公开(公告)号：US5476548A

公开(公告)日：1995-12-19

申请号：US263617

申请日：1994-06-20

申请人： Lawrence C. Lei ,  Cissy S. Leung ,  Eric A. Englhardt ,  Ashok K. Sinha

发明人： Lawrence C. Lei ,  Cissy S. Leung ,  Eric A. Englhardt ,  Ashok K. Sinha

IPC分类号： C23C16/44 ,  C23C16/455 ,  C23C16/458 ,  C30B25/14 ,  H01L21/205 ,  H01L21/285 ,  H01L21/683 ,  C23C16/00 ,  B05C13/00 ,  H01L21/00

CPC分类号： C23C16/45521 ,  C23C16/4585 ,  C30B25/14 ,  H01L21/6838

摘要： A substrate processing apparatus for processing a substrate having a peripheral edge, an upper surface for processing and a lower surface lying on a support. The apparatus includes a processing chamber which houses the substrate support, in the form of a heater pedestal including a substrate receiving surface for receiving the lower surface of the substrate. A circumscribing shadow ring is located around the pedestal to cover peripheral edge portion of the substrate. The shadow ring also defines a cavity, between itself and the pedestal, at the peripheral edge of the substrate. In operation, the chamber receives processing gas at a first pressure and purge gas is introduced into the cavity, between the ring and the pedestal, at a second pressure which is greater than the first pressure. Fluid conduits are provided to enhance the flow of the purge gas away from the peripheral edge of the substrate.

摘要翻译： 一种基板处理装置，用于处理具有外围边缘的基板，用于加工的上表面和位于支撑件上的下表面。 该设备包括处理室，该处理室以加热器底座的形式容纳衬底支撑件，该加热器基座包括用于接收衬底的下表面的衬底接收表面。 位于基座周围的外接阴影环覆盖基板的周边部分。 阴影环还在基板的周边边缘处限定了在其自身与基座之间的空腔。 在操作中，室以第一压力接收处理气体，并且净化气体以大于第一压力的第二压力被引入空腔中，在环和基座之间。 提供流体导管以增强净化气体远离衬底的周边边缘的流动。

公开(公告)号：US5810936A

公开(公告)日：1998-09-22

申请号：US662723

申请日：1996-06-10

申请人： Cissy S. Leung ,  Lawrence Chung-Lai Lei ,  Sasson Somekh

发明人： Cissy S. Leung ,  Lawrence Chung-Lai Lei ,  Sasson Somekh

IPC分类号： C30B33/12 ,  C23C16/44 ,  C23F4/00 ,  H01J37/32 ,  H01L21/00 ,  H01L21/205 ,  H01L21/302 ,  H01L21/304 ,  H01L21/3065 ,  C23C16/00 ,  C23F1/02

CPC分类号： H01L21/67028 ,  C23C16/4405 ,  H01J37/32862 ,  H01J2237/022 ,  Y10S438/905

摘要： A apparatus for removing deposits from within a space at least partially delimited by a surface which is subject to attack from a plasma including a surface cover comprising a material which is inert to the plasma.

摘要翻译： 一种用于从至少部分地由受等离子体侵蚀的表面限定的空间内去除沉积物的装置，包括包含对等离子体是惰性的材料的表面覆盖物。

公开(公告)号：US5705080A

公开(公告)日：1998-01-06

申请号：US271134

申请日：1994-07-06

申请人： Cissy S. Leung ,  Lawrence Chung-Lai Lei ,  Sasson Somekh

发明人： Cissy S. Leung ,  Lawrence Chung-Lai Lei ,  Sasson Somekh

IPC分类号： C30B33/12 ,  C23C16/44 ,  C23F4/00 ,  H01J37/32 ,  H01L21/00 ,  H01L21/205 ,  H01L21/302 ,  H01L21/304 ,  H01L21/3065

CPC分类号： H01L21/67028 ,  C23C16/4405 ,  H01J37/32862 ,  H01J2237/022 ,  Y10S438/905

摘要： A process for removing deposits from within a space at least partially delimited by a surface which is subject to attack from a plasma includes the steps of placing on the surface a cover comprising a material which is inert to the plasma, and then removing the deposits.

摘要翻译： 用于从至少部分地由等离子体侵蚀的表面界定的空间内去除沉积物的方法包括以下步骤：在表面上放置包含对等离子体是惰性的材料的盖子，然后去除沉积物。