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公开(公告)号：US20080285136A1
公开(公告)日：2008-11-20
申请号：US12140676
申请日：2008-06-17
申请人： Lawrence Jacobowitz , Stephen L. Buchwalter , Casimer DeCusatis , Peter A. Gruber , Da-Yuan Shih
发明人： Lawrence Jacobowitz , Stephen L. Buchwalter , Casimer DeCusatis , Peter A. Gruber , Da-Yuan Shih
IPC分类号： G02B27/10
CPC分类号： H01L27/14685 , B29D11/00365 , B29D11/00461 , B82Y30/00 , G02B3/0018 , G02B3/0056 , G02F1/137 , G02F1/29 , H01L27/14627 , H01L31/02327 , H01L33/58
摘要： A wafer-scale apparatus and method is described for the automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on semiconductor and other image display devices, backplanes, optoelectronic boards, and integrated optical systems. In an ordered fabrication sequence, a mold plate comprised of optically designed cavities is formed by reactive ion etching or alternative processes, optionally coated with a release material layer and filled with optically specified materials by an automated fluid-injection and defect-inspection subsystem. Optical alignment fiducials guide the disclosed transfer and attachment processes to achieve specified tolerances between the microoptic elements and corresponding optoelectronic devices and circuits. The present invention applies to spectral filters, waveguides, fiber-optic mode-transformers, diffraction gratings, refractive lenses, diffractive lens/Fresnel zone plates, reflectors, and to combinations of elements and devices, including microelectromechanical systems (MEMS) and liquid crystal device (LCD) matrices for adaptive, tunable elements. Preparation of interfacial layer properties and attachment process embodiments are taught.
摘要翻译： 描述了用于在半导体和其他图像显示装置，背板，光电板和集成光学系统上形成，对准和附着微量元件的二维阵列的自动化的晶片级装置和方法。 在有序的制造顺序中，由光学设计的空腔构成的模具板通过反应离子蚀刻或可选的工艺形成，任选地涂覆有释放材料层，并通过自动化流体注入和缺陷检查子系统填充光学特定的材料。 光学校准基准指导所公开的转移和附着过程以实现微光学元件与对应的光电器件和电路之间的特定公差。 本发明适用于光谱滤波器，波导管，光纤模式变压器，衍射光栅，折射透镜，衍射透镜/菲涅耳带片，反射器以及元件和器件的组合，包括微机电系统（MEMS）和液晶器件 （LCD）矩阵，用于自适应，可调元素。 教导界面层性质和附着工艺实施例的制备。
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公开(公告)号：US07399421B2
公开(公告)日：2008-07-15
申请号：US11195147
申请日：2005-08-02
申请人： Lawrence Jacobowitz , Stephen L. Buchwalter , Casimer DeCusatis , Peter A. Gruber , Da-Yuan Shih
发明人： Lawrence Jacobowitz , Stephen L. Buchwalter , Casimer DeCusatis , Peter A. Gruber , Da-Yuan Shih
IPC分类号： B29D11/00
CPC分类号： H01L27/14685 , B29D11/00365 , B29D11/00461 , B82Y30/00 , G02B3/0018 , G02B3/0056 , G02F1/137 , G02F1/29 , H01L27/14627 , H01L31/02327 , H01L33/58
摘要： A wafer-scale apparatus and method is described for the automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on semiconductor and other image display devices, backplanes, optoelectronic boards, and integrated optical systems. In an ordered fabrication sequence, a mold plate comprised of optically designed cavities is formed by reactive ion etching or alternative processes, optionally coated with a release material layer and filled with optically specified materials by an automated fluid-injection and defect-inspection subsystem. Optical alignment fiducials guide the disclosed transfer and attachment processes to achieve specified tolerances between the microoptic elements and corresponding optoelectronic devices and circuits. The present invention applies to spectral filters, waveguides, fiber-optic mode-transformers, diffraction gratings, refractive lenses, diffractive lens/Fresnel zone plates, reflectors, and to combinations of elements and devices, including microelectromechanical systems (MEMS) and liquid crystal device (LCD) matrices for adaptive, tunable elements. Preparation of interfacial layer properties and attachment process embodiments are taught.
