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    Image pickup device and method of manufacturing the same
    2.
    发明申请
    Image pickup device and method of manufacturing the same 有权
    摄像装置及其制造方法

    公开(公告)号：US20080023780A1

    公开(公告)日：2008-01-31

    申请号：US11700067

    申请日：2007-01-31

    申请人： Kyu Dong Jung ,  Woon Bae Kim ,  Min Seog Choi ,  Seung Wan Lee

    发明人： Kyu Dong Jung ,  Woon Bae Kim ,  Min Seog Choi ,  Seung Wan Lee

    IPC分类号： H01L31/0232 ,  H01L21/00

    CPC分类号： H01L27/14618 ,  H01L27/14625 ,  H01L2224/48091 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3025 ,  H01L2924/00014

    摘要： An image pickup device comprises: a sensor substrate having image sensors arranged in its image pickup region in the form of a matrix; an interlayer insulating film layer formed below a bottom of the sensor substrate, the interlayer insulating film layer including wiring layers formed therein to construct an electric circuit, the wiring layer being electrically connected with the image sensors; a support substrate attached on a bottom of the interlayer insulating film layer, the support substrate having contact electrodes formed in via holes; a lens layer formed over the top surface of the sensor substrate to be opposite to the interlayer insulating film layer; and a light-transmitting member formed over the lens layer.

    摘要翻译： 图像拾取装置包括：传感器基板，其具有以矩阵形式布置在其图像拾取区域中的图像传感器; 在所述传感器基板的底部的下方形成的层间绝缘膜层，所述层间绝缘膜层包括形成在其中的布线层，构成电路，所述布线层与所述图像传感器电连接; 支撑衬底，其附接在所述层间绝缘膜层的底部，所述支撑衬底具有形成在通孔中的接触电极; 透镜层，形成在所述传感器基板的顶表面上以与所述层间绝缘膜层相对; 以及形成在透镜层上的透光部件。

    Micro-element package and manufacturing method thereof
    3.
    发明授权
    Micro-element package and manufacturing method thereof 有权
    微元件封装及其制造方法

    公开(公告)号：US07615397B2

    公开(公告)日：2009-11-10

    申请号：US11584486

    申请日：2006-10-23

    申请人： Seung Wan Lee ,  Woon Bae Kim ,  Kyu Dong Jung ,  Min Seog Choi

    发明人： Seung Wan Lee ,  Woon Bae Kim ,  Kyu Dong Jung ,  Min Seog Choi

    IPC分类号： H01L21/00

    CPC分类号： H01L27/14618 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

    摘要： A method of manufacturing a micro-element package which can reduce a manufacturing cost and improve productivity by simplifying its structure and manufacturing process, and also can make contributions to miniaturization and thinness, and the micro-element package are provided. The method of the micro-element package including: providing a substrate having a micro-element on its top surface and a transparent cover having a groove on its bottom surface; attaching the transparent cover on the substrate, wherein the bottom surface of the transparent cover where the groove is formed faces the micro-element; exposing the groove by selectively eliminating the transparent cover; and dicing the substrate along the exposed groove.

    摘要翻译： 通过简化其结构和制造工艺，可以降低制造成本和提高生产率的微元件封装的制造方法，并且还可以对微型化和薄型化做出贡献，并且提供微元件封装。 微元件封装的方法包括：在其顶表面上提供具有微元件的衬底和在其底表面上具有凹槽的透明盖; 将透明盖安装在基板上，其中形成凹槽的透明盖的底表面面向微元件; 通过选择性地去除透明盖露出凹槽; 并且沿着暴露的凹槽切割衬底。

    Image pickup device and method of manufacturing the same
    4.
    发明授权
    Image pickup device and method of manufacturing the same 有权
    摄像装置及其制造方法

    公开(公告)号：US07605404B2

    公开(公告)日：2009-10-20

    申请号：US11700067

    申请日：2007-01-31

    申请人： Kyu Dong Jung ,  Woon Bae Kim ,  Min Seog Choi ,  Seung Wan Lee

    发明人： Kyu Dong Jung ,  Woon Bae Kim ,  Min Seog Choi ,  Seung Wan Lee

    IPC分类号： H01L29/22 ,  H01L29/227 ,  H01L33/00

    CPC分类号： H01L27/14618 ,  H01L27/14625 ,  H01L2224/48091 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3025 ,  H01L2924/00014

    摘要： An image pickup device includes a sensor substrate having image sensors arranged in its image pickup region in the form of a matrix. An interlayer insulating film layer is formed below a bottom of the sensor substrate. The interlayer insulating film layer includes wiring layers to construct an electric circuit. The wiring layer is electrically connected with the image sensors. A support substrate is attached on a bottom of the interlayer insulating film layer. The support substrate has contact electrodes formed in via holes. A lens layer is formed over the top surface of the sensor substrate to be opposite to the interlayer insulating film layer. A light-transmitting member is formed over the lens layer.

