Abstract:
Durable seamless replication tools are disclosed for replication of seamless relief patterns in desired media, for example in optical recording or data storage media. Methods of making such durable replication tools are disclosed, including preparing a recording substrate on the inner surface of a support cylinder, recording and developing a relief pattern in the substrate, creating a durable negative relief replica of the pattern, extracting the resulting durable tool sleeve from a processing cell, and mounting the tool sleeve on a mounting fixture. Apparatus are disclosed for fabricating such seamless replication tools, including systems for recording a desired relief pattern on a photosensitive layer on an inner surface of a support cylinder. Also disclosed are electrodeposition cells for forming a durable tool sleeve having a desired relief pattern. The replication tool relief features may have critical dimensions down to the micron and nanometer regime.
Abstract:
The present disclosure advances the art by providing a method and system for forming electronic devices. In particular, and by example only, methods are described for forming devices for harvesting energy in the terahertz frequency range on flexible substrates, wherein the methods provide favorable accuracy in registration of the various device elements and facilitate low-cost R2R manufacturing
Abstract:
Systems, methods, and structures for improving the performance of thin-film electronic devices, in particular organic LEDs (OLEDs) used in lighting, are disclosed. Enhanced substrates, upon which OLED devices may be deposited, incorporate various structures for extracting light trapped in the device stack and substrate. The substrates provide an improved transparent electrode layer. Methods for forming planarized buried extraction structures to reduce disruption to the deposited device stack layers are disclosed, as are methods for providing smooth, planarized buried metal mesh conductors.
Abstract:
The present disclosure advances the art by providing a method and system for forming electronic devices. In particular, and by example only, methods are described for forming devices for harvesting energy in the terahertz frequency range on flexible substrates, wherein the methods provide favorable accuracy in registration of the various device elements and facilitate low-cost R2R manufacturing.
Abstract:
Systems and methods are disclosed by which patterns of various materials can be formed on flexible substrates by a continuous roll-to-roll manufacturing process. The patterns may include metallic, transparent conductive, or non-metallic elements with lateral dimensions including in the range from below 100 nanometers to millimeters and with thickness dimensions including the range from tens of Angstroms to greater than 10,000 Angstroms. The substrate may be any material capable of sufficient flexibility for compatibility with roll-based processing equipment, including polymeric films, metallic foils, and thin glass, with polymeric films representing a particularly broad field of application. Methods may include the continuous roll-to-roll formation of a temporary polymeric structure with selected areas open to the underlying substrate, the continuous addition or subtraction of constituent materials, and the continuous removal, where necessary, of the polymeric structure and any excess material.
Abstract:
Systems, methods, and apparatus are disclosed for making patterning tools from one or more discrete elements. Such tools can have one or more “seams” or joints where the individual elements abut which can limit the tools' performance and utility in roll-to-roll manufacturing. Methods are described herein for producing “near-seamless” tools, that is, tools having seams that exhibit minimum disruption of the tool pattern and thus improved material produced by such tools. The patterning tools can be cylindrical and/or closed in shape.
Abstract:
Methods, apparatus and systems are disclosed by which patterned layers can be formed in a roll-to-roll process using a variable and programmable means for applying liquids and solutions used in the patterning process.
Abstract:
Systems and methods are disclosed for providing working substrates for the deposition of various photonic and electronic devices, in particular for organic light emitting diodes (OLEDs) used for lighting and displays, where these substrates incorporate structural elements that improve the performance of these devices. These elements include nanoscale and microscale relief (3D) patterns on one or both sides of the substrate that are beneficial in controlling light and electrical properties of these devices by, for example, improving light output efficiency and uniformity. The present disclosure describes batch and roll-to-roll (R2R) techniques that allow these performance enhancing substrates to be efficiently formed, and at a much lower cost than can be achieved using prior art. Although one particular application relates to OLED lighting, such substrates can be used to enhance the performance of other devices, including flexible displays, touch screens, energy harvesting cells, sensors, and the like.
Abstract:
Methods are described for forming polarized image films in which a displayed image changes depending on the state of polarization of a backside illumination source. Methods are also described for eliminating the leakage of unpolarized light through certain parts of the images resulting in unwanted visual artifacts in these images. Polarized dual graphic films achieving images with higher optical density and uniformity, minimum ghosting and mis-registration, can be made by a manufacturing technique that is faster, capable of higher production volumes, and that can produce polarized images at a lower cost. An exemplary method provides for forming a polarized image or pattern on an oriented substrate by using a negative patterned resist image or pattern formed by graphic arts techniques, followed by the imbibition of a dichroic dye or iodine ink to form a corresponding positive image in the areas not protected by the resist.
Abstract:
A method of forming a metal mold for casting a micro-scale dry adhesive structure includes securing a master patch of material including a micro-scale dry adhesive structure on a plating fixture, electroforming the metal mold on the patch of material, and removing the metal mold from the plating fixture and patch of material.