semiconductor light emitting device and method for fabricating same 有权
    半导体发光器件及其制造方法

    公开(公告)号:US20080151952A1

    公开(公告)日:2008-06-26

    申请号:US12000929

    申请日:2007-12-19

    IPC分类号: H01S5/024 H01L33/00

    摘要: A nitride semiconductor device includes a stem. A heat sink is provided on the stem. At least one nitride semiconductor light-emitting element is connected to the heat sink. A light-detecting element for detecting light from the semiconductor light-emitting element is provided on the stem. A cap for encapsulating therein the heat sink, the semiconductor light-emitting element, and the light-detecting element in a sealed manner is connected to the stem. The space in the cap has an encapsulated atmosphere. The encapsulated atmosphere contains a component for inhibiting diffusion of hydrogen atoms contained in the semiconductor light-emitting element. The present invention suppresses defect due to an increase in operation voltage to increase a ratio of good goods thereby improving the fabrication yield of the semiconductor light-emitting device.

    摘要翻译: 氮化物半导体器件包括茎。 杆上设有散热器。 至少一个氮化物半导体发光元件连接到散热器。 用于检测来自半导体发光元件的光的光检测元件设置在杆上。 用于将封装在其中的散热片,半导体发光元件和光检测元件封装的盖连接到该杆上。 帽中的空间具有封装的气氛。 封装的气氛含有抑制半导体发光元件中含有的氢原子扩散的成分。 本发明抑制了由于操作电压的增加引起的缺陷,从而提高了商品的比例,从而提高了半导体发光装置的制造成品率。

    Semiconductor light emitting device and method for fabricating same
    2.
    发明授权
    Semiconductor light emitting device and method for fabricating same 有权
    半导体发光器件及其制造方法

    公开(公告)号:US07656916B2

    公开(公告)日:2010-02-02

    申请号:US12000929

    申请日:2007-12-19

    IPC分类号: H01S3/04

    摘要: A nitride semiconductor device includes a stem. A heat sink is provided on the stem. At least one nitride semiconductor light-emitting element is connected to the heat sink. A light-detecting element for detecting light from the semiconductor light-emitting element is provided on the stem. A cap for encapsulating therein the heat sink, the semiconductor light-emitting element, and the light-detecting element in a sealed manner is connected to the stem. The space in the cap has an encapsulated atmosphere. The encapsulated atmosphere contains a component for inhibiting diffusion of hydrogen atoms contained in the semiconductor light-emitting element. The present invention suppresses defect due to an increase in operation voltage to increase a ratio of good goods thereby improving the fabrication yield of the semiconductor light-emitting device.

    摘要翻译: 氮化物半导体器件包括茎。 杆上设有散热器。 至少一个氮化物半导体发光元件连接到散热器。 用于检测来自半导体发光元件的光的光检测元件设置在杆上。 用于将封装在其中的散热片,半导体发光元件和光检测元件封装的盖连接到该杆上。 帽中的空间具有封装的气氛。 封装的气氛含有抑制半导体发光元件中含有的氢原子扩散的成分。 本发明抑制了由于操作电压的增加引起的缺陷,从而提高了商品的比例,从而提高了半导体发光装置的制造成品率。

    Method for producing nitride semiconductor laser light source and apparatus for producing nitride semiconductor laser light source
    4.
    发明申请
    Method for producing nitride semiconductor laser light source and apparatus for producing nitride semiconductor laser light source 审中-公开
    氮化物半导体激光光源的制造方法以及氮化物半导体激光光源的制造装置

    公开(公告)号:US20110174288A1

    公开(公告)日:2011-07-21

    申请号:US13064534

    申请日:2011-03-30

    IPC分类号: F24B1/00

    摘要: A method for producing a nitride semiconductor laser light source is provided. The nitride semiconductor laser light source has a nitride semiconductor laser chip, a stem for mounting the laser chip thereon, and a cap for covering the laser chip. The laser chip is encapsulated in a sealed container composed of the stem and the cap. The method for producing this nitride semiconductor laser light source has a cleaning step of cleaning the surface of the laser chip, the stem, or the cap. In the cleaning step, the laser chip, the stem, or the cap is exposed with ozone or an excited oxygen atom, or baked by heat. The method also has, after the cleaning step, a capping step of encapsulating the laser chip in the sealed container composed of the stem and the cap. During the capping step, the cleaned surface of the laser chip, the stem, or the cap is kept clean. This method provides a long-life nitride semiconductor laser light source the light emission intensity of which is not easily reduced after a long period of use.

