Ear type clinical thermometer
    4.
    发明授权
    Ear type clinical thermometer 有权
    耳式体温计

    公开(公告)号:US07063458B1

    公开(公告)日:2006-06-20

    申请号:US10009595

    申请日:2000-06-09

    IPC分类号: G01J5/04 G01K1/00 A61B5/01

    摘要: An object of the present invention is to provide an ear type clinical thermometer in which the main body can be held according to the position of the eardrum of the person whose temperature is being measured. There is provided an ear type clinical thermometer comprising: a main body to be held by hand at a time when an eardrum temperature is to be measured; and a probe fixed to the main body while protruding from the main body and to be inserted into an external auditory canal of a person whose eardrum temperature is to be measured at the time when the measurement is to be taken. The main body has a side at which the probe protrudes from the main body and a side opposite to this side, and the side opposite to the side at which the probe protrudes from the main body is constructed of a curved surface having a substantially constant curvature along a direction perpendicular to a reference plane containing the center axis of the probe. Further, the main body has an indicator for allowing a user to recognize a plurality of methods of holding the main body which differ according to directions in which the probe is to be inserted into the external auditory canal of the person whose temperature is to be measured.

    摘要翻译: 本发明的目的是提供一种耳式体温计,其中主体可以根据正在测量温度的人的鼓膜的位置来保持。 提供了一种耳式体温计,其包括:在要测量鼓膜温度的时候用手握持的主体; 以及固定到主体的探针,同时从主体突出并插入到要测量鼓膜温度的人的外耳道中。 主体具有探针从主体突出的一侧和与该侧相反的一侧,并且与探头从主体突出的一侧相反的一侧由具有基本恒定曲率的曲面构成 沿垂直于包含探针的中心轴的参考平面的方向。 此外,主体具有指示器,用于使用户能够识别根据要测量的探针插入到要测量的人的外耳道的外耳道中的方向不同的多个保持方法 。

    Infrared thermometer
    5.
    发明授权
    Infrared thermometer 失效
    红外线温度计

    公开(公告)号:US06513970B1

    公开(公告)日:2003-02-04

    申请号:US09807828

    申请日:2001-04-19

    IPC分类号: G01J500

    摘要: An infrared sensor 20 is held in a housing 10 by a sensor holder 28 made of synthetic resin. A waveguide 30 for guiding infrared radiation, which is emitted from a target, to the infrared sensor 20 is supported by waveguide holders 31, 32 made of synthetic resin (or metal). An air layer (insulative layer, gap) 34 resides between an inner end (terminal end) 30b of the waveguide 30 and the infrared sensor 20. A probe 40 made of synthetic resin surrounding an externally protruding portion of the waveguide 30 is provided. An air layer (insulating layer, gap) 33 resides between the tip of the probe 40 and a tip (outer end) 30a of the waveguide 30. The tip of the waveguide 30 is covered by a cap 50.

    摘要翻译: 红外传感器20通过由合成树脂制成的传感器保持器28保持在壳体10中。 用于将从目标射出的红外线引导到红外传感器20的波导管30由由合成树脂(或金属)制成的波导保持器31,32支撑。 在波导管30的内端(末端)30b和红外线传感器20之间设有空气层(绝缘层,间隙)34。设置由围绕波导管30的外部突出部分的合成树脂构成的探针40。 探针40的前端与波导管30的前端(外端)30a之间存在空气层(绝缘层,间隙)33。波导30的前端由盖50覆盖。

    Infrared ray clinical thermometer

    公开(公告)号:US06612735B2

    公开(公告)日:2003-09-02

    申请号:US10157018

    申请日:2002-05-30

    IPC分类号: G01K108

    摘要: An infrared ray clinical thermometer enhanced in fitted probe cover stability is provided with a simple structure. A mechanism for detecting the presence or absence of a fitted probe cover is provided near the root of a probe, and is mainly composed of a slide member as a movable part, a spring as thrusting means for thrusting the slide member, and a switch for making contact with and departing from the slide member. The slide member is movable disposed in a direction nearly perpendicular to the detaching direction of the probe cover, that is, from the inner side to the outer side, and from the outer side to the inner side of the probe.

    Method for polishing a semiconductor wafer
    7.
    发明授权
    Method for polishing a semiconductor wafer 有权
    抛光半导体晶片的方法

    公开(公告)号:US08157617B2

    公开(公告)日:2012-04-17

    申请号:US12542920

    申请日:2009-08-18

    IPC分类号: B24B1/00

    CPC分类号: B24B37/042 H01L21/02024

    摘要: Semiconductor wafers are CMP polished by polishing the rear side of the semiconductor wafer by means of CMP with a material removal with a profile along the diameter of the wafer wherein material removal is higher at the center than at the edge of the rear side; and polishing the front side of the wafer by means of CMP with a material removal with a profile along the diameter of the wafer wherein material removal is lower in the center of the front side than in an edge region of the front side.

    摘要翻译: 半导体晶片通过CMP抛光半导体晶片的后侧,通过沿着晶片直径的轮廓去除材料进行抛光,其中材料去除在中心处比后侧的边缘更高; 并且通过CMP沿着沿着晶片直径的轮廓的材料除去材料抛光晶片的前侧,其中在前侧的中心处的材料去除比在前侧的边缘区域更低。

    Electronic apparatus
    9.
    发明申请
    Electronic apparatus 有权
    电子仪器

    公开(公告)号:US20080150811A1

    公开(公告)日:2008-06-26

    申请号:US11902448

    申请日:2007-09-21

    IPC分类号: H01Q1/22

    摘要: An electronic apparatus includes: a housing provided with a first conductive pattern; a substrate provided with a first wiring layer in a surface thereof and fixed to the housing; and a first conductive member connecting the first conductive pattern and the first wiring layer. The first conductive pattern extends onto an outer surface and an inner surface of the housing. The first conductive member is in contact with each of at least a part of the first conductive pattern extending onto the inner surface and an end of the first wiring layer. Alternatively, an electronic apparatus includes: a housing provided with a conductive pattern and having a through part in a frame portion thereof; and a substrate provided with a wiring layer on a surface thereof and having a protruding part and fixed to the housing. The protruding part and the through part are fit. The conductive pattern extends onto an outer surface of the housing and onto an inner surface of the through part. At least some of the conductive pattern extending onto the inner surface is in contact with an end of the wiring layer.

    摘要翻译: 电子设备包括:具有第一导电图案的壳体; 基板,其在其表面上设置有第一布线层并固定到所述壳体; 以及连接第一导电图案和第一布线层的第一导电构件。 第一导电图案延伸到壳体的外表面和内表面上。 第一导电构件与延伸到第一布线层的内表面和端部的第一导电图案的至少一部分中的每一个接触。 或者,电子设备包括:壳体,设置有导电图案,并且在其框架部分中具有通孔部分; 以及在其表面上设置有布线层并且具有突出部并固定到壳体的基板。 突出部分和贯穿部分是合适的。 导电图案延伸到壳体的外表面上并延伸到通孔的内表面上。 延伸到内表面上的至少一些导电图案与布线层的端部接触。