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公开(公告)号：US20070291247A1
公开(公告)日：2007-12-20
申请号：US11804469
申请日：2007-05-18
申请人： Kyoung-Ho Kim , Jae-Hyun Sung
发明人： Kyoung-Ho Kim , Jae-Hyun Sung
IPC分类号： G03B27/72
CPC分类号： G03B27/54 , G03B27/42 , G03F7/2028
摘要： In an apparatus for performing an edge exposure process on an edge portion of a photoresist film that is formed on a semiconductor wafer, light provided from a light source is formed to have a ring shape corresponding to a shape of an edge portion of the wafer by an optical unit. The ring-shaped light is irradiated onto the edge portion of the wafer through a ring lens. Thus, the light efficiency is improved. Further, since there is no need to rotate the wafer, a side surface profile of the photoresist film is improved.
摘要翻译： 在对形成在半导体晶片上的光致抗蚀剂膜的边缘部分进行边缘曝光处理的装置中，从光源提供的光由具有与晶片的边缘部分形状对应的环状形成， 光学单元。 环状光通过环形透镜照射在晶片的边缘部分上。 因此，光效率提高。 此外，由于不需要旋转晶片，光致抗蚀剂膜的侧表面轮廓得到改善。
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2.发明授权Apparatus for supporting a wafer, apparatus for exposing a wafer and method of supporting a wafer 有权用于支撑晶片的装置，用于暴露晶片的装置和支撑晶片的方法公开(公告)号：US07864299B2
公开(公告)日：2011-01-04
申请号：US11889871
申请日：2007-08-17
申请人： Jae-Hyun Sung , Jong-Min Kim
发明人： Jae-Hyun Sung , Jong-Min Kim
CPC分类号： G03B27/52 , G03F7/70916 , G03F7/70925
摘要： In an apparatus for supporting a wafer, the apparatus may remove particles thereon. The apparatus may include a conductive support configured to support the wafer, and a power source electrically connected to the conductive support, the power source configured to provide at least one current to the conductive support to remove particles from the conductive support.
摘要翻译： 在用于支撑晶片的装置中，该装置可以去除其上的颗粒。 该装置可以包括被配置为支撑晶片的导电支撑件和电连接到导电支撑件的电源，该电源被配置为向导电支撑件提供至少一个电流以从导电支撑件移除颗粒。
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3.发明申请Apparatus for supporting a wafer, apparatus for exposing a wafer and method of supporting a wafer 有权用于支撑晶片的装置，用于暴露晶片的装置和支撑晶片的方法公开(公告)号：US20080068582A1
公开(公告)日：2008-03-20
申请号：US11889871
申请日：2007-08-17
申请人： Jae-Hyun Sung , Jong-Min Kim
发明人： Jae-Hyun Sung , Jong-Min Kim
IPC分类号： G03B27/60
CPC分类号： G03B27/52 , G03F7/70916 , G03F7/70925
摘要： In an apparatus for supporting a wafer, the apparatus may remove particles thereon. The apparatus may include a conductive support configured to support the wafer, and a power source electrically connected to the conductive support, the power source configured to provide at least one current to the conductive support to remove particles from the conductive support.
摘要翻译： 在用于支撑晶片的装置中，该装置可以去除其上的颗粒。 该装置可以包括被配置为支撑晶片的导电支撑件和电连接到导电支撑件的电源，该电源被配置为向导电支撑件提供至少一个电流以从导电支撑件移除颗粒。
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公开(公告)号：US20060168839A1
公开(公告)日：2006-08-03
申请号：US11327361
申请日：2006-01-09
申请人： Ju-Won Lee , Jae-Hyun Sung , Nak-Hee Seong
发明人： Ju-Won Lee , Jae-Hyun Sung , Nak-Hee Seong
CPC分类号： H01L21/67109
摘要： A layer on a semiconductor substrate is scanned with a stream of heated gas to bake the layer. A baking apparatus includes a stage that supports the semiconductor substrate and a gas injector that expels the stream of the heated gas. The stage and the gas injector are moved relative to one another to scan the substrate with the stream of heated gas and thus, bake the layer that is disposed thereon. Fumes emanating from the layer are removed while the layer is scanned. To this end, the apparatus also includes a vacuum head that is fixed in position relative to the gas injector.
摘要翻译： 用加热气体流扫描半导体衬底上的层以烘烤该层。 烘烤装置包括支撑半导体衬底的台和排出加热气体流的气体注射器。 阶段和气体注入器相对于彼此移动，以加热气体流扫描衬底，从而烘烤设置在其上的层。 在扫描层时，从层中发出的烟雾被去除。 为此，该装置还包括相对于气体喷射器固定在适当位置的真空头。
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