公开(公告)号：US10320048B2

公开(公告)日：2019-06-11

申请号：US15978574

申请日：2018-05-14

Applicant: MICROELECTRONICS TECHNOLOGY, INC.

Inventor： Ping-Chin Tseng

IPC: H05K7/02 ,  H01P5/18 ,  H01P3/08 ,  H05K1/02 ,  H05K5/00 ,  H05K1/18 ,  H05K7/04

Abstract: A communication device includes a circuit board having an upper surface and a lower surface, an upper housing disposed on the upper surface, and a lower housing disposed on the lower surface. The circuit board includes a top metal frame disposed on the upper surface, wherein the top metal frame defines a top cavity; a bottom metal frame disposed on the bottom surface, wherein the bottom metal frame defines a bottom cavity corresponding to the top cavity; a microstrip line disposed on the upper surface and extending into the top cavity; and a side coupler disposed on the lower surface and extending into the bottom cavity. The upper housing includes a depression corresponding to the top cavity, and the lower housing includes an aperture corresponding to the bottom cavity.