摘要:
A method of determining the location information of a plurality of wheels mounted on a vehicle by obtaining a relationship between the lateral location of a wheel and the polarity of a transverse acceleration transmitted by an accelerometer of a wheel in response to a lateral turn of the vehicle in a direction of a lateral side of the vehicle and determining the lateral location of a wheel with reference to the polarity of the transverse acceleration signal transmitted by the accelerometer of the wheel upon the vehicle undergoing a lateral turn.
摘要:
A method of determining the location information of a plurality of wheels mounted on a vehicle by obtaining a relationship between the lateral location of a wheel and the polarity of a transverse acceleration transmitted by an accelerometer of a wheel in response to a lateral turn of the vehicle in a direction of a lateral side of the vehicle and determining the lateral location of a wheel with reference to the polarity of the transverse acceleration signal transmitted by the accelerometer of the wheel upon the vehicle undergoing a lateral turn.
摘要:
A electronic circuit package having a flexible substrate with metals layers on one or more of its surfaces forming a wiring pattern and/or surface mount bonding pads. Passive electronic components are integrated onto component packages that are mounted to the flexible substrate and electrically connected with the wiring pattern or bonding pad. An active electronic device is mounted on the flexible substrate or bonding pad.
摘要:
An electronic circuit package has a thin-film circuit integrated with the ceramic substrate. The thin-film circuit includes at least two passive circuit elements joined by an integrated electrical interconnect. At least one active power electronic component mounted on the ceramic substrate and is electrically connected with the integrated thin-film circuit.