公开(公告)号：US20130091867A1

公开(公告)日：2013-04-18

申请号：US13271304

申请日：2011-10-12

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Evan G. COLGAN ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Evan G. COLGAN ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： F25B21/02 ,  B23P15/26

CPC分类号： F25B21/02 ,  B23P15/26 ,  F25B43/00 ,  F25B43/003 ,  F25B2400/01 ,  H05K7/20809 ,  H05K7/20836 ,  Y10T29/49359

摘要： Apparatuses and methods are provided for facilitating cooling of an electronic component. The apparatus includes a vapor-compression refrigeration system, which includes an expansion component, an evaporator, a compressor and a condenser coupled in fluid communication. The evaporator is coupled to and cools the electronic component. The apparatus further includes a contaminant separator coupled in fluid communication with the refrigerant flow path. The separator includes a refrigerant cold filter and a thermoelectric array. At least a portion of refrigerant passing through the refrigerant flow path passes through the cold filter, and the thermoelectric array provides cooling to the cold filter to cool refrigerant passing through the filter. By cooling refrigerant passing through the filter, contaminants solidify from the refrigerant, and are deposited in the cold filter. The separator may further include a refrigerant hot filter coupled to a hot side of the thermoelectric array for further filtering the refrigerant.

摘要翻译： 提供了便于冷却电子部件的装置和方法。 该装置包括蒸气压缩式制冷系统，其包括膨胀部件，蒸发器，压缩机和流体连通的冷凝器。 蒸发器与电子部件联接并冷却。 该装置还包括与制冷剂流动路径流体连通的污染物分离器。 分离器包括制冷剂冷滤器和热电阵列。 通过制冷剂流路的制冷剂的至少一部分通过冷过滤器，并且热电阵列向冷过滤器提供冷却以冷却通过过滤器的制冷剂。 通过冷却通过过滤器的制冷剂，污染物从制冷剂中固化，并沉积在冷过滤器中。 分离器还可以包括耦合到热电阵列的热侧的制冷剂热过滤器，用于进一步过滤制冷剂。

公开(公告)号：US20130091886A1

公开(公告)日：2013-04-18

申请号：US13271290

申请日：2011-10-12

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Evan G. Colgan ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Evan G. Colgan ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： F25B43/00 ,  F25D31/00 ,  B23P15/26

CPC分类号： F25B43/003 ,  F25B2400/01 ,  H05K7/20327 ,  H05K7/20809

摘要： Apparatuses and methods are provided for facilitating cooling of an electronic component. The apparatus includes a vapor-compression refrigeration system. The vapor-compression refrigeration system includes an expansion component, an evaporator, a compressor, and a condenser coupled in fluid communication via a refrigerant flow path. The evaporator is coupled to and cools the electronic component. The apparatus further includes a contaminant extractor coupled in fluid communication with the refrigerant flow path. The extractor includes a refrigerant boiling filter and a heater. At least a portion of refrigerant passing through the refrigerant flow path passes through the refrigerant boiling filter, and the heater provides heat to the refrigerant boiling filter to boil refrigerant passing through the filter. By boiling refrigerant passing through the filter, contaminants are extracted from the refrigerant, and are deposited in the refrigerant boiling filter.

摘要翻译： 提供了便于冷却电子部件的装置和方法。 该装置包括蒸气压缩制冷系统。 蒸汽压缩式制冷系统包括膨胀部件，蒸发器，压缩机以及通过制冷剂流动路径流体连通的冷凝器。 蒸发器与电子部件联接并冷却。 该装置还包括与制冷剂流动路径流体连通地联接的污染物提取器。 提取器包括制冷剂沸腾过滤器和加热器。 通过制冷剂流路的制冷剂的至少一部分通过制冷剂沸腾过滤器，并且加热器向制冷剂沸腾过滤器提供热量以沸腾通过过滤器的制冷剂。 通过沸腾通过过滤器的制冷剂，污染物从制冷剂中排出，并沉积在制冷剂沸腾过滤器中。

公开(公告)号：US20130091871A1

公开(公告)日：2013-04-18

申请号：US13271296

申请日：2011-10-12

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Evan G. COLGAN ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Evan G. COLGAN ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： B01D8/00

