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公开(公告)号:US20230056968A1
公开(公告)日:2023-02-23
申请号:US17580437
申请日:2022-01-20
IPC分类号: H01S5/024 , H01S5/0234 , H01S5/02345 , H01S5/0237
摘要: In some implementations, an opto-electrical device includes a heatsink; a thermally conductive element disposed on a first region of a surface of the heatsink; an adaptive thickness thermally conductive pad disposed on the thermally conductive element; an integrated circuit (IC) disposed on the adaptive thickness thermally conductive pad; a thermoelectric cooler (TEC) disposed on a second region of the surface of the heatsink; an opto-electrical chip disposed on the TEC; and a substrate disposed on the IC and the opto-electrical chip, wherein the substrate is configured to electrically connect the IC and the opto-electrical chip.