公开(公告)号：US5581195A

公开(公告)日：1996-12-03

申请号：US345447

申请日：1994-11-21

申请人： Kyu J. Lee ,  Hyeon J. Jeong

发明人： Kyu J. Lee ,  Hyeon J. Jeong

IPC分类号： G01R31/26 ,  G01R1/04 ,  G01R31/28 ,  H01L21/326 ,  H01L21/66 ,  G01R31/02

CPC分类号： G01R1/0483 ,  G01R31/2863

摘要： An appartus for testing bare semiconductor chips, especially for burn-in testing, includes a chip holding socket which comprises a substrate portion having at least one pair of opposing grooves formed along respective edges thereof. A pair of resilient elongate members are inserted into the grooves, and act to hold a respective bare chip in the holding socket. Preferably, a plurality of such holding sockets are mounted and electrically connected to a main test board, by which test signals are provided to test the bare semiconductor chips. A method for manufacturing such a testing apparatus is also disclosed herein.

摘要翻译： 用于测试裸露的半导体芯片的特别用于老化测试的配件包括：芯片保持插座，其包括具有沿其相应边缘形成的至少一对相对的沟槽的衬底部分。 一对弹性细长构件插入槽中，并且用于将相应的裸芯片保持在保持插座中。 优选地，多个这样的保持插座安装并电连接到主测试板，由此提供测试信号以测试裸半导体芯片。 本文还公开了一种用于制造这种测试装置的方法。