摘要翻译： 描述了用于在半导体和其他图像显示装置，背板，光电板和集成光学系统上形成，对准和附着微量元件的二维阵列的自动化的晶片级装置和方法。 在有序的制造顺序中，由光学设计的空腔构成的模具板通过反应离子蚀刻或可选的工艺形成，任选地涂覆有释放材料层，并通过自动化流体注入和缺陷检查子系统填充光学特定的材料。 光学校准基准指导所公开的转移和附着过程以实现微光学元件与对应的光电器件和电路之间的特定公差。 本发明适用于光谱滤波器，波导管，光纤模式变压器，衍射光栅，折射透镜，衍射透镜/菲涅耳带片，反射器以及元件和器件的组合，包括微机电系统（MEMS）和液晶器件 （LCD）矩阵，用于自适应，可调元素。 教导界面层性质和附着工艺实施例的制备。
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公开(公告)号：US20070029277A1
公开(公告)日：2007-02-08
申请号：US11195147
申请日：2005-08-02
CPC分类号： H01L27/14685 , B29D11/00365 , B29D11/00461 , B82Y30/00 , G02B3/0018 , G02B3/0056 , G02F1/137 , G02F1/29 , H01L27/14627 , H01L31/02327 , H01L33/58
摘要： A wafer-scale apparatus and method is described for the automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on semiconductor and other image display devices, backplanes, optoelectronic boards, and integrated optical systems. In an ordered fabrication sequence, a mold plate comprised of optically designed cavities is formed by reactive ion etching or alternative processes, optionally coated with a release material layer and filled with optically specified materials by an automated fluid-injection and defect-inspection subsystem. Optical alignment fiducials guide the disclosed transfer and attachment processes to achieve specified tolerances between the microoptic elements and corresponding optoelectronic devices and circuits. The present invention applies to spectral filters, waveguides, fiber-optic mode-transformers, diffraction gratings, refractive lenses, diffractive lens/Fresnel zone plates, reflectors, and to combinations of elements and devices, including microelectromechanical systems (MEMS) and liquid crystal device (LCD) matrices for adaptive, tunable elements. Preparation of interfacial layer properties and attachment process embodiments are taught.
摘要翻译： 描述了用于在半导体和其他图像显示装置，背板，光电板和集成光学系统上形成，对准和附着微量元件的二维阵列的自动化的晶片级装置和方法。 在有序的制造顺序中，由光学设计的空腔构成的模具板通过反应离子蚀刻或可选的工艺形成，任选地涂覆有释放材料层，并通过自动化流体注入和缺陷检查子系统填充光学特定的材料。 光学校准基准指导所公开的转移和附着过程以实现微光学元件与对应的光电器件和电路之间的特定公差。 本发明适用于光谱滤波器，波导管，光纤模式变压器，衍射光栅，折射透镜，衍射透镜/菲涅耳带片，反射器以及元件和器件的组合，包括微机电系统（MEMS）和液晶器件 （LCD）矩阵，用于自适应，可调元素。 教导界面层性质和附着工艺实施例的制备。
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4.发明授权Sprocket opening alignment process and apparatus for multilayer solder decal 失效用于多层焊料贴花的链轮开口对准工艺和装置公开(公告)号：US07928585B2
公开(公告)日：2011-04-19
申请号：US11869573
申请日：2007-10-09
IPC分类号： H01L23/488
CPC分类号： H01L24/11 , H01L24/13 , H01L24/742 , H01L2224/0401 , H01L2224/05571 , H01L2224/11003 , H01L2224/1111 , H01L2224/1131 , H01L2224/11849 , H01L2224/131 , H01L2924/0002 , H01L2924/14 , Y10T29/49149 , H01L2924/00012 , H01L2924/014 , H01L2224/05552
摘要： A process for aligning at least two layers in an abutting relationship with each other comprises forming a plurality of sprocket openings in each of the layers for receiving a sprocket of diminishing diameters as the sprocket extends outwardly from a base, with the center axes of the sprocket openings in each layer being substantially alignable with one another, the diameter of the sprocket openings in an abutting layer for first receiving the sprocket being greater than the diameter of the sprocket openings in an abutted layer. This is followed by forming a plurality of reservoir openings in each of at least two of the layers and positioning the sprocket openings in the layers to correspond with one another and the reservoir openings in the layers to correspond with one another so that substantial alignment of the center axes of the corresponding sprocket openings in the layers effects substantial alignment of the center axes of the corresponding reservoir openings in the layers. Engaging the sprocket openings with the sprocket by inserting the end of the sprocket having the smallest diameter into the sprocket openings having the largest diameter in the layers and continuing through to the sprocket opening having the smallest diameter in the layers effects substantial alignment of the center axes of the corresponding sprocket openings and substantial alignment of the center axes of the corresponding reservoir openings in the layers. The invention also comprises apparatus-for performing this process.
