公开(公告)号：US08856321B2

公开(公告)日：2014-10-07

申请号：US13077578

申请日：2011-03-31

申请人： Madhusudan K. Iyengar ,  Vinod Kamath ,  Eren Kursun ,  Roger R. Schmidt

发明人： Madhusudan K. Iyengar ,  Vinod Kamath ,  Eren Kursun ,  Roger R. Schmidt

IPC分类号： G06F15/16 ,  G06F15/173 ,  G06F9/50

CPC分类号： G06F9/5094 ,  Y02D10/22

摘要： A system to improve operation of a data center with heterogeneous computing clouds may include monitoring components to track data center climate controls and individual heterogeneous computing clouds' operating parameters within the data center. The system may also include a controller that regulates the individual heterogeneous computing clouds and data center climate controls based upon data generated by the monitoring components to improve the operating performance of the individual heterogeneous computing clouds as well as the operating performance of the data center. The system may further include spilling computing clouds to receive excess workload of an individual heterogeneous computing cloud without violating individual heterogeneous computing clouds contracts.

摘要翻译： 改进具有异构计算云的数据中心运行的系统可能包括监视组件以跟踪数据中心气候控制和数据中心内的个别异构计算云运行参数。 该系统还可以包括控制器，其基于由监视组件生成的数据来调节各个异构计算云和数据中心气候控制，以改善各个异构计算云的操作性能以及数据中心的操作性能。 该系统可以进一步包括溢出计算云以接收单个异构计算云的额外的工作量，而不违反个别的异构计算云合同。

公开(公告)号：US20120254400A1

公开(公告)日：2012-10-04

申请号：US13077578

申请日：2011-03-31

申请人： Madhusudan K. Iyengar ,  Vinod Kamath ,  Eren Kursun ,  Roger R. Schmidt

发明人： Madhusudan K. Iyengar ,  Vinod Kamath ,  Eren Kursun ,  Roger R. Schmidt

IPC分类号： G06F15/173

CPC分类号： G06F9/5094 ,  Y02D10/22

摘要： A system to improve operation of a data center with heterogeneous computing clouds may include monitoring components to track data center climate controls and individual heterogeneous computing clouds' operating parameters within the data center. The system may also include a controller that regulates the individual heterogeneous computing clouds and data center climate controls based upon data generated by the monitoring components to improve the operating performance of the individual heterogeneous computing clouds as well as the operating performance of the data center. The system may further include spilling computing clouds to receive excess workload of an individual heterogeneous computing cloud without violating individual heterogeneous computing clouds contracts.

摘要翻译： 改进具有异构计算云的数据中心运行的系统可能包括监视组件以跟踪数据中心气候控制和数据中心内的个别异构计算云运行参数。 该系统还可以包括控制器，其基于由监视组件生成的数据来调节各个异构计算云和数据中心气候控制，以改善各个异构计算云的操作性能以及数据中心的操作性能。 该系统可以进一步包括溢出计算云以接收单个异构计算云的额外的工作量，而不违反个别的异构计算云合同。

公开(公告)号：US08913384B2

公开(公告)日：2014-12-16

申请号：US13527947

申请日：2012-06-20

申请人： Milnes P. David ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Pritish R. Parida ,  Roger R. Schmidt ,  Mark E. Steinke

发明人： Milnes P. David ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Pritish R. Parida ,  Roger R. Schmidt ,  Mark E. Steinke

IPC分类号： H05K7/20 ,  H05K13/00

CPC分类号： H05K7/20745 ,  H05K7/2079 ,  H05K13/00

摘要： Cooling apparatuses and coolant-cooled electronic systems are provided which include thermal transfer structures configured to engage with a spring force one or more electronics cards with docking of the electronics card(s) within a respective socket(s) of the electronic system. A thermal transfer structure of the cooling apparatus includes a thermal spreader having a first thermal conduction surface, and a thermally conductive spring assembly coupled to the conduction surface of the thermal spreader and positioned and configured to reside between and physically couple a first surface of an electronics card to the first surface of the thermal spreader with docking of the electronics card within a socket of the electronic system. The thermal transfer structure is, in one embodiment, metallurgically bonded to a coolant-cooled structure and facilitates transfer of heat from the electronics card to coolant flowing through the coolant-cooled structure.

摘要翻译： 提供冷却装置和冷却剂冷却的电子系统，其包括热传递结构，其被配置成与弹簧力接合一个或多个电子卡，其中电子卡在电子系统的相应插座内对接。 冷却装置的热传递结构包括具有第一热传导表面的散热器和耦合到散热器的导电表面的导热弹簧组件，并被定位和配置成驻留在物理上耦合电子器件的第一表面 卡到散热器的第一表面，使电子卡在电子系统的插座内对接。 在一个实施例中，热传递结构是冶金结合到冷却剂冷却结构，并且有助于将热量从电子卡传递到流过冷却剂冷却结构的冷却剂。

公开(公告)号：US20130192794A1

公开(公告)日：2013-08-01

申请号：US13361929

申请日：2012-01-30

申请人： Timothy J. Chainer ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark E. Steinke

发明人： Timothy J. Chainer ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark E. Steinke

IPC分类号： F28F9/00

CPC分类号： H05K13/00 ,  H01L21/4882 ,  H01L23/40 ,  H01L23/42 ,  H01L23/44 ,  H01L23/467 ,  H01L23/473 ,  H01L2224/16225 ,  H05K7/20009 ,  H05K7/20254 ,  Y10T29/49117

摘要： Several apparatuses and methods for providing cooling system interchangeability. One apparatus includes a thermally conductive plate thermally coupled to an integrated circuit. The thermally conductive plate is configured to couple interchangeably to a liquid cooling assembly or an air cooling assembly, and the liquid cooling assembly and the air cooling assembly are separate devices.

