摘要:
A computer program product corrects a detonation time from a ballistic table, based on the actual velocity of a projectile measured upon exit of the projectile from the gun tube. The computer program product transfers a 16-bit data stream, through a 16-bit to an 8-bit encoder, to a fuze controller implemented as an 8-bit platform, to provide precise timing adjustment to a fuze controller. The computer program product significantly improves the accuracy of detonation times for air burst mode. The encoder calculates the absolute truncated, square rooted, X, of the input time delay number, as well as the error correction number, Y. The encoder then transmits both numbers X and Y as an 8-bit data stream, optionally along with the parity data to the fuze controller.
摘要:
A vertical cavity surface emitting laser that emits visible radiation is built upon a substrate, then having mirrors, the first mirror on top of the substrate; both sets of mirrors being a distributed Bragg reflector of either dielectrics or other materials which affect the resistivity or of semiconductors, such that the structure within the mirror comprises a plurality of sets, each having a thickness of .lambda./2n where n is the index of refraction of each of the sets; each of the mirrors adjacent to spacers which are on either side of an optically active bulk or quantum well layer; and the spacers and the optically active layer are from one of the following material systems: In.sub.z (Al.sub.y Ga.sub.1-y).sub.1-z P, InAlGaAs, AlGaAs, InGaAs, or AlGaP/GaP, wherein the optically active region having a length equal to m .lambda./2n.sub.eff where m is an integer and n.sub.eff is the effective index of refraction of the laser cavity, and the spacer layer and one of the mirrors being transmissive to radiation having a wavelength of .lambda./n, typically within the green to red portion of the visible spectrum.
摘要翻译:发射可见光辐射的垂直腔表面发射激光器建立在衬底上,然后具有反射镜,第一反射镜位于衬底顶部; 这两套反射镜是影响电阻率或半导体的电介质或其他材料的分布布拉格反射器,使得反射镜内的结构包括多个组,每组具有λ/ 2n的厚度,其中n是 各组折射; 与在光学活性体积或量子阱层的任一侧上的间隔物相邻的每个反射镜; 并且间隔物和光学活性层来自以下材料体系之一:Inz(Al y Ga 1-y)1-zP,InAlGaAs,AlGaAs,InGaAs或AlGaP / GaP,其中长度等于mλ的光学活性区 / 2neff其中m是整数,neff是激光腔的有效折射率,并且间隔层和一个反射镜对波长为λ/ n的辐射是透射的,通常在辐射的绿色至红色部分内 可见光谱。
摘要:
A process is provided for aligning and connecting at least one optical fiber to at least one optoelectronic device so as to couple light between at least one optical fiber and at least one optoelectronic device. One embodiment of this process comprises the following steps: (1) holding at least one optical element close to at least one optoelectronic device, at least one optical element having at least a first end; (2) aligning at least one optical element with at least one optoelectronic device; (3) depositing a first non-opaque material on a first end of at least one optoelectronic device; and (4) bringing the first end of at least one optical element proximate to the first end of at least one optoelectronic device in such a manner that the first non-opaque material contacts the first end of at least one optoelectronic device and the first end of at least one optical element. The optical element may be an optical fiber, and the optoelectronic device may be a vertical cavity surface emitting laser. The first non-opaque material may be a UV optical adhesive that provides an optical path and mechanical stability. In another embodiment of the alignment process, the first end of at least one optical element is brought proximate to the first end of at least one optoelectronic device in such a manner that an interstitial space exists between the first end of at least one optoelectronic device and the first end of at least one optical element.
摘要:
This invention relates to an optical transmitter, receiver or transceiver module, and more particularly, to an apparatus for connecting a first optical connector to a second optical connector. The apparatus comprises: (1) a housing having at least a first end and at least a second end, the first end of the housing capable of receiving the first optical connector, and the second end of the housing capable of receiving the second optical connector; (2) a longitudinal cavity extending from the first end of the housing to the second end of the housing; and (3) an electromagnetic shield comprising at least a portion of the housing. This invention also relates to an apparatus for housing a flexible printed circuit board, and this apparatus comprises: (1) a mounting structure having at least a first surface and a second surface; (2) alignment ridges along the first and second surfaces of the mounting structure, the alignment ridges functioning to align and secure a flexible printed circuit board that is wrapped around and attached to the first and second surfaces of the mounting structure; and (3) a series of heat sink ridges adapted to the mounting structure, the heat sink ridges functioning to dissipate heat that is generated from the flexible printed circuit board.