摘要翻译： 用于将至少两个彼此邻接的层对准的方法包括在每个层中形成多个链轮开口，用于当链轮从基座向外延伸时接收链轮直径减小的链轮，链轮的中心轴线 每个层中的开口基本上彼此对准，用于首先接收链轮的邻接层中的链轮开口的直径大于邻接层中链轮开口的直径。 随后在至少两个层中的每一个中形成多个储存器开口，并且将链轮开口定位在层中以彼此对应并且层中的储存器开口彼此对应，使得 层中对应的链轮开口的中心轴线对层中对应的储存器开口的中心轴进行实质上的对准。 通过将具有最小直径的链轮的端部插入到具有最大直径的链轮的链轮开口中并且连续到具有最小直径的链轮开口，使链轮开口与链轮接合，使得中心轴线 的对应的链轮开口和相应的储存器开口的中心轴线在层中的基本对准。 本发明还包括用于执行该过程的装置。
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公开(公告)号：US07838954B2
公开(公告)日：2010-11-23
申请号：US12015447
申请日：2008-01-16
IPC分类号： H01L23/48
CPC分类号： B23K1/0016 , B23K1/19 , B23K35/262 , B23K35/3013 , B23K2101/36 , H01L24/11 , H01L2224/05001 , H01L2224/05027 , H01L2224/0508 , H01L2224/05124 , H01L2224/05147 , H01L2224/05572 , H01L2224/056 , H01L2224/11003 , H01L2224/1111 , H01L2924/01322 , Y10T428/24826 , Y10T428/24942 , H01L2924/00 , H01L2924/00014
摘要： A semiconductor solder bump structure having a solder bump with at least a first solder and a second solder attached to the first solder, producing one solder bump having at least two different solders with different melting temperatures. A method of fabricating the solder is included.
摘要翻译： 一种半导体焊料凸块结构，具有至少具有第一焊料的焊料凸块和附着到第一焊料的第二焊料，产生具有不同熔化温度的至少两种不同焊料的一个焊料凸块。 包括制造焊料的方法。
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公开(公告)号：US07523852B2
公开(公告)日：2009-04-28
申请号：US11005557
申请日：2004-12-05
申请人： Stephen L. Buchwalter , Claudius Feger , Peter A. Gruber , Sung K. Kang , Paul A. Lauro , Da-Yuan Shih
发明人： Stephen L. Buchwalter , Claudius Feger , Peter A. Gruber , Sung K. Kang , Paul A. Lauro , Da-Yuan Shih
IPC分类号： B23K35/12
CPC分类号： H05K3/3436 , B23K35/26 , H01L24/11 , H01L24/12 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/1308 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/13155 , H01L2224/13176 , H01L2224/13181 , H01L2224/13184 , H01L2224/1357 , H01L2224/13639 , H01L2224/13644 , H01L2224/13655 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01047 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15787 , H05K3/3426 , H05K3/3468 , H05K2201/10287 , H05K2201/10992 , H05K2203/0113 , H05K2203/0415 , H05K2203/128 , Y02P70/613 , H01L2224/13099 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Improved interconnects are produced by injection molded solder which fills mold arrays with molten solder so that columns that have much greater height to width aspect ratios greater than one are formed, rather than conventional flip chip bumps. The columns may have filler particles or reinforcing conductors therein. In the interconnect structures produced, the cost and time of a subsequent underfill step is reduced or avoided. The problem of incompatibility with optical interconnects between chips because underfills require high loading of silica fillers which scatter light, is solved, thus allowing flip chips to incorporate optical interconnects.