摘要翻译： 提供冷却系统互换性的几种设备和方法。 一种装置包括热耦合到集成电路的导热板。 导热板被配置为可互换地耦合到液体冷却组件或空气冷却组件，并且液体冷却组件和空气冷却组件是分离的装置。

公开(公告)号：US07660109B2

公开(公告)日：2010-02-09

申请号：US11957619

申请日：2007-12-17

申请人： Madhusudan K. Iyengar ,  Vinod Kamath ,  Jason A. Matteson ,  Roger R. Schmidt ,  Mark E. Steinke

发明人： Madhusudan K. Iyengar ,  Vinod Kamath ,  Jason A. Matteson ,  Roger R. Schmidt ,  Mark E. Steinke

IPC分类号： H05K7/20 ,  F25D23/12

CPC分类号： H05K7/20754 ,  F25D17/06 ,  F25D2317/0655 ,  F25D2317/0661 ,  Y10T29/49826

摘要： Apparatus and method are provided for facilitating air-cooling of an electronics system employing a vapor-compression heat exchange system, and front and back covers. An evaporator housing of the heat exchange system is mounted to a system housing of the electronics system and extends at least partially between air inlet and outlet sides of the system housing. The evaporator housing includes air inlet and outlet openings, and an evaporator. The front cover is mounted to the system or evaporator housing adjacent to the air inlet side or air outlet opening, and the back cover is mounted to the system or evaporator housing adjacent to the air outlet side or air inlet opening. Together, the system housing, back cover, evaporator housing and front cover define a closed loop airflow path passing through the system housing and evaporator housing, with the vapor-compression heat exchange system cooling air circulating therethrough.

摘要翻译： 提供了用于促进采用蒸气压缩热交换系统的电子系统以及前后盖的空气冷却的装置和方法。 热交换系统的蒸发器壳体安装到电子系统的系统壳体，并且至少部分地延伸到系统壳体的空气入口侧和出口侧之间。 蒸发器壳体包括空气入口和出口以及蒸发器。 前盖与空气入口侧或空气出口开口相邻地安装在系统或蒸发器壳体上，后盖与空气出口侧或进气口相邻地安装在系统或蒸发器壳体上。 系统壳体，后盖，蒸发器壳体和前盖一起限定通过系统壳体和蒸发器壳体的闭环气流路径，其中蒸气压缩热交换系统冷却空气循环通过。

公开(公告)号：US07639499B1

公开(公告)日：2009-12-29

申请号：US12168259

申请日：2008-07-07

申请人： Levi A. Campbell ,  Richard C. Chu ,  Martin J. Crippen ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Jason A. Matteson ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Martin J. Crippen ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Jason A. Matteson ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/20772

摘要： Apparatus and method are provided for facilitating liquid cooling one or more components of an electronic subsystem chassis disposed within an electronics rack. The apparatus includes a rack-level coolant manifold assembly and at least one movable chassis-level manifold subassembly. The rack-level coolant manifold assembly includes a rack-level inlet manifold and a rack-level outlet manifold, and each movable chassis-level manifold subassembly includes a chassis-level coolant inlet manifold coupled in fluid communication with the rack-level inlet manifold, and a chassis-level coolant outlet manifold coupled in fluid communication with the rack-level outlet manifold. The chassis-level manifold subassembly is slidably coupled to the electronics rack to facilitate access to one or more removable components of the electronic subsystem chassis. In one embodiment, the electronics subsystem chassis is a multi-blade center system having multiple removable blades, each blade being an electronics subsystem.

摘要翻译： 提供了设备和方法，以便于液体冷却设置在电子机架内的电子子系统机架的一个或多个部件。 该设备包括机架级冷却剂歧管组件和至少一个可移动底盘级歧管组件。 机架级冷却剂歧管组件包括机架级入口歧管和机架级出口歧管，并且每个可移动底盘级歧管组件包括与机架级入口歧管流体连通地联接的底盘级冷却剂入口歧管， 以及与所述齿条级出口歧管流体连通地联接的底盘级冷却剂出口歧管。 底盘级歧管子组件可滑动地联接到电子机架，以便于接近电子子系统底盘的一个或多个可拆卸部件。 在一个实施例中，电子系统底盘是具有多个可移除刀片的多刀片中心系统，每个刀片是电子子系统。

