MOVABLE BUILDING
    1.
    发明申请
    MOVABLE BUILDING 有权
    可移动建筑

    公开(公告)号:US20110036018A1

    公开(公告)日:2011-02-17

    申请号:US12612086

    申请日:2009-11-04

    IPC分类号: E04H1/00 E04B1/38 E04G11/04

    摘要: A building includes a wall and a roof. The wall encloses an enclosed area, and the wall comprises a plurality of standardized modules, each having an inner space used as a room. The roof covers the enclosed area. The standardized modules are standardized, and thus very convenient to manufacture. In addition, the standardized modules can be transported quickly and efficiently, therefore, the building as disclosed is convenient and reliable to construct and dismantle.

    摘要翻译: 建筑物包括墙壁和屋顶。 墙壁封闭一个封闭区域,墙壁包括多个标准化模块,每个具有用作房间的内部空间。 屋顶覆盖封闭区域。 标准化模块是标准化的,因此制造非常方便。 此外,标准化模块可以快速有效地运输,因此,建筑物的建造和拆除方便可靠。

    MOVABLE BUILDING
    2.
    发明申请
    MOVABLE BUILDING 审中-公开
    可移动建筑

    公开(公告)号:US20110036022A1

    公开(公告)日:2011-02-17

    申请号:US12612085

    申请日:2009-11-04

    IPC分类号: E04H1/00 E04B1/343

    摘要: The present disclosure discloses a building including a wall and a roof. The wall encloses an enclosed area. The wall includes a plurality of serialized modules, and at least one of the serialized modules is a functional module having accessories with corresponding functions. The roof covers the enclosed area. The building as disclosed is convenient and reliable to construct and dismantle, because the modules can be transported quickly and efficiently and at least one of the serialized modules has desired function.

    摘要翻译: 本公开公开了一种包括墙壁和屋顶的建筑物。 墙壁封闭一个封闭区域。 墙壁包括多个串行化模块,并且至少一个串行化模块是具有相应功能的附件的功能模块。 屋顶覆盖封闭区域。 所建立的建筑物构造和拆卸方便可靠,因为模块可以快速有效地运输,并且至少一个串行化模块具有所需的功能。

    BRITTLE NONMETALLIC WORKPIECE AND METHOD AND DEVICE FOR MAKING SAME
    4.
    发明申请
    BRITTLE NONMETALLIC WORKPIECE AND METHOD AND DEVICE FOR MAKING SAME 有权
    非常重要的工作条件及其制造方法和装置

    公开(公告)号:US20090159580A1

    公开(公告)日:2009-06-25

    申请号:US12141091

    申请日:2008-06-18

    IPC分类号: B23K26/00 B32B17/00

    摘要: An exemplary brittle non-metallic workpiece (70) is made by the laser beam (31), a cutting surface (701 ) of the brittle non-metallic workpiece has no micro cracks. A method for making the brittle non-metallic workpiece includes: focusing a laser beam on the brittle non-metallic substrate to form an elliptic beam spot; driving the laser beam to move along a predetermined curved cutting path, making a center of a major axis of the elliptic beam spot intersecting along the predetermined curved cutting path and the major axis being tangent to the predetermined curved cutting path at the intersecting point; a coolant stream following the elliptic beam spot to move, thus producing a crack in the brittle non-metallic substrate corresponding to the predetermined curved cutting path; separating the brittle non-metallic substrate along the crack. A laser cutting device (40) for making the same is also provided.

    摘要翻译: 通过激光束(31)制成示例性的脆性非金属工件(70),脆性非金属工件的切割面(701)没有微裂纹。 用于制造脆性非金属工件的方法包括:将激光束聚焦在脆性非金属基底上以形成椭圆束斑; 驱动所述激光束沿着预定的弯曲切割路径移动,使得所述椭圆光束点的长轴的中心沿着所述预定弯曲切割路径相交,并且所述长轴在所述交叉点处与所述预定弯曲切割路径相切; 沿着椭圆形光束点移动的冷却剂流,从而在对应于预定弯曲切割路径的脆性非金属基板中产生裂纹; 沿着裂纹分离脆性非金属基材。 还提供了一种用于制造它的激光切割装置(40)。

    ELECTRONIC DEVICE HOUSING AND METHOD OF MANUFACTURING THE SAME
    5.
    发明申请
    ELECTRONIC DEVICE HOUSING AND METHOD OF MANUFACTURING THE SAME 审中-公开
    电子设备外壳及其制造方法

    公开(公告)号:US20120241185A1

    公开(公告)日:2012-09-27

    申请号:US13288169

    申请日:2011-11-03

    IPC分类号: H05K5/00 B32B37/12

    摘要: An electronic device housing includes a bottom layer, a adhesion layer and a protection layer. The adhesion layer is located on the bottom layer. The protection layer is located on the adhesion layer. The electronic device housing has excellent appearance and high durability. The present disclosure also provides a method of manufacturing the electronic device housing.

