公开(公告)号：US20050100253A1

公开(公告)日：2005-05-12

申请号：US10821373

申请日：2004-04-09

申请人： Kuo-Chun Chang ,  Jenn-Shin Hwang ,  George Lee ,  Sen-Nan Lee

发明人： Kuo-Chun Chang ,  Jenn-Shin Hwang ,  George Lee ,  Sen-Nan Lee

IPC分类号： F16M5/00 ,  E04H9/02 ,  F16F15/02 ,  F16F15/04 ,  H05K5/02 ,  F16C41/00

CPC分类号： F16F15/02 ,  E04H9/023 ,  H05K5/0234 ,  H05K7/1495

摘要： A seismic isolation bearing assembly includes a frame unit including upper and lower frames and defining a plurality of upper and lower sub-frames, and a plurality of bearing units, each of which is mounted in a mounting cell defined by a respective one of the upper sub-frames and a respective one of the lower sub-frames, and each of which includes spaced apart upper and lower load plates and a bearing interposed between and in sliding contact with the upper and lower load plates. The upper load plate is secured to the respective one of the upper sub-frames. The lower load plate is secured to the respective one of the lower sub-frames.

公开(公告)号：US06955467B2

公开(公告)日：2005-10-18

申请号：US10821373

申请日：2004-04-09

申请人： Kuo-Chun Chang ,  Jenn-Shin Hwang ,  George C. Lee ,  Sen-Nan Lee

发明人： Kuo-Chun Chang ,  Jenn-Shin Hwang ,  George C. Lee ,  Sen-Nan Lee

IPC分类号： F16M5/00 ,  E04H9/02 ,  F16F15/02 ,  F16F15/04 ,  H05K5/02 ,  F16C21/00

CPC分类号： F16F15/02 ,  E04H9/023 ,  H05K5/0234 ,  H05K7/1495

摘要： A seismic isolation bearing assembly includes a frame unit including upper and lower frames and defining a plurality of upper and lower sub-frames, and a plurality of bearing units, each of which is mounted in a mounting cell defined by a respective one of the upper sub-frames and a respective one of the lower sub-frames, and each of which includes spaced apart upper and lower load plates and a bearing interposed between and in sliding contact with the upper and lower load plates. The upper load plate is secured to the respective one of the upper sub-frames. The lower load plate is secured to the respective one of the lower sub-frames.

摘要翻译： 隔震轴承组件包括框架单元，该框架单元包括上框架和下框架并且限定多个上下子框架，以及多个轴承单元，每个轴承单元安装在由上部 子框架和下部子框架中的相应一个，并且每个子框架包括间隔开的上部和下部负载板以及插入在上部和下部负载板之间并与上部和下部负载板滑动接触的轴承。 上装载板被固定到相应的一个上子框架上。 下负载板固定到相应的一个下子框架。

公开(公告)号：US20060048462A1

公开(公告)日：2006-03-09

申请号：US11186873

申请日：2005-07-22

申请人： Chih-Hung Huang ,  Sen-Nan Lee ,  Kuo-Chun Chang

发明人： Chih-Hung Huang ,  Sen-Nan Lee ,  Kuo-Chun Chang

IPC分类号： E04H9/02

CPC分类号： E04H9/023

摘要： The present invention relates to an aseismatic support unit, and more particularly to an aseismatic support unit capable of being easily and fitly in-situ assembled to become an aseismatic system. The aseismatic support unit is mounted between a base and a loaded article, comprising a lower support member, an upper support member and a plurality of aseismatic units mounted therebetween. Each of the aseismatic units includes a lower carry member having an upward carry surface, an upper carry member having a downward carry surface and a support roller mounted therebetween. When an earthquake happens, shakes are transmitted from the base. Then, the aseismatic support unit of the present invention diminishes the extent of the shakes of the load article placed over the upper support member and thus prevent the loaded article from overturn and damage as a result of the earthquake.

摘要翻译： 本发明涉及一种抗震支撑单元，更具体地涉及一种能够容易且适合地组装成抗震系统的抗震支撑单元。 抗震支撑单元安装在基座和装载物品之间，包括下支撑构件，上支撑构件和安装在其间的多个抗震单元。 每个抗震单元包括具有向上携带表面的下承载构件，具有向下承载表面的上承载构件和安装在其间的支撑辊。 发生地震时，震动从基地传出。 然后，本发明的抗震支撑单元减小了放置在上支撑构件上的载物的振动程度，从而防止装载的物品由于地震而被翻倒和损坏。

公开(公告)号：US06101656A

公开(公告)日：2000-08-15

申请号：US200174

申请日：1998-11-25

申请人： Sen-Nan Lee ,  Ying-Chih Liu

发明人： Sen-Nan Lee ,  Ying-Chih Liu

IPC分类号： B08B1/00 ,  H01L21/00 ,  B08B3/00 ,  B08B11/00

CPC分类号： H01L21/67028 ,  B08B1/008

摘要： A wafer-cleaning device comprises a looped belt forming an enclosed region and a pair of rollers. Each roller occupies one end inside the enclosed region. Furthermore, a supporting structure located inside the enclosed region not only supports the rollers, but also maintains some tension on the belt. Thus, one portion of the belt is flat. The supporting structure is capable of supporting a wafer as well. In addition, a wafer-rotating device can be installed next to the edge of a wafer so that the wafer can rotate in a prescribed direction while the wafer surface is cleaned.