公开(公告)号：US09307674B2

公开(公告)日：2016-04-05

申请号：US13102200

申请日：2011-05-06

申请人： Timothy J. Chainer ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark E. Steinke

发明人： Timothy J. Chainer ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark E. Steinke

IPC分类号： H01L23/427 ,  H01L23/473 ,  H05K7/20 ,  F28D15/02

CPC分类号： H05K7/20336 ,  F28D15/02 ,  H05K7/20509 ,  H05K7/20772 ,  H05K7/20936

摘要： Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

公开(公告)号：US09027360B2

公开(公告)日：2015-05-12

申请号：US13102195

申请日：2011-05-06

申请人： Timothy J. Chainer ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark E. Steinke

发明人： Timothy J. Chainer ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark E. Steinke

IPC分类号： F25D23/12 ,  F25D17/06

CPC分类号： H05K7/20763 ,  F25B21/02 ,  F25B21/04 ,  F25D17/06 ,  H05K7/20254 ,  H05K7/20263 ,  H05K7/20781 ,  H05K7/2079 ,  H05K7/20836

摘要： Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled structure, a thermal conduction path coupling the electronic component and the liquid-cooled structure, a coolant loop in fluid communication with a coolant-carrying channel of the liquid-cooled structure, and an outdoor-air-cooled heat exchange unit coupled to facilitate heat transfer from the liquid-cooled structure via, at least in part, the coolant loop. The thermoelectric array facilitates transfer of heat from the electronic component to the liquid-cooled structure, and the heat exchange unit cools coolant passing through the coolant loop by dissipating heat from the coolant to outdoor ambient air. In one implementation, temperature of coolant entering the liquid-cooled structure is greater than temperature of the outdoor ambient air to which heat is dissipated.

摘要翻译： 提供了用于促进电子部件的冷却的装置和方法。 该装置包括液冷结构，耦合电子部件和液冷结构的热传导路径，与液冷结构的冷却剂传送通道流体连通的冷却剂回路，室外空气冷却 热交换单元被耦合以便于至少部分地通过冷却剂回路从液冷结构经由热传递。 热电阵列有助于将热量从电子部件传递到液冷结构，并且热交换单元通过将冷却剂的热量散发到室外环境空气来冷却通过冷却剂回路的冷却剂。 在一个实施方案中，进入液冷结构的冷却剂的温度大于散热的室外环境空气的温度。

公开(公告)号：US08493738B2

公开(公告)日：2013-07-23

申请号：US13102211

申请日：2011-05-06

申请人： Timothy J. Chainer ,  Michael A. Gaynes ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark D. Schultz ,  Daniel P. Simco ,  Mark E. Steinke

发明人： Timothy J. Chainer ,  Michael A. Gaynes ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark D. Schultz ,  Daniel P. Simco ,  Mark E. Steinke

IPC分类号： H05K7/20

CPC分类号： H05K7/20772 ,  H05K7/20781 ,  H05K7/2079

摘要： Liquid-cooled electronic systems are provided which include an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket or removal of the card from the socket. A liquid-cooled cold rail is disposed at the one end of the socket, and a thermal spreader couples the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The thermally conductive extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.

摘要翻译： 提供液冷电子系统，其包括具有电子卡的电子组件和在一端具有闩锁的插座。 闩锁有助于将卡固定在插座内或从插座中取出卡。 液冷冷轨布置在插座的一端，散热器将电子卡连接到冷轨。 热散布器包括耦合到卡的相对侧上的第一和第二表面的第一和第二热传递板，以及从板的端部边缘延伸的导热延伸件，其将相应的传递板联接到液体冷却的冷轨。 导热延伸部设置在闩锁的侧面，并且卡可以使用闩锁固定在插座内或从插座中移除而不移除冷轨或散热器。

公开(公告)号：US08649177B2

公开(公告)日：2014-02-11

申请号：US13451714

申请日：2012-04-20

申请人： Timothy J. Chainer ,  Michael A. Gaynes ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark D. Schultz ,  Daniel P. Simco ,  Mark E. Steinke

发明人： Timothy J. Chainer ,  Michael A. Gaynes ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark D. Schultz ,  Daniel P. Simco ,  Mark E. Steinke

IPC分类号： H05K7/20

CPC分类号： H05K7/20772 ,  H05K7/20781 ,  H05K7/2079

摘要： A method of fabricating a liquid-cooled electronic system is provided which includes an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket. The method includes providing a liquid-cooled cold rail at the one end of the socket, and a thermal spreader to couple the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.

摘要翻译： 提供一种制造液冷电子系统的方法，其包括具有电子卡的电子组件和在一端具有闩锁的插座。 闩锁有助于将卡固定在插座内。 该方法包括在插座的一端提供液冷冷轨，以及将电子卡耦合到冷轨的散热器。 热散布器包括耦合到卡的相对侧上的第一和第二表面的第一和第二热传递板，以及从板的端部边缘延伸的导热延伸件，其将相应的传递板联接到液体冷却的冷轨。 延伸件设置在闩锁的侧面，并且卡可以使用闩锁固定在插座内或从插座中移除，而不移除冷轨或散热器。