CPC分类号： B01D8/00 ,  B01D5/0039 ,  H05K7/20809

摘要： Apparatuses and methods are provided for facilitating cooling of an electronic component. The apparatus includes a vapor-compression refrigeration system. The vapor-compression refrigeration system includes an expansion component, an evaporator and a compressor coupled in fluid communication via a refrigerant flow path. The evaporator is coupled to and cools the electronic component. The apparatus further includes a contaminant cold trap coupled in fluid communication with the refrigerant flow path. The cold trap includes a refrigerant cold filter and a coolant-cooled structure. At least a portion of refrigerant passing through the refrigerant flow path passes through the refrigerant cold filter, and the coolant-cooled structure provides cooling to the refrigerant cold filter to cool refrigerant passing through the filter. By cooling refrigerant passing through the filter, contaminants solidify from the refrigerant, and are deposited in the refrigerant cold filter.

摘要翻译： 提供了便于冷却电子部件的装置和方法。 该装置包括蒸气压缩制冷系统。 蒸气压缩式制冷系统包括经由制冷剂流动路径流体连通的膨胀部件，蒸发器和压缩机。 蒸发器与电子部件联接并冷却。 该装置还包括耦合成与制冷剂流动路径流体连通的污染物冷阱。 冷阱包括制冷剂冷却过滤器和冷却剂冷却结构。 通过制冷剂流路的制冷剂的至少一部分通过制冷剂冷滤器，冷却剂冷却结构向制冷剂冷滤器提供冷却，以冷却通过过滤器的制冷剂。 通过冷却通过过滤器的制冷剂，污染物从制冷剂中固化，并沉积在制冷剂冷滤器中。

公开(公告)号：US20130128918A1

公开(公告)日：2013-05-23

申请号：US13300803

申请日：2011-11-21

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： G01N25/00

CPC分类号： H05K7/20836

摘要： Monitoring of cooling of an electronic component is provided, which includes: determining a current thermal resistance associated with one or more of the electronic component, a heat sink coupled to the electronic component, or a thermal interface coupling the electronic component and the heat sink; and determining, by a processor, whether the current thermal resistance exceeds a set thermal resistance threshold, and responsive to the current thermal resistance exceeding the set thermal resistance threshold, indicating a thermal resistance fault. As an enhancement, rate of change over time of the thermal resistance is determined, and compared against a rate of change threshold, and if exceeding the threshold, a rate of change thermal resistance warning is provided.

摘要翻译： 提供了对电子部件的冷却的监视，其包括：确定与电子部件中的一个或多个相关联的当前热阻，耦合到电子部件的散热器或耦合电子部件和散热器的热接口; 以及通过处理器确定当前热阻是否超过设定的热阻阈值，并且响应于当前热阻超过设定的热阻阈值，指示热阻故障。 作为增强，确定热阻时间的变化率，并且与变化率阈值进行比较，并且如果超过阈值，则提供变化率热阻警告。

公开(公告)号：US20130107457A1

公开(公告)日：2013-05-02

申请号：US13281495

申请日：2011-10-26

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Eric J. McKEEVER ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Eric J. McKEEVER ,  Robert E. SIMONS

IPC分类号： H05K7/20 ,  F28D7/10

CPC分类号： H05K7/20272 ,  H05K7/2079 ,  Y10T29/4935 ,  Y10T29/49389

摘要： A cooling apparatus is provided which includes one or more coolant-cooled structures attached to one or more electronic components, one or more coolant conduits, and one or more coolant manifolds. The coolant-cooled structure(s) includes one or more coolant-carrying channels, and the coolant manifolds includes one or more rotatable manifold sections. One coolant conduit couples in fluid communication a respective rotatable manifold section and the coolant-carrying channel(s) of a respective coolant-cooled structure. The respective rotatable manifold section is rotatable relative to another portion of the coolant manifold to facilitate detaching of the coolant-cooled structure from its associated electronic component while maintaining the coolant-cooled structure in fluid communication with the respective rotatable manifold section through the one coolant conduit, which in one embodiment, is a substantially rigid coolant conduit.