    摘要翻译: 提供一种生产氮化物半导体激光光源的方法。 氮化物半导体激光光源具有氮化物半导体激光器芯片,用于在其上安装激光器芯片的杆和用于覆盖激光器芯片的盖。 激光芯片被封装在由杆和盖组成的密封容器中。 用于制造该氮化物半导体激光光源的方法具有清洁激光芯片,杆或盖的表面的清洁步骤。 在清洁步骤中,激光芯片,阀杆或盖子暴露于臭氧或激发氧原子,或通过加热进行烘烤。 该方法在清洁步骤之后还具有将激光芯片封装在由杆和盖组成的密封容器中的封盖步骤。 在封盖步骤中,激光芯片,阀杆或盖子的清洁表面保持清洁。 该方法提供了长期使用后其发光强度不容易降低的长寿命氮化物半导体激光光源。

    Method for producing nitride semiconductor laser light source and apparatus for producing nitride semiconductor laser light source
    6.
    发明授权
    Method for producing nitride semiconductor laser light source and apparatus for producing nitride semiconductor laser light source 有权
    氮化物半导体激光光源的制造方法及氮化物半导体激光光源的制造装置

    公开(公告)号:US07833834B2

    公开(公告)日:2010-11-16

    申请号:US11237946

    申请日:2005-09-29

    IPC分类号: H01L21/00

    摘要: A method for producing a nitride semiconductor laser light source is provided. The nitride semiconductor laser light source has a nitride semiconductor laser chip, a stem for mounting the laser chip thereon, and a cap for covering the laser chip. The laser chip is encapsulated in a sealed container composed of the stem and the cap. The method for producing this nitride semiconductor laser light source has a cleaning step of cleaning the surface of the laser chip, the stem, or the cap. In the cleaning step, the laser chip, the stem, or the cap is exposed with ozone or an excited oxygen atom, or baked by heat. The method also has, after the cleaning step, a capping step of encapsulating the laser chip in the sealed container composed of the stem and the cap. During the capping step, the cleaned surface of the laser chip, the stem, or the cap is kept clean. This method provides a long-life nitride semiconductor laser light source the light emission intensity of which is not easily reduced after a long period of use.

    摘要翻译: 提供一种生产氮化物半导体激光光源的方法。 氮化物半导体激光光源具有氮化物半导体激光器芯片,用于在其上安装激光器芯片的杆和用于覆盖激光器芯片的盖。 激光芯片被封装在由杆和盖组成的密封容器中。 用于制造该氮化物半导体激光光源的方法具有清洁激光芯片,杆或盖的表面的清洁步骤。 在清洁步骤中,激光芯片,阀杆或盖子暴露于臭氧或激发氧原子,或通过加热进行烘烤。 该方法在清洁步骤之后还具有将激光芯片封装在由杆和盖组成的密封容器中的封盖步骤。 在封盖步骤中,激光芯片,阀杆或盖子的清洁表面保持清洁。 该方法提供了长期使用后其发光强度不容易降低的长寿命氮化物半导体激光光源。

    Nitride semiconductor laser device
    7.
    发明授权
    Nitride semiconductor laser device 有权
    氮化物半导体激光器件

    公开(公告)号:US07573924B2

    公开(公告)日:2009-08-11

    申请号:US11127083

    申请日:2005-05-12

    IPC分类号: H01S5/00 H01S3/04 H01S3/08

    摘要: A nitride semiconductor laser device includes a nitride semiconductor laser element having a resonator end surface and capable of emitting light with a wavelength of at most 420 nm, a heat sink joined to the nitride semiconductor laser element, a stem with the heat sink mounted thereon, and a light detecting element mounted on the stem for detecting a laser beam from the nitride semiconductor laser element. The nitride semiconductor laser element, the heat sink and the light detecting element are enclosed within a cap that is joined to the stem, and an atmosphere within the cap has a dew point of at most −30° C. and an oxygen concentration of at most 100 ppm.