    摘要翻译： 图像拾取装置包括具有以矩阵形式布置在其图像拾取区域中的图像传感器的传感器基板。 在传感器基板的底部的下方形成层间绝缘膜层。 层间绝缘膜层包括构成电路的布线层。 布线层与图像传感器电连接。 支撑基板安装在层间绝缘膜层的底部。 支撑基板具有形成在通孔中的接触电极。 在传感器基板的顶表面上形成与层间绝缘膜层相反的透镜层。 在透镜层上形成透光部件。

    Micro-element package module and manufacturing method thereof
    5.
    发明申请
    Micro-element package module and manufacturing method thereof 审中-公开
    微元件封装模块及其制造方法

    公开(公告)号：US20070228403A1

    公开(公告)日：2007-10-04

    申请号：US11585260

    申请日：2006-10-24

    申请人： Min Seog Choi ,  Seung Wan Lee ,  Woon Bae Kim ,  Kyu Dong Jung

    发明人： Min Seog Choi ,  Seung Wan Lee ,  Woon Bae Kim ,  Kyu Dong Jung

    IPC分类号： H01L33/00

    CPC分类号： H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

    摘要： A micro-element package module which can reduce manufacturing costs and can be advantageous for mass production due to simplifying its structure and manufacturing process, and also can facilitate miniaturization and promote thinness, and a method of manufacturing the micro-element package module. The micro-element package module includes: an element substrate having a micro-element on a top surface of the element substrate; a circuit substrate that is provided around the element substrate; and an element housing that is provided above the element substrate and the circuit substrate, and includes a connecting section for electrically connecting the micro-element and the circuit substrate.

    摘要翻译： 一种微元件封装模块，其可以降低制造成本，并且由于简化其结构和制造工艺而可以有利于批量生产，并且还可以促进小型化和促进薄度，以及制造微元件封装模块的方法。 微元件封装模块包括：元件衬底，其在元件衬底的顶表面上具有微元件; 设置在所述元件基板周围的电路基板; 以及设置在元件基板和电路基板上方的元件外壳，并且包括用于电连接微元件和电路基板的连接部。

    Image sensor and method of manufacturing thereof
    6.
    发明授权
    Image sensor and method of manufacturing thereof 有权
    图像传感器及其制造方法

    公开(公告)号：US07616356B2

    公开(公告)日：2009-11-10

    申请号：US11369728

    申请日：2006-03-08

    申请人： Kyu Dong Jung ,  Min Seog Choi ,  Seung Wan Lee ,  Woon Bae Kim

    发明人： Kyu Dong Jung ,  Min Seog Choi ,  Seung Wan Lee ,  Woon Bae Kim

    IPC分类号： H04N1/04 ,  H01L21/00 ,  H01L21/339

    CPC分类号： H01L27/14683 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

    摘要： An image sensor and a method of manufacturing the image sensor, wherein the image sensor can electrically connect a light receiving portion and a printed circuit board (PCB) including circuits by forming holes and filling the holes with a conductive material, without using a wire for the electrical connection between the light receiving portion and the PCB. The light receiving portion converts lights into electrical signals and the PCB electrically processes signals. That is, since a distance for a wire between a sealing structure and because a filter is unnecessary, a thickness may be reduced. Also, since a space for wire bonding is unnecessary on the outside of an image sensor, a fill factor may increase. Also, since a process that may cause contaminates is removed, average yield may increase and production cost may decrease. The manufacturing productivity may be improved.

    摘要翻译： 一种图像传感器和图像传感器的制造方法，其中图像传感器可以通过形成孔并且用导电材料填充孔来电连接包含电路的光接收部分和印刷电路板（PCB），而不使用用于 光接收部分和PCB之间的电连接。 光接收部分将光转换为电信号，并且PCB电处理信号。 也就是说，由于密封结构和因为过滤器之间的电线的距离是不必要的，所以可以减小厚度。 此外，由于在图像传感器的外部不需要用于引线接合的空间，所以填充因子可能增加。 此外，由于可能导致污染物的过程被去除，所以平均产量可能增加并且生产成本可能降低。 可以提高制造生产率。

    Optical lens and method of manufacturing the same
    7.
    发明授权
    Optical lens and method of manufacturing the same 失效
    光学透镜及其制造方法

    公开(公告)号：US07580195B2

    公开(公告)日：2009-08-25

    申请号：US11723875

    申请日：2007-03-22

    申请人： Seung Tae Choi ,  Seung Wan Lee ,  Woon Bae Kim ,  Min Seog Choi ,  Eun Sung Lee ,  Kyu Dong Jung