摘要翻译： 提供了一种冷却装置，其包括连接到一个或多个电子部件，一个或多个冷却剂管道和一个或多个冷却剂歧管的一个或多个冷却剂冷却结构。 冷却剂冷却结构包括一个或多个冷却剂输送通道，并且冷却剂歧管包括一个或多个可旋转的歧管段。 一个冷却剂管道将相应的可旋转歧管部分和相应冷却剂冷却结构的冷却剂输送通道流体连通地连接。 相应的可旋转歧管部分可相对于冷却剂歧管的另一部分旋转，以便于将冷却剂冷却结构与其相关联的电子部件分离，同时保持冷却剂冷却结构与相应的可旋转歧管部分流体连通，通过一个冷却剂管道 ，其在一个实施例中是基本刚性的冷却剂导管。

公开(公告)号：US20130105139A1

公开(公告)日：2013-05-02

申请号：US13285116

申请日：2011-10-31

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： F28F27/00 ,  B21D53/02 ,  F28F13/00

CPC分类号： H05K7/20263 ,  H05K7/20709 ,  H05K7/20754 ,  H05K7/20763 ,  H05K7/20781 ,  H05K7/20836

摘要： A multi-rack assembly is provided which includes first and second electronics racks. The first electronics rack includes one or more cooling units disposed within the first electronics rack, which are coupled in fluid communication with a primary coolant loop of the first electronics rack to, at least in part, provide cooled coolant to the primary coolant loop and facilitate cooling one or more first rack electronic components. The second electronics rack includes a secondary coolant loop coupled in fluid communication with the cooling unit(s) disposed within the first electronics rack. The multi-rack assembly further includes a controller to automatically provide cooled coolant to the secondary coolant loop, and wherein the controller controls flow of cooled coolant from the cooling unit(s) to the secondary coolant loop depending, at least in part, on cooling requirements of the first electronics rack.

摘要翻译： 提供了包括第一和第二电子机架的多机架组件。 第一电子机架包括设置在第一电子机架内的一个或多个冷却单元，其联接成与第一电子机架的主冷却剂回路流体连通，至少部分地将冷却的冷却剂提供给主冷却剂回路，并且促进 冷却一个或多个第一机架电子部件。 第二电子机架包括与布置在第一电子机架内的冷却单元流体连通的二次冷却剂回路。 多机架组件还包括控制器，用于将冷却的冷却剂自动地提供给二次冷却剂回路，并且其中控制器控制冷却的冷却剂从冷却单元到第二冷却剂回路的流动，这至少部分地取决于冷却 第一电子机架的要求。

公开(公告)号：US20130094145A1

公开(公告)日：2013-04-18

申请号：US13271268

申请日：2011-10-12

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS ,  Prabjit SINGH

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS ,  Prabjit SINGH

IPC分类号： H05K7/20 ,  B21D53/02 ,  F28F7/00

CPC分类号： H05K7/20 ,  H01L23/367 ,  H01L23/373 ,  H01L23/3736 ,  H01L23/4006 ,  H01L23/427 ,  H01L23/473 ,  H01L2023/4087 ,  H01L2224/16 ,  Y10T29/49002 ,  Y10T29/4935 ,  Y10T29/49353

摘要： A heat sink and method of fabrication are provided for removing heat from an electronic component(s). The heat sink includes a heat sink base and frame. The base has a first coefficient of thermal expansion (CTE), and includes a base surface configured to couple to the electronic component to facilitate removal of heat. The frame has a second CTE, and is configured to constrain the base surface in opposing relation to the electronic component, wherein the first CTE is greater than the second CTE. At least one of the heat sink base or frame is configured so that heating of the heat sink base results in a compressive force at the base surface of the heat sink base towards the electronic component that facilitates heat transfer from the electronic component. A thermal interface material is disposed between the base surface and the electronic component.

摘要翻译： 散热器和制造方法被提供用于从电子部件去除热量。 散热器包括散热器底座和框架。 基座具有第一热膨胀系数（CTE），并且包括配置成耦合到电子部件以便于去除热量的基面。 框架具有第二CTE，并且被配置为以与电子部件相对的关系约束基面，其中第一CTE大于第二CTE。 散热器基座或框架中的至少一个被构造成使得散热器基座的加热导致散热器基座的基面朝向电子部件的压缩力，其有助于从电子部件的热传递。 热界面材料设置在基底表面和电子部件之间。

公开(公告)号：US20130027878A1

公开(公告)日：2013-01-31

申请号：US13189597

申请日：2011-07-25

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： H05K7/20 ,  F28F7/00

CPC分类号： B23P15/26 ,  F28D15/0266 ,  F28F3/00 ,  F28F3/12 ,  F28F13/00 ,  G06F1/20 ,  H05K7/20254 ,  H05K7/20272 ,  H05K7/2029 ,  H05K7/20772 ,  Y10T29/4935

摘要： A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).

