摘要:
An energy beam method and apparatus for processing a workpiece is accomplished by making the energy density per unit time and unit area of the energy beam proportional to the traveling velocity of the workpiece. This is accomplished by adjusting the frequency, irradiation power, or duty cycle of the energy beam. The travel velocity of the workpiece is measured by using a linear scale to generate pulse signals, calculating a traveling velocity based on the pulse signals and generating a pulse signal, dividing the pulse signals output by the calculation step, and generating a trigger signal in response to the pulse signals created by the dividing step to drive an energy beam irradiation device (such as a laser generator) to output the energy beam.
摘要:
A method and apparatus for machining an electrically conductive film at a low cost, suitable for multi-product small-amount production are provided to reduce variations in resulting dimensions, a partially remaining conductive film, damage to an insulating substrate, and so on after machining, while eliminating the need for a waste liquid treatment. The apparatus includes a YAG laser for emitting near infrared light (at wavelength &lgr;=1064 nm), an optical system including a step index optical fiber for guiding the laser light emitted from the laser to the vicinity of an electrically conductive film on an insulating transparent substrate, an X-Y stage having a carrier for carrying the transparent substrate thereon, and a controller for controlling and driving the X-Y stage to move the transparent substrate in a direction orthogonal to a direction in which the laser light is irradiated. Instead of the optical fiber, a kaleidoscope may be used. The carrier can include a recess below at least a portion of the workpiece, which can be a touch panel or liquid crystal panel.
摘要:
A non-aqueous electrolyte solution containing a cyclic sulfone compound having a 1,3-dithietane-1,1,3,3-tetraoxide structure is provided. The cyclic sultone compound is preferably a compound represented by formula (I) [wherein in formula (I), R1 to R4 each represent a hydrogen atom, a halogen atom, a substituted or unsubstituted alkyl group, or the like].
摘要:
A copper alloy having excellent sliding performance is produced without relying on lead or molybdenum. The copper alloy contains a sintered Cu5FeS4 material produced by sintering a raw material powder that comprises Cu, Fe and S and is produced by a gas atomizing method.
摘要:
A bronze alloy includes copper, tin, bismuth, nickel and sulfur and a metal structure of the bronze alloy has an eutectoid phase including α-copper having a lamellar structure including a flaky copper-tin intermetallic compound precipitated and metal particles including the bismuth dispersedly precipitated therein.
摘要:
Disclosed is a lead-free copper alloy for casting which contains 0.1-0.7% of S, 8% or less (excluding 0%) of Sn, and 6% or less (excluding 0%) of Zn, and in which a sulfide is dispersed and the average spheroidization ratio of the sulfide is 0.7 or greater. Due to this constitution, said lead-free copper alloy for casting has excellent mechanical properties such as strength, high pressure resistance and good machinability and, therefore, is useful as a starting material for faucet metal fittings, water faucet and so on, even though the alloy contains no lead which causes deterioration of water.
摘要:
A writing lead (10) is grasped and released by reciprocation of a chuck (3) provided in a body cylinder (1) so as to inch the writing lead forward and a rotational drive mechanism is provided for rotationally driving a rotor (5) in one direction in conjunction with retreat operation by the writing pressure applied to the writing lead and forward movement by releasing the writing pressure. A pipe support member (8) for supporting a pipe end (7) is accommodated in a base (1A) which constitutes a front end portion of the body cylinder, and a retreat drive mechanism is provided for gradually retreating the pipe support member into the body cylinder in conjunction with rotational drive operation of the rotor. With the above-mentioned structure, a pipe-slide type mechanical pencil can maintain an amount of projection of the writing lead from the pipe end within a certain range.
摘要:
A method of producing a compound represented by the following general formula (3): [wherein R is a bivalent aliphatic group having a carbon number of 1-16 or a bivalent aromatic group], which comprises a step (i) of reacting a compound represented by the following general formula (1): with a carboxylic acid halide represented by the following general formula (2): [wherein R is a bivalent aliphatic group having a carbon number of 1-16 or a bivalent aromatic group and X is a halogen atom] in the presence of a basic compound to form an ester, and a step (ii) of conducting a heat treatment after the step (i) to decompose an oligomer in the ester.
摘要:
The present invention provides methods for the generation of viable reoviruses using only cloned nucleic acid segments representing the RNA segments of the reovirus genome.
摘要:
The present invention provides a vertical heat treatment boat that has at least four or more support portions per processing target substrate to be supported, the support portions horizontally supporting the processing target substrate, support auxiliary members on which the processing target substrate is mounted being detachably attached to the four or more support portions, respectively, wherein flatness obtained from all surfaces of the respective support auxiliary members on which the processing target substrate is mounted is adjusted by adjusting thicknesses of the support auxiliary members or interposing spacers between the support portions and the support auxiliary members in accordance with respective shapes of the four or more support portions. As a result, it is provided the vertical heat treatment boat and a heat treatment method for a semiconductor wafer that can readily improve flatness in support of the processing target substrate and effectively prevent occurrence of slip dislocation when performing a heat treatment to the processing target substrate such as a semiconductor wafer by using a vertical heat treatment furnace.