摘要翻译： 晶片清洁装置包括形成封闭区域和一对辊的环形带。 每个辊子在封闭区域内占据一端。 此外，位于封闭区域内的支撑结构不仅支撑辊，而且在带上保持一定的张力。 因此，皮带的一部分是平的。 支撑结构也能够支撑晶片。 此外，可以在晶片的边缘旁边安装晶片旋转装置，使得晶片可以在晶片表面被清洁时沿规定方向旋转。

公开(公告)号：US6022800A

公开(公告)日：2000-02-08

申请号：US69711

申请日：1998-04-29

申请人： Wen-Yu Ho ,  Sen-Nan Lee ,  Sung Chun Hsieh ,  Hui-Lun Chen

发明人： Wen-Yu Ho ,  Sen-Nan Lee ,  Sung Chun Hsieh ,  Hui-Lun Chen

IPC分类号： H01L21/768 ,  H01L21/4763

CPC分类号： H01L21/76844 ,  H01L21/76843

摘要： A method of reducing tungsten plug loss in processes for fabrication for silicon-based semiconductor devices that include a tungsten plug in a high aspect ratio contact hole. The invention provides a barrier layer prepared by first forming a conformal layer of titanium nitride by chemical vapor deposition. Afterward, another film of titanium nitride is supplied by plasma vapor deposition. The barrier layer comprises at least these two films, and tungsten is then deposited to at least fill the high aspect ratio film-coated contact hole. Upon removal of excess tungsten as by wet etch back, the tungsten plug remains essentially intact, and any plug loss is insignificant in comparison with the prior art.

摘要翻译： 一种在包括高长宽比接触孔中的钨插件的硅基半导体器件的制造工艺中降低钨插塞损耗的方法。 本发明提供了通过化学气相沉积首先形成氮化钛保形层而制备的阻挡层。 之后，通过等离子体气相沉积提供另一氮化钛膜。 阻挡层至少包括这两个膜，然后沉积钨至少填充高纵横比的薄膜接触孔。 在通过湿式回蚀去除多余的钨之后，钨塞基本上保持完整，并且与现有技术相比，任何塞子损失是不显着的。

公开(公告)号：US6116991A

公开(公告)日：2000-09-12

申请号：US200364

申请日：1998-11-25

申请人： Ying-Chih Liu ,  Sen-Nan Lee

发明人： Ying-Chih Liu ,  Sen-Nan Lee

IPC分类号： B24B37/16 ,  B24B37/24 ,  B24D9/08 ,  B24D11/04 ,  B24B1/00

CPC分类号： B24B37/16 ,  B24B37/24 ,  B24B57/02

摘要： A chemical-mechanical polishing station comprises a polishing table that has concentric rings. The rings are separated from each other by a small gap and all rings are capable of rotating in the same prescribed direction. A polishing pad is mounted on top of each ring, and a delivery tube is positioned at a distance above the polishing pads. The delivery tube further includes a tube handle and a tube surface, and the tube surface has a plurality of holes drilled in it for delivering slurry to the polishing pad surface. Each concentric ring of the polishing table is able to rotate such that all the rings have the same tangential polishing speed. Therefore a wafer surface can be more uniformly polished. Moreover, material having different density, roughness and chemical composition can be chosen to fabricate the polishing pads so that an even better polishing result can be obtained.

摘要翻译： 化学机械抛光站包括具有同心环的抛光台。 环通过小间隙彼此分离，并且所有环能够以相同的规定方向旋转。 抛光垫安装在每个环的顶部上，并且输送管位于抛光垫上方一段距离处。 输送管还包括管手柄和管表面，并且管表面具有在其中钻出的多个孔，用于将浆料输送到抛光垫表面。 抛光台的每个同心环能够旋转，使得所有的环具有相同的切向抛光速度。 因此，可以更均匀地抛光晶片表面。 此外，可以选择具有不同密度，粗糙度和化学成分的材料来制造抛光垫，从而可以获得更好的抛光结果。

公开(公告)号：US06277751B1

公开(公告)日：2001-08-21

申请号：US09247749

申请日：1999-02-09

申请人： Pao-Kang Niu ,  Chang-Sheng Lee ,  Bih-Tiao Lin ,  Sen-Nan Lee

发明人： Pao-Kang Niu ,  Chang-Sheng Lee ,  Bih-Tiao Lin ,  Sen-Nan Lee

IPC分类号： H01L21302

CPC分类号： H01L21/31053

摘要： A method for planarizing a semiconductor wafer. An insulation layer is formed over the wafer. A spin-on-glass layer is coated over the insulation layer. Subsequently, the spin-on-glass layer is baked to smooth out its upper surface. A chemical-mechanical polishing process is carried out to planarize the insulation layer. The method eliminates recess cavities in the more loosely packed device region of the insulation layer after a planarization process.

摘要翻译： 一种用于平面化半导体晶片的方法。 在晶片上形成绝缘层。 在绝缘层上涂覆旋涂玻璃层。 随后，将旋涂玻璃层烘烤以平滑其上表面。 进行化学机械抛光工艺以使绝缘层平坦化。 在平坦化处理之后，该方法消除了绝缘层更松散的装置区域中的凹陷腔。