公开(公告)号：US20230352384A1

公开(公告)日：2023-11-02

申请号：US18188622

申请日：2023-03-23

申请人： Lumentum Operations LLC

发明人： Wei SHI ,  Mikhail DOLGANOV ,  Steve CHEUNG ,  Lijun ZHU

IPC分类号： H01L23/498 ,  H05K3/46 ,  H05K1/11 ,  H05K1/03 ,  H05K1/16

CPC分类号： H01L23/49822 ,  H05K1/0306 ,  H05K1/115 ,  H05K1/162 ,  H05K3/4688 ,  H05K2201/0187 ,  H05K2201/09563

摘要： In some implementations, a substrate comprises a ceramic core, multiple metal-filled vias through the ceramic core, and a first metal layer, on a top side of the ceramic core, including metal traces, over respective metal-filled vias. The substrate comprises a second metal layer, including a first electrical contact over a first metal trace, a second electrical contact over a second metal trace, and a third electrical contact over a third metal trace, where the second metal trace is electrically isolated from the first and third metal traces. The substrate comprises a thin dielectric layer separating the first metal layer and the second metal layer. The dielectric layer between the first metal layer and the second layer provides the substrate with a low parasitic inductance and a low thermal resistance based on a thickness of the dielectric layer and/or a material used for the dielectric layer.