-
公开(公告)号：US20090191791A1
公开(公告)日：2009-07-30
申请号：US12320471
申请日：2009-01-27
申请人： Makoto Fukushima , Tetsuji Togawa , Hozumi Yasuda , Osamu Nabeya , Shingo Saito
发明人： Makoto Fukushima , Tetsuji Togawa , Hozumi Yasuda , Osamu Nabeya , Shingo Saito
CPC分类号： B24B37/345
摘要： A polishing method can safely detach and lift up a workpiece from a polishing surface without carrying out the operation of making the workpiece overhang the polishing surface. The polishing method includes carrying out processing of a surface to be polished of a workpiece by supplying a liquid to a polishing surface while pressing the surface to be polished of the workpiece held by a holding device against the polishing surface and moving the workpiece and the polishing surface relative to each other, attracting the workpiece after the processing to the holding device while supplying the liquid to the polishing surface at a decreased flow rate, thereby detaching the workpiece from the polishing surface, and lifting up the holding device together with the workpiece on confirmation of detachment of the workpiece from the polishing surface and attachment of the workpiece to the holding device.
摘要翻译： 抛光方法可以安全地从抛光表面上分离和提起工件，而不必进行使工件伸出抛光表面的操作。 抛光方法包括：通过向抛光表面供给液体来进行待研磨表面的加工，同时将由保持装置保持的工件的待抛光表面压在抛光表面上并移动工件和抛光 相对于彼此的表面，在将处理后的工件吸收到保持装置的同时，以降低的流量向抛光表面供给液体，从而将工件从抛光表面分离，并将工件与工件一起提起 确认工件与抛光表面分离并将工件附着到保持装置上。
-
公开(公告)号：US08430716B2
公开(公告)日：2013-04-30
申请号：US12320471
申请日：2009-01-27
申请人： Makoto Fukushima , Tetsuji Togawa , Hozumi Yasuda , Osamu Nabeya , Shingo Saito
发明人： Makoto Fukushima , Tetsuji Togawa , Hozumi Yasuda , Osamu Nabeya , Shingo Saito
IPC分类号： B24B7/22
CPC分类号： B24B37/345
摘要： A polishing method can safely detach and lift up a workpiece from a polishing surface without carrying out the operation of making the workpiece overhang the polishing surface. The polishing method includes carrying out processing of a surface to be polished of a workpiece by supplying a liquid to a polishing surface while pressing the surface to be polished of the workpiece held by a holding device against the polishing surface and moving the workpiece and the polishing surface relative to each other, attracting the workpiece after the processing to the holding device while supplying the liquid to the polishing surface at a decreased flow rate, thereby detaching the workpiece from the polishing surface, and lifting up the holding device together with the workpiece on confirmation of detachment of the workpiece from the polishing surface and attachment of the workpiece to the holding device.
-
公开(公告)号：US20080318499A1
公开(公告)日：2008-12-25
申请号：US12222909
申请日：2008-08-19
申请人： Hozumi Yasuda , Tetsuji Togawa , Osamu Nabeya , Kenichiro Saito , Makoto Fukushima , Tomoshi Inoue
发明人： Hozumi Yasuda , Tetsuji Togawa , Osamu Nabeya , Kenichiro Saito , Makoto Fukushima , Tomoshi Inoue
IPC分类号： B24B1/00
CPC分类号： B24B37/32
摘要： A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring includes a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.
摘要翻译： 基板保持装置防止基板滑出并允许基板被稳定地抛光。 基板保持装置具有用于将基板保持并压靠在研磨面上的顶环体，以及用于按压研磨面的保持环，保持环设置在顶环体的外周部。 保持环包括由磁性材料制成的第一构件和具有设置在其表面上的磁体的第二构件，该磁体保持抵靠第一构件。
-
公开(公告)号：US20060234609A1
公开(公告)日：2006-10-19
申请号：US11452218
申请日：2006-06-14
申请人： Tetsuji Togawa , Ikutaro Noji , Keisuke Namiki , Hozumi Yasuda , Shunichiro Kojima , Kunihiko Sakurai , Nobuyuki Takada , Osamu Nabeya , Makoto Fukushima , Hideki Takayanagi
发明人： Tetsuji Togawa , Ikutaro Noji , Keisuke Namiki , Hozumi Yasuda , Shunichiro Kojima , Kunihiko Sakurai , Nobuyuki Takada , Osamu Nabeya , Makoto Fukushima , Hideki Takayanagi
CPC分类号： B24B37/30 , B24B41/061
摘要： The present invention relates to a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against a polishing surface. The substrate holding apparatus comprises a top ring body for holding a substrate, an elastic pad for being brought into contact with the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further comprises a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for being brought into contact with the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus further comprises a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.
-
公开(公告)号：US08485866B2
公开(公告)日：2013-07-16
申请号：US13587371
申请日：2012-08-16
申请人： Hozumi Yasuda , Tetsuji Togawa , Osamu Nabeya , Kenichiro Saito , Makoto Fukushima , Tomoshi Inoue
发明人： Hozumi Yasuda , Tetsuji Togawa , Osamu Nabeya , Kenichiro Saito , Makoto Fukushima , Tomoshi Inoue
CPC分类号： B24B37/32
摘要： A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring includes a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.