摘要翻译： 改进的互连通过注射成型的焊料生产，该焊料用熔融焊料填充模具阵列，使得形成具有大于1的高宽比宽高比的柱而不是传统的倒装芯片凸块。 该列可以在其中具有填料颗粒或增强导体。 在所生产的互连结构中，减少或避免了后续底部填充步骤的成本和时间。 与芯片之间的光学互连不兼容的问题，因为底部填充物需要高散射光的二氧化硅填料的高负载，因此可以使倒装芯片结合光学互连。
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7.发明申请Sprocket Opening Alignment Process and Apparatus for Multilayer Solder Decal 失效用于多层焊料贴花的链轮开口对准工艺和装置公开(公告)号：US20110097892A1
公开(公告)日：2011-04-28
申请号：US12983292
申请日：2011-01-01
IPC分类号： H01L21/44
CPC分类号： H01L24/11 , H01L24/13 , H01L24/742 , H01L2224/0401 , H01L2224/05571 , H01L2224/11003 , H01L2224/1111 , H01L2224/1131 , H01L2224/11849 , H01L2224/131 , H01L2924/0002 , H01L2924/14 , Y10T29/49149 , H01L2924/00012 , H01L2924/014 , H01L2224/05552
摘要： A process for aligning at least two layers in an abutting relationship with each other comprises forming a plurality of sprocket openings in each of the layers for receiving a sprocket of diminishing diameters as the sprocket extends outwardly from a base, with the center axes of the sprocket openings in each layer being substantially alignable with one another, the diameter of the sprocket openings in an abutting layer for first receiving the sprocket being greater than the diameter of the sprocket openings in an abutted layer. This is followed by forming a plurality of reservoir openings in each of at least two of the layers and positioning the sprocket openings in the layers to correspond with one another and the reservoir openings in the layers to correspond with one another so that substantial alignment of the center axes of the corresponding sprocket openings in the layers effects substantial alignment of the center axes of the corresponding reservoir openings in the layers. Engaging the sprocket openings with the sprocket by inserting the end of the sprocket having the smallest diameter into the sprocket openings having the largest diameter in the layers and continuing through to the sprocket opening having the smallest diameter in the layers effects substantial alignment of the center axes of the corresponding sprocket openings and substantial alignment of the center axes of the corresponding reservoir openings in the layers. The invention also comprises apparatus for performing this process.
摘要翻译： 用于将至少两个彼此邻接的层对准的方法包括在每个层中形成多个链轮开口，用于当链轮从基座向外延伸时接收链轮直径减小的链轮，链轮的中心轴线 每个层中的开口基本上彼此对准，用于首先接收链轮的邻接层中的链轮开口的直径大于邻接层中链轮开口的直径。 随后在至少两个层中的每一个中形成多个储存器开口，并且将链轮开口定位在层中以彼此对应并且层中的储存器开口彼此对应，使得 层中对应的链轮开口的中心轴线对层中对应的储存器开口的中心轴进行实质上的对准。 通过将具有最小直径的链轮的端部插入到具有最大直径的链轮的链轮开口中并且连续到具有最小直径的链轮开口，使链轮开口与链轮接合，使得中心轴线 的对应的链轮开口和相应的储存器开口的中心轴线在层中的基本对准。 本发明还包括用于执行该过程的装置。
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8.发明授权Sprocket opening alignment process and apparatus for multilayer solder decal 失效用于多层焊料贴花的链轮开口对准工艺和装置公开(公告)号：US08268719B2
公开(公告)日：2012-09-18
申请号：US12983292
申请日：2011-01-01
IPC分类号： H01L21/44
CPC分类号： H01L24/11 , H01L24/13 , H01L24/742 , H01L2224/0401 , H01L2224/05571 , H01L2224/11003 , H01L2224/1111 , H01L2224/1131 , H01L2224/11849 , H01L2224/131 , H01L2924/0002 , H01L2924/14 , Y10T29/49149 , H01L2924/00012 , H01L2924/014 , H01L2224/05552
摘要： A process for aligning at least two layers in an abutting relationship with each other comprises forming a plurality of sprocket openings in each of the layers for receiving a sprocket of diminishing diameters as the sprocket extends outwardly from a base, with the center axes of the sprocket openings in each layer being substantially alignable with one another, the diameter of the sprocket openings in an abutting layer for first receiving the sprocket being greater than the diameter of the sprocket openings in an abutted layer. This is followed by forming a plurality of reservoir openings in each of at least two of the layers and positioning the sprocket openings in the layers to correspond with one another and the reservoir openings in the layers to correspond with one another so that substantial alignment of the center axes of the corresponding sprocket openings in the layers effects substantial alignment of the center axes of the corresponding reservoir openings in the layers. Engaging the sprocket openings with the sprocket by inserting the end of the sprocket having the smallest diameter into the sprocket openings having the largest diameter in the layers and continuing through to the sprocket opening having the smallest diameter in the layers effects substantial alignment of the center axes of the corresponding sprocket openings and substantial alignment of the center axes of the corresponding reservoir openings in the layers. The invention also comprises apparatus for performing this process.