    摘要翻译: 氮化物半导体激光器件包括具有谐振器端面并能够发射波长最多为420nm的光的氮化物半导体激光元件,连接到氮化物半导体激光元件的散热片,安装有散热片的杆, 以及安装在所述杆上的光检测元件,用于检测来自所述氮化物半导体激光元件的激光束。 氮化物半导体激光元件,散热器和光检测元件被封闭在与杆接合的盖内,盖内的气氛的露点至多为-30℃,氧浓度为 最多100 ppm。

    Method for producing nitride semiconductor laser light source and apparatus for producing nitride semiconductor laser light source
    8.
    发明申请
    Method for producing nitride semiconductor laser light source and apparatus for producing nitride semiconductor laser light source 有权
    氮化物半导体激光光源的制造方法及氮化物半导体激光光源的制造装置

    公开(公告)号:US20060068516A1

    公开(公告)日:2006-03-30

    申请号:US11237946

    申请日:2005-09-29

    IPC分类号: H01L21/00 B29C65/00

    摘要: A method for producing a nitride semiconductor laser light source is provided. The nitride semiconductor laser light source has a nitride semiconductor laser chip, a stem for mounting the laser chip thereon, and a cap for covering the laser chip. The laser chip is encapsulated in a sealed container composed of the stem and the cap. The method for producing this nitride semiconductor laser light source has a cleaning step of cleaning the surface of the laser chip, the stem, or the cap. In the cleaning step, the laser chip, the stem, or the cap is exposed with ozone or an excited oxygen atom, or baked by heat. The method also has, after the cleaning step, a capping step of encapsulating the laser chip in the sealed container composed of the stem and the cap. During the capping step, the cleaned surface of the laser chip, the stem, or the, cap is kept clean. This method provides a long-life nitride semiconductor laser light source the light emission intensity of which is not easily reduced after a long period of use.

    摘要翻译: 提供一种生产氮化物半导体激光光源的方法。 氮化物半导体激光光源具有氮化物半导体激光器芯片,用于在其上安装激光器芯片的杆和用于覆盖激光器芯片的盖。 激光芯片被封装在由杆和盖组成的密封容器中。 用于制造该氮化物半导体激光光源的方法具有清洁激光芯片,杆或盖的表面的清洁步骤。 在清洁步骤中,激光芯片,阀杆或盖子暴露于臭氧或激发氧原子,或通过加热进行烘烤。 该方法在清洁步骤之后还具有将激光芯片封装在由杆和盖组成的密封容器中的封盖步骤。 在封盖步骤中,激光芯片,杆或盖的清洁表面保持清洁。 该方法提供了长期使用后其发光强度不容易降低的长寿命氮化物半导体激光光源。

    Nitride semiconductor laser device
    9.
    发明申请
    Nitride semiconductor laser device 有权
    氮化物半导体激光器件

    公开(公告)号:US20050265413A1

    公开(公告)日:2005-12-01

    申请号:US11127083

    申请日:2005-05-12

    摘要: A nitride semiconductor laser device includes a nitride semiconductor laser element having a resonator end surface and capable of emitting light with a wavelength of at most 420 nm, a heat sink joined to the nitride semiconductor laser element, a stem with the heat sink mounted thereon, and a light detecting element mounted on the stem for detecting a laser beam from the nitride semiconductor laser element. The nitride semiconductor laser element, the heat sink and the light detecting element are enclosed within a cap that is joined to the stem, and an atmosphere within the cap has a dew point of at most −30° C. and an oxygen concentration of at most 100 ppm.

    摘要翻译: 氮化物半导体激光器件包括具有谐振器端面并能够发射波长最多为420nm的光的氮化物半导体激光元件,连接到氮化物半导体激光元件的散热片,安装有散热片的杆, 以及安装在所述杆上的光检测元件,用于检测来自所述氮化物半导体激光元件的激光束。 氮化物半导体激光元件,散热器和光检测元件被封闭在与杆接合的盖内,盖内的气氛的露点至多为-30℃,氧浓度为 最多100 ppm。