摘要翻译： 基板保持装置防止基板滑出并允许基板被稳定地抛光。 基板保持装置具有用于将基板保持并压靠在研磨面上的顶环体，以及用于按压研磨面的保持环，保持环设置在顶环体的外周部。 保持环包括由磁性材料制成的第一构件和具有设置在其表面上的磁体的第二构件，该磁体保持抵靠第一构件。
-
公开(公告)号：US08267746B2
公开(公告)日：2012-09-18
申请号：US12222909
申请日：2008-08-19
申请人： Hozumi Yasuda , Tetsuji Togawa , Osamu Nabeya , Kenichiro Saito , Makoto Fukushima , Tomoshi Inoue
发明人： Hozumi Yasuda , Tetsuji Togawa , Osamu Nabeya , Kenichiro Saito , Makoto Fukushima , Tomoshi Inoue
IPC分类号： B24B47/02
CPC分类号： B24B37/32
摘要： A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring includes a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.
摘要翻译： 基板保持装置防止基板滑出并允许基板被稳定地抛光。 基板保持装置具有用于将基板保持并压靠在研磨面上的顶环体，以及用于按压研磨面的保持环，保持环设置在顶环体的外周部。 保持环包括由磁性材料制成的第一构件和具有设置在其表面上的磁体的第二构件，该磁体保持抵靠第一构件。
-
公开(公告)号：US20120071065A1
公开(公告)日：2012-03-22
申请号：US13304931
申请日：2011-11-28
申请人： Osamu NABEYA , Tetsuji Togawa , Makoto Fukushima , Hozumi Yasuda
发明人： Osamu NABEYA , Tetsuji Togawa , Makoto Fukushima , Hozumi Yasuda
IPC分类号： B24B7/10
CPC分类号： B24B37/20 , B24B37/005 , B24B37/10 , B24B37/105 , B24B37/30 , B24B37/32 , B24B47/22 , B24B49/00 , B24B49/16
摘要： A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.
摘要翻译： 抛光装置具有抛光垫，用于保持半导体晶片的顶环，以及可操作以在垂直方向上移动顶环的垂直移动机构。 抛光装置还具有距离测量传感器，该距离测量传感器可操作以当顶环的下表面与抛光垫接触时检测顶环的位置，以及控制器，其可操作以计算顶环的最佳位置进行抛光 基于由距离测量传感器检测到的位置的半导体晶片。 垂直移动机构包括可操作以将顶环移动到最佳位置的滚珠丝杠机构。
-
公开(公告)号：US07967665B2
公开(公告)日：2011-06-28
申请号：US11730142
申请日：2007-03-29
申请人： Hozumi Yasuda , Tetsuji Togawa , Osamu Nabeya , Kenichiro Saito , Makoto Fukushima , Tomoshi Inoue
发明人： Hozumi Yasuda , Tetsuji Togawa , Osamu Nabeya , Kenichiro Saito , Makoto Fukushima , Tomoshi Inoue
IPC分类号： B24B29/00
CPC分类号： B24B37/32
摘要： A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring includes a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.
摘要翻译： 基板保持装置防止基板滑出并允许基板被稳定地抛光。 基板保持装置具有用于将基板保持并压靠在研磨面上的顶环体，以及用于按压研磨面的保持环，保持环设置在顶环体的外周部。 保持环包括由磁性材料制成的第一构件和具有设置在其表面上的磁体的第二构件，该磁体保持抵靠第一构件。
-
公开(公告)号：USD634719S1
公开(公告)日：2011-03-22
申请号：US29356450
申请日：2010-02-25
-
公开(公告)号：US07850509B2
公开(公告)日：2010-12-14
申请号：US12285936
申请日：2008-10-16
申请人： Tetsuji Togawa , Ikutaro Noji , Keisuke Namiki , Hozumi Yasuda , Shunichiro Kojima , Kunihiko Sakurai , Nobuyuki Takada , Osamu Nabeya , Makoto Fukushima , Hideki Takayanagi
发明人： Tetsuji Togawa , Ikutaro Noji , Keisuke Namiki , Hozumi Yasuda , Shunichiro Kojima , Kunihiko Sakurai , Nobuyuki Takada , Osamu Nabeya , Makoto Fukushima , Hideki Takayanagi
IPC分类号： B24B7/22
CPC分类号： B24B37/30 , B24B41/061
摘要： The present invention relates to a substrate holding apparatus for holding and pressing a substrate against a polishing surface. The substrate holding apparatus includes a top ring body for holding the substrate, an elastic pad for contacting the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further includes a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for contacting the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus also includes a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.
摘要翻译： 本发明涉及一种用于将基板保持并压靠在抛光表面上的基板保持装置。 基板保持装置包括用于保持基板的顶环体，用于接触基板的弹性垫和用于支撑弹性垫的支撑构件。 基板保持装置还包括安装在支撑构件的下表面上并设置在由弹性垫和支撑构件形成的空间中的接触构件。 接触构件具有用于接触弹性垫的弹性膜。 第一压力室限定在接触构件中，并且第二压力室限定在接触构件的外部。 基板保持装置还包括用于独立地向第一压力室和第二压力室供应流体或产生真空的流体源。
-
-
-
-
-
-
-
-
-
搜索结果
67 条记录 (耗时 0.035 秒)