摘要翻译： 用于将至少两个彼此邻接的层对准的方法包括在每个层中形成多个链轮开口，用于当链轮从基座向外延伸时接收链轮直径减小的链轮，链轮的中心轴线 每个层中的开口基本上彼此对准，用于首先接收链轮的邻接层中的链轮开口的直径大于邻接层中链轮开口的直径。 随后在至少两个层中的每一个中形成多个储存器开口，并且将链轮开口定位在层中以彼此对应并且层中的储存器开口彼此对应，使得 层中对应的链轮开口的中心轴线对层中对应的储存器开口的中心轴进行实质上的对准。 通过将具有最小直径的链轮的端部插入到具有最大直径的链轮的链轮开口中并且连续到具有最小直径的链轮开口，使链轮开口与链轮接合，使得中心轴线 的对应的链轮开口和相应的储存器开口的中心轴线在层中的基本对准。 本发明还包括用于执行该过程的装置。
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公开(公告)号：US20090181223A1
公开(公告)日：2009-07-16
申请号：US12015447
申请日：2008-01-16
CPC分类号： B23K1/0016 , B23K1/19 , B23K35/262 , B23K35/3013 , B23K2101/36 , H01L24/11 , H01L2224/05001 , H01L2224/05027 , H01L2224/0508 , H01L2224/05124 , H01L2224/05147 , H01L2224/05572 , H01L2224/056 , H01L2224/11003 , H01L2224/1111 , H01L2924/01322 , Y10T428/24826 , Y10T428/24942 , H01L2924/00 , H01L2924/00014
摘要： A semiconductor solder bump structure having a solder bump with at least a first solder and a second solder attached to the first solder, producing one solder bump having at least two different solders with different melting temperatures. A method of fabricating the solder is included.
摘要翻译： 一种半导体焊料凸块结构，具有至少具有第一焊料的焊料凸块和附着到第一焊料的第二焊料，产生具有不同熔融温度的至少两种不同焊料的一个焊料凸块。 包括制造焊料的方法。
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10.发明申请SPROCKET OPENING ALIGNMENT PROCESS AND APPARATUS FOR MULTILAYER SOLDER DECAL 失效SPROCKET打开对齐过程以及多层焊锡膏的设备公开(公告)号：US20090093111A1
公开(公告)日：2009-04-09
申请号：US11869573
申请日：2007-10-09
CPC分类号： H01L24/11 , H01L24/13 , H01L24/742 , H01L2224/0401 , H01L2224/05571 , H01L2224/11003 , H01L2224/1111 , H01L2224/1131 , H01L2224/11849 , H01L2224/131 , H01L2924/0002 , H01L2924/14 , Y10T29/49149 , H01L2924/00012 , H01L2924/014 , H01L2224/05552
摘要： A process for aligning at least two layers in an abutting relationship with each other comprises forming a plurality of sprocket openings in each of the layers for receiving a sprocket of diminishing diameters as the sprocket extends outwardly from a base, with the center axes of the sprocket openings in each layer being substantially alignable with one another, the diameter of the sprocket openings in an abutting layer for first receiving the sprocket being greater than the diameter of the sprocket openings in an abutted layer. This is followed by forming a plurality of reservoir openings in each of at least two of the layers and positioning the sprocket openings in the layers to correspond with one another and the reservoir openings in the layers to correspond with one another so that substantial alignment of the center axes of the corresponding sprocket openings in the layers effects substantial alignment of the center axes of the corresponding reservoir openings in the layers. Engaging the sprocket openings with the sprocket by inserting the end of the sprocket having the smallest diameter into the sprocket openings having the largest diameter in the layers and continuing through to the sprocket opening having the smallest diameter in the layers effects substantial alignment of the center axes of the corresponding sprocket openings and substantial alignment of the center axes of the corresponding reservoir openings in the layers. The invention also comprises apparatus-for performing this process.
摘要翻译： 用于将至少两个彼此邻接的层对准的方法包括在每个层中形成多个链轮开口，用于当链轮从基座向外延伸时接收链轮直径减小的链轮，链轮的中心轴线 每个层中的开口基本上彼此对准，用于首先接收链轮的邻接层中的链轮开口的直径大于邻接层中链轮开口的直径。 随后在至少两个层中的每一个中形成多个储存器开口，并且将链轮开口定位在层中以彼此对应并且层中的储存器开口彼此对应，使得 层中对应的链轮开口的中心轴线对层中对应的储存器开口的中心轴进行实质上的对准。 通过将具有最小直径的链轮的端部插入到具有最大直径的链轮的链轮开口中并且连续到具有最小直径的链轮开口，使链轮开口与链轮接合，使得中心轴线 的对应的链轮开口和相应的储存器开口的中心轴线在层中的基本对准。 本发明还包括用于执行该过程的装置。
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