Abstract:
According to one embodiment, an imaging device includes a semiconductor substrate having a first conductivity type, a well region which is arranged on a front surface side of the semiconductor substrate and has the first conductivity type, photodiodes which are arranged in the well region and have a second conductivity type, a diffusion layer which is arranged between the photodiodes, supplies a potential to the well region, and has the first conductivity type, an overflow drain layer which is arranged on a back surface side of the semiconductor substrate and has the second conductivity type, an overflow drain electrode which extends from the front surface side of the semiconductor substrate to the overflow drain layer and supplies a bias potential to the overflow drain layer from the front surface side of the semiconductor substrate, and a wiring layer which is arranged on the front surface of the semiconductor substrate.
Abstract:
According to one embodiment, a solid-state image sensing device for reading out, via an output circuit, a reset signal and a pixel signal from a pixel unit which performs photoelectric conversion includes a comparator which compares a signal read out from the pixel unit with a reference signal, a counter which counts clocks input until a pulse signal indicating a comparison result from the comparator is obtained, and a counter controller which prevents the counter from performing an operation of stopping pixel signal counting, based on an output result of the reset signal from the comparator.
Abstract:
According to one embodiment, a solid state imaging device includes a first photodiode, a first transistor, a floating diffusion, a second transistor, a third transistor. The first photodiode performs photoelectric conversion and accumulates a charge obtained. The first transistor reads the charge. The floating diffusion is one end of a current pathway of the first transistor. The charge is read through the first transistor to the first node. The second transistor's gate is connected to the first node. The second transistor's one end of a current pathway is connected to a vertical signal line. The one end of a current pathway of the third transistor is connected to the floating diffusion. Another end is connected to a power supply. The charge accumulated in the floating diffusion is discharged to the power supply by turning on the third transistor.
Abstract:
According to an embodiment, an image sensor is provided for photoelectrically converting blue light, green light and red light for each pixel. A photoelectric conversion layer for red light is provided having a light absorption coefficient that is different than the light absorption coefficient of the photoelectric conversion layers for blue light and green light.
Abstract:
According to one embodiment, a solid-state imaging device includes: a pixel array section in which pixels that accumulate photoelectrically-converted charges are arranged in a matrix shape; and an analog-voltage stabilizing circuit configured to supply, when an analog voltage exceeds a predetermined value, the analog voltage as a power supply voltage for the pixels and supply, when the analog voltage is equal to or smaller than the predetermined value, the analog voltage as the power supply voltage for the pixels after boosting the analog voltage.
Abstract:
According to one embodiment, a solid-state imaging device includes a pixel array, two signal lines and a row scanning circuit. The row scanning circuit simultaneously renders conductive, by the first read-out row scanning circuit and the second read-out row scanning circuit, the two transfer transistors, which are connected to two photoelectric conversion elements do not share a floating diffusion portion neighboring in the column direction, thereby reading out signals in parallel from the photoelectric conversion elements of the pixels of two rows of an odd-numbered row and an even-numbered row.
Abstract:
While a drain power source of a reset transistor and a drain power source of an amplifying transistor are separated, the load of drain power source can be reduced by sharing a drain diffusion layer of the reset transistor and a drain diffusion layer of the amplifying transistor and a pixel amp transistor by adjacent cells in sharing pixel units. Further, it is possible to perform layout setting for the floating diffusions such that parasitic capacitances between the floating diffusions are equal to each other. It is possible to prevent step-like noise from occurring among the pixels while improving sensitivity.
Abstract:
While a drain power source of a reset transistor and a drain power source of an amplifying transistor are separated, the load of drain power source can be reduced by sharing a drain diffusion layer of the reset transistor and a drain diffusion layer of the amplifying transistor by adjacent cells in sharing pixel units. Further, an efficient pixel layout is provided by reducing the number of routing wires.