摘要翻译： 提供散热器，冷却电子结构和利用散热器的冷却电子设备。 散热器由导热结构制成，该导热结构包括一个或多个冷却剂承载通道，其联接以便于冷却剂流过冷却剂输送通道。 散热器还包括与冷却剂输送通道相关联的膜。 该膜包括至少一个透气区域，其覆盖着一部分冷却剂输送通道，并且有助于从冷却剂输送通道中除去蒸气，以及至少一个孔口，其连接以将冷却剂注入到 在一个或多个通道的相对端之间的冷却剂承载通道的至少一个表面。

公开(公告)号：US20140071627A1

公开(公告)日：2014-03-13

申请号：US13613873

申请日：2012-09-13

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： F28D15/02 ,  H05K7/20

CPC分类号： H05K7/20809 ,  F28D15/02 ,  F28D15/046 ,  F28F3/048 ,  H05K7/203

摘要： Cooling apparatus and methods are provided for partial immersion-cooling of multiple electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a compartment about the components, and a fluid disposed within the compartment. First and second electronic components are at least partially non-immersed within the fluid, with the first component being a different type of electronic component with different configuration than the second component. A vapor condenser is provided with a vapor-condensing surface disposed within the compartment for condensing fluid vapor, and a condensate redirect structure is disposed within the compartment between the vapor condenser and the first and second components. The redirect structure is differently configured over the first electronic component compared with over the second electronic component, and provides a different pattern of condensate drip over the first component compared with over the second component.

摘要翻译： 提供冷却装置和方法用于多个电子部件的部分浸没冷却。 冷却装置包括至少部分围绕部件周围并形成隔室的壳体以及设置在隔间内的流体。 第一和第二电子部件至少部分地不浸在流体内，其中第一部件是与第二部件不同的构造的不同类型的电子部件。 蒸汽冷凝器设置有设置在隔间内的蒸汽冷凝表面，用于冷凝流体蒸气，并且冷凝物重新导向结构设置在蒸气冷凝器和第一和第二部件之间的隔间内。 与第二电子部件相比，重定向结构在第一电子部件上被不同地配置，并且与第二部件相比，在第一部件上提供了不同的冷凝物滴落模式。

公开(公告)号：US20130105122A1

公开(公告)日：2013-05-02

申请号：US13281669

申请日：2011-10-26

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： F28D15/04

CPC分类号： F28D1/0477 ,  F28D15/0266 ,  F28D15/0275 ,  H05K7/203 ,  H05K7/20809

摘要： Cooling apparatuses and methods are provided for immersion-cooling one or more electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s) and a dielectric fluid disposed within the fluid-tight compartment, with the electronic component(s) immersed within the dielectric fluid. A vapor-condenser and one or more wicking components are also provided. The vapor-condenser includes a plurality of thermally conductive condenser fins extending within the fluid-tight compartment, and the wicking component(s) is disposed within the fluid-tight compartment in physical contact with at least a portion of one or more thermally conductive condenser fins of the thermally conductive condenser fins extending within the compartment. The wicking component(s) facilitates drawing condensed fluid from a surface of the thermally conductive condenser fin(s) and thereby enhances heat transfer across the surface of the condenser fin(s).

摘要翻译： 提供冷却装置和方法用于浸入冷却一个或多个电子部件。 冷却装置包括壳体，其至少部分围绕电子部件围绕并形成流体密封的隔室，以及布置在流体密封隔室内的电介质流体，电子部件浸入介电流体内。 还提供蒸气冷凝器和一个或多个芯吸部件。 蒸汽冷凝器包括在流体密封室内延伸的多个导热冷凝器翅片，并且芯吸部件设置在流体密封室内，与至少一部分一个或多个导热冷凝器物理接触 在隔室内延伸的导热冷凝器翅片的翅片。 芯吸部件有助于从导热性冷凝器翅片的表面吸收冷凝流体，从而增强横跨冷凝器翅片的表面的热传递。