摘要:
A photodetector that is responsive to a wavelength or wavelengths of interest which have heretofore been unrealized. The photodetector includes a resonant cavity structure bounded by first and second reflectors, the resonant cavity structure being resonant at the wavelength or wavelengths of interest for containing a plurality of standing waves therein. The photodetector further includes a radiation absorbing region disposed within the resonant cavity structure, the radiation absorbing region including a plurality of radiation absorbing layers spaced apart from one another by a distance substantially equal to a distance between antinodes of adjacent ones of the standing waves. Each of radiation absorbing layers is spatially positioned at a location of one of the antinodes of one of the standing waves such that radiation absorption is enhanced. The radiation absorbing layers may be either bulk layers or quantum wells includes a plurality of layers, each of which is comprised of a strained layer of InGaAs. Individual ones of the InGaAs layers are spaced apart from one another by a GaAs barrier layer.
摘要:
This invention relates to a method of improving the fabrication of etched semiconductor devices by using a patterned adhesion promoter layer over a hydrocarbon planarization material. More specifically, the present invention improves the bonding of a metal interconnect layer to a hydrocarbon planarization material, such as polyimide, by inserting an adhesion promotion layer, such as silicon nitride, between the hydrocarbon planarization material and the metal interconnect layer. A process for improving the fabrication of etched semiconductor devices, comprises the steps of: (1) depositing a hydrocarbon planarization material over a substrate; (2) depositing an adhesion promoter over the hydrocarbon planarization material; (3) defining a first mask and etching back the adhesion promoter so as to form an adhesion promoter pad over a portion of the hydrocarbon planarization material; and (4) depositing a first metal over the adhesion promoter pad.
摘要:
A monolithically integrated optoelectronic device is provided which integrates a vertical cavity surface emitting laser and either a photosensitive or an electrosensitive device either as input or output to the vertical cavity surface emitting laser either in parallel or series connection. Both vertical and side-by-side arrangements are disclosed, and optical and electronic feedback means are provided. Arrays of these devices can be configured to enable optical computing and neural network applications.
摘要:
An optical memory system employing multiple reading/writing optical beams for simultaneously reading from or writing to multiple tracks of optical media to allow reading/writing of closely spaced adjacent tracks. Various optical elements and other means are incorporated to enable the beams as a group to remain focused and properly tracking as the beams as a group scan across the tracks. Means are also provided for modulating the beams to reduce crosstalk. Various optical elements and combinations of optical elements are provided to compensate for beam and system imperfections.
摘要:
A package and method for packaging optoelectronic or electronic components is provided in which multiple chip regions are packaged simultaneously prior to sectioning of the wafer into chips. The method and package allows micro-optic and other package elements to be integrated onto wafers on the same face as the optoelectronic or electronic devices without inhibiting the ability to make electrical contact to the devices. The package elements may be integrated to the wafer by material deposition, by spinning, or by physical mounting.
摘要:
An apparatus and method of attenuating and/or conditioning optical energy for an optical transmitter, receiver or transceiver module is disclosed. An apparatus for attenuating the optical output of an optoelectronic connector including: a mounting surface; an array of optoelectronic devices having at least a first end; an array of optical elements having at least a first end; the first end of the array of optical elements optically aligned with the first end of the array of optoelectronic devices; an optical path extending from the first end of the array of optoelectronic devices and ending at a second end of the array of optical elements; and an attenuator in the optical path for attenuating the optical energy emitted from the array of optoelectronic devices. Alternatively, a conditioner may be adapted in the optical path for conditioning the optical energy emitted from the array of optoelectronic devices.