    发明人： Seung Tae Choi ,  Seung Wan Lee ,  Woon Bae Kim ,  Min Seog Choi ,  Eun Sung Lee ,  Kyu Dong Jung

    IPC分类号： G02B1/06

    CPC分类号： G02B3/14 ,  G02B7/026

    摘要： An optical lens is provided. The optical lens provides miniaturization and thin size, and reduces the cost and improves productivity by simplifying the structure and manufacturing process. The optical lens includes a light-transmitting substrate with a lens chamber and a fluidic chamber that are connected with each other. The optical lens also includes a light-transmitting elastic film which seals the lens chamber, a buffer elastic film which seals the fluidic chamber, and an actuator on the buffer elastic film which corresponds to the fluidic chamber, and varies the volume of the fluidic chamber to vary a pressure acting on the light-transmitting elastic film.

    摘要翻译： 提供了一种光学透镜。 光学透镜提供小型化和薄型化，并且通过简化结构和制造工艺来降低成本并提高生产率。 光学透镜包括具有彼此连接的透镜室和流体室的透光基板。 光学透镜还包括密封透镜室的透光弹性膜，密封流体室的缓冲弹性膜和对应于流体室的缓冲弹性膜上的致动器，并且改变流体室的体积 以改变作用在透光弹性膜上的压力。

    Optical lens and method of manufacturing the same
    8.
    发明申请
    Optical lens and method of manufacturing the same 失效
    光学透镜及其制造方法

    公开(公告)号：US20080112059A1

    公开(公告)日：2008-05-15

    申请号：US11723875

    申请日：2007-03-22

    申请人： Seung Tae Choi ,  Seung Wan Lee ,  Woon Bae Kim ,  Min Seog Choi ,  Eun Sung Lee ,  Kyu Dong Jung

    发明人： Seung Tae Choi ,  Seung Wan Lee ,  Woon Bae Kim ,  Min Seog Choi ,  Eun Sung Lee ,  Kyu Dong Jung

    IPC分类号： G02B3/14

    CPC分类号： G02B3/14 ,  G02B7/026

    摘要： An optical lens is provided. The optical lens provides miniaturization and thin size, and reduces the cost and improves productivity by simplifying the structure and manufacturing process. The optical lens includes a light-transmitting substrate with a lens chamber and a fluidic chamber that are connected with each other. The optical lens also includes a light-transmitting elastic film which seals the lens chamber, a buffer elastic film which seals the fluidic chamber, and an actuator on the buffer elastic film which corresponds to the fluidic chamber, and varies the volume of the fluidic chamber to vary a pressure acting on the light-transmitting elastic film.

    摘要翻译： 提供了一种光学透镜。 光学透镜提供小型化和薄型化，并且通过简化结构和制造工艺来降低成本并提高生产率。 光学透镜包括具有彼此连接的透镜室和流体室的透光基板。 光学透镜还包括密封透镜室的透光弹性膜，密封流体室的缓冲弹性膜和对应于流体室的缓冲弹性膜上的致动器，并且改变流体室的体积 以改变作用在透光弹性膜上的压力。

    Micro-element package and manufacturing method thereof
    10.
    发明申请
    Micro-element package and manufacturing method thereof 有权
    微元件封装及其制造方法

    公开(公告)号：US20070210399A1

    公开(公告)日：2007-09-13

    申请号：US11584486

    申请日：2006-10-23

    申请人： Seung Wan Lee ,  Woon Bae Kim ,  Kyu Dong Jung ,  Min Seog Choi

    发明人： Seung Wan Lee ,  Woon Bae Kim ,  Kyu Dong Jung ,  Min Seog Choi

    IPC分类号： H01L31/0203 ,  H01L21/00

    CPC分类号： H01L27/14618 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

    摘要： A method of manufacturing a micro-element package which can reduce a manufacturing cost and improve productivity by simplifying its structure and manufacturing process, and also can make contributions to miniaturization and thinness, and the micro-element package are provided. The method of the micro-element package including: providing a substrate having a micro-element on its top surface and a transparent cover having a groove on its bottom surface; attaching the transparent cover on the substrate, wherein the bottom surface of the transparent cover where the groove is formed faces the micro-element; exposing the groove by selectively eliminating the transparent cover; and dicing the substrate along the exposed groove.

    摘要翻译： 通过简化其结构和制造工艺，可以降低制造成本和提高生产率的微元件封装的制造方法，并且还可以对微型化和薄型化做出贡献，并且提供微元件封装。 微元件封装的方法包括：在其顶表面上提供具有微元件的衬底和在其底表面上具有凹槽的透明盖; 将透明盖安装在基板上，其中形成凹槽的透明盖的底表面面向微元件; 通过选择性地去除透明盖露出凹槽; 并且沿着暴露的凹槽切割衬底。