    摘要翻译: 电子装置壳体包括底层,粘合层和保护层。 粘附层位于底层。 保护层位于粘合层上。 电子设备外壳具有优异的外观和高耐久性。 本公开还提供了一种制造电子设备外壳的方法。

    ELECTRONIC DEVICE HOUSING AND METHOD OF MANUFACTURING THEREOF
    6.
    发明申请
    ELECTRONIC DEVICE HOUSING AND METHOD OF MANUFACTURING THEREOF 审中-公开
    电子设备外壳及其制造方法

    公开(公告)号:US20120275130A1

    公开(公告)日:2012-11-01

    申请号:US13305945

    申请日:2011-11-29

    IPC分类号: H05K7/02 B32B38/16

    摘要: An electronic device housing and a method of forming the housing are disclosed. The electronic device housing, comprises a bottom layer defining a though hole; an adhesion layer on the bottom layer defining a through hole; and a protection layer on the adhesion layer defining a through hole, wherein the adhesion layer is cured by ultraviolet (UV) rays, the adhesion layer is adapted to tightly combine the bottom layer and the protection layer.

    摘要翻译: 公开了电子设备外壳和形成外壳的方法。 电子设备外壳包括限定通孔的底层; 底层上的粘附层限定通孔; 以及形成通孔的粘合层上的保护层,其中粘合层通过紫外线(UV)光线固化,粘附层适于紧密地组合底层和保护层。

    LENS HOLDER
    8.
    发明申请
    LENS HOLDER 有权
    镜头支架

    公开(公告)号:US20090168210A1

    公开(公告)日:2009-07-02

    申请号:US12131132

    申请日:2008-06-02

    IPC分类号: G02B7/02

    CPC分类号: G02B7/023

    摘要: An exemplary lens holder (30) includes a lens holding platform (35), a base (31), a resilient element (33), and three platform supporting members (32). The platform supporting members (32) connect the lens holding platform (35) with the base (31), and are aligned on different axes. The resilient element (33) is positioned between the lens holding platform (35) and the base (31), and configured for uniformly resisting the lens holding platform (35) away from the base (31). One of the three platform supporting members (32) is adjustable, thus adjusting a gradient of the lens holding platform (35) relative to the base (31).

    摘要翻译: 示例性透镜保持器(30)包括透镜保持平台(35),基部(31),弹性元件(33)和三个平台支撑构件(32)。 平台支撑构件(32)将透镜保持平台(35)与基座(31)连接,并且在不同的轴线上对准。 弹性元件(33)位于透镜保持平台(35)和基座(31)之间,并且构造成用于均匀地抵抗透镜保持平台(35)远离基座(31)。 三个平台支撑构件(32)中的一个是可调节的,因此调节透镜保持平台(35)相对于基座(31)的梯度。

    BRITTLE NON-METALLIC WORKPIECE WITH THROUGH HOLE AND METHOD FOR MAKING SAME
    9.
    发明申请
    BRITTLE NON-METALLIC WORKPIECE WITH THROUGH HOLE AND METHOD FOR MAKING SAME 有权
    具有通孔的微型非金属工件及其制造方法

    公开(公告)号:US20090162606A1

    公开(公告)日:2009-06-25

    申请号:US12145467

    申请日:2008-06-24

    IPC分类号: B32B3/10

    摘要: An exemplary brittle non-metallic workpiece (80) defines a through hole (82). An inner surface (822) for forming the though hole has no microcracks and burrs. A method for making a through hole in a brittle non-metallic substrate (50) is also provided. The method includes as follows: forming an enclosing sketched etch (66) engraved into a brittle non-metallic substrate with a given depth (H) from a surface of the brittle non-metallic substrate; placing a cooling object (74) on an excess portion (68) inside the enclosing sketched etch (66); and extending the enclosing sketched etch through the brittle non-metallic substrate.

    摘要翻译: 示例性的脆性非金属工件(80)限定通孔(82)。 用于形成通孔的内表面(822)没有微裂纹和毛刺。 还提供了一种用于在脆性非金属基底(50)中形成通孔的方法。 该方法包括如下:从脆性非金属基底的表面形成刻蚀到具有给定深度(H)的脆性非金属基底中的封闭草图蚀刻(66); 将冷却对象(74)放置在封闭的草图蚀刻(66)内部的多余部分(68)上; 并且通过脆性非金属基底延伸封闭的草图蚀刻。