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公开(公告)号:US20110155426A1
公开(公告)日:2011-06-30
申请号:US12974763
申请日:2010-12-21
申请人: Kyung-Wan PARK , Shi-Yun Cho , Byung-Jik Kim , Ho-Seong Seo , Youn-Ho Chol , Yu-Su Kim , Seok-Myong Kang , Ji-Hyun Jung
发明人: Kyung-Wan PARK , Shi-Yun Cho , Byung-Jik Kim , Ho-Seong Seo , Youn-Ho Chol , Yu-Su Kim , Seok-Myong Kang , Ji-Hyun Jung
摘要: An embedded circuit board is disclosed including a first copper clad laminate formed with a plurality of cavities and including a plurality of chips having different thicknesses embedded in the cavities, a second copper clad laminate provided in the cavities to allow the first copper clad laminate to level with the chips; and a resin coated copper foil provided on upper surfaces of the first and second copper clad laminates.
摘要翻译: 公开了一种嵌入式电路板,其包括形成有多个空腔的第一覆铜层压板,并且包括嵌入空腔中的具有不同厚度的多个芯片,设置在该空腔中的第二覆铜层压板,以使第一覆铜层压板达到 与芯片; 以及设置在第一和第二覆铜层压板的上表面上的树脂涂覆铜箔。