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公开(公告)号:US06513970B1
公开(公告)日:2003-02-04
申请号:US09807828
申请日:2001-04-19
申请人: Makoto Tabata , Tetsuya Sato , Hiroyuki Ota , Shigeru Tomioka
发明人: Makoto Tabata , Tetsuya Sato , Hiroyuki Ota , Shigeru Tomioka
IPC分类号: G01J500
CPC分类号: G01J5/04 , G01J5/0003 , G01J5/0011 , G01J5/0022 , G01J5/02 , G01J5/021 , G01J5/0235 , G01J5/046 , G01J5/049 , G01J5/06 , G01J5/08 , G01J5/0818 , G01J2005/068
摘要: An infrared sensor 20 is held in a housing 10 by a sensor holder 28 made of synthetic resin. A waveguide 30 for guiding infrared radiation, which is emitted from a target, to the infrared sensor 20 is supported by waveguide holders 31, 32 made of synthetic resin (or metal). An air layer (insulative layer, gap) 34 resides between an inner end (terminal end) 30b of the waveguide 30 and the infrared sensor 20. A probe 40 made of synthetic resin surrounding an externally protruding portion of the waveguide 30 is provided. An air layer (insulating layer, gap) 33 resides between the tip of the probe 40 and a tip (outer end) 30a of the waveguide 30. The tip of the waveguide 30 is covered by a cap 50.
摘要翻译: 红外传感器20通过由合成树脂制成的传感器保持器28保持在壳体10中。 用于将从目标射出的红外线引导到红外传感器20的波导管30由由合成树脂(或金属)制成的波导保持器31,32支撑。 在波导管30的内端(末端)30b和红外线传感器20之间设有空气层(绝缘层,间隙)34。设置由围绕波导管30的外部突出部分的合成树脂构成的探针40。 探针40的前端与波导管30的前端(外端)30a之间存在空气层(绝缘层,间隙)33。波导30的前端由盖50覆盖。
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公开(公告)号:US06612735B2
公开(公告)日:2003-09-02
申请号:US10157018
申请日:2002-05-30
申请人: Shigeru Tomioka , Makoto Tabata , Hiroyuki Ota
发明人: Shigeru Tomioka , Makoto Tabata , Hiroyuki Ota
IPC分类号: G01K108
摘要: An infrared ray clinical thermometer enhanced in fitted probe cover stability is provided with a simple structure. A mechanism for detecting the presence or absence of a fitted probe cover is provided near the root of a probe, and is mainly composed of a slide member as a movable part, a spring as thrusting means for thrusting the slide member, and a switch for making contact with and departing from the slide member. The slide member is movable disposed in a direction nearly perpendicular to the detaching direction of the probe cover, that is, from the inner side to the outer side, and from the outer side to the inner side of the probe.
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公开(公告)号:US07434992B2
公开(公告)日:2008-10-14
申请号:US10875682
申请日:2004-06-25
申请人: Makoto Tabata , Hiroyuki Ota , Yoshihide Onishi , Yoshihiko Ogura , Tetsuya Sato , Taiga Sato
发明人: Makoto Tabata , Hiroyuki Ota , Yoshihide Onishi , Yoshihiko Ogura , Tetsuya Sato , Taiga Sato
CPC分类号: G01J5/02 , A61B5/01 , G01J5/021 , G01J5/025 , G01J5/026 , G01J5/04 , G01J5/045 , G01J5/049 , G01J5/12 , G01J5/16 , G01J5/522 , G01J2005/068
摘要: A first thermistor 8 and a second thermistor 9 are arranged forwardly and rearwardly of a thermopile sensor 5. A thermopile chip 55 is arranged and interposed between the first thermistor 8 and an integrated thermistor 57. A sensor cover is mounted in contact with front and side portions of a can portion 59 of a thermopile casing 56. A temperature or a radiant quantity of infrared rays on the front portion of the can portion is estimated from a temperature change of the integrated thermistor per second.
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公开(公告)号:US07380981B2
公开(公告)日:2008-06-03
申请号:US10875636
申请日:2004-06-25
申请人: Makoto Tabata , Hiroyuki Ota , Yoshihide Onishi , Yoshihiko Ogura , Tetsuya Sato , Taiga Sato
发明人: Makoto Tabata , Hiroyuki Ota , Yoshihide Onishi , Yoshihiko Ogura , Tetsuya Sato , Taiga Sato
CPC分类号: G01J5/02 , A61B5/01 , G01J5/021 , G01J5/025 , G01J5/026 , G01J5/04 , G01J5/045 , G01J5/049 , G01J5/12 , G01J5/16 , G01J5/522 , G01J2005/068
摘要: A first thermistor 8 and a second thermistor 9 are arranged forwardly and rearwardly of a thermopile sensor 5. A thermopile chip 55 is arranged and interposed between the first thermistor 8 and an integrated thermistor 57. A sensor cover is mounted in contact with front and side portions of a can portion 59 of a thermopile casing 56. A temperature or a radiant quantity of infrared rays on the front portion of the can portion is estimated from a temperature change of the integrated thermistor per second.
摘要翻译: 第一热敏电阻8和第二热敏电阻9布置在热电堆传感器5的前方和后方。 热电堆芯片55布置在第一热敏电阻8和集成热敏电阻57之间。 传感器盖安装成与热电堆套管56的罐部分59的前部和侧部接触。 根据集成热敏电阻每秒的温度变化估计罐部前面部分的红外线的温度或辐射量。
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公开(公告)号:US07063458B1
公开(公告)日:2006-06-20
申请号:US10009595
申请日:2000-06-09
申请人: Makoto Tabata , Hiroyuki Ota , Tetsuya Sato
发明人: Makoto Tabata , Hiroyuki Ota , Tetsuya Sato
摘要: An object of the present invention is to provide an ear type clinical thermometer in which the main body can be held according to the position of the eardrum of the person whose temperature is being measured. There is provided an ear type clinical thermometer comprising: a main body to be held by hand at a time when an eardrum temperature is to be measured; and a probe fixed to the main body while protruding from the main body and to be inserted into an external auditory canal of a person whose eardrum temperature is to be measured at the time when the measurement is to be taken. The main body has a side at which the probe protrudes from the main body and a side opposite to this side, and the side opposite to the side at which the probe protrudes from the main body is constructed of a curved surface having a substantially constant curvature along a direction perpendicular to a reference plane containing the center axis of the probe. Further, the main body has an indicator for allowing a user to recognize a plurality of methods of holding the main body which differ according to directions in which the probe is to be inserted into the external auditory canal of the person whose temperature is to be measured.
摘要翻译: 本发明的目的是提供一种耳式体温计,其中主体可以根据正在测量温度的人的鼓膜的位置来保持。 提供了一种耳式体温计,其包括:在要测量鼓膜温度的时候用手握持的主体; 以及固定到主体的探针,同时从主体突出并插入到要测量鼓膜温度的人的外耳道中。 主体具有探针从主体突出的一侧和与该侧相反的一侧,并且与探头从主体突出的一侧相反的一侧由具有基本恒定曲率的曲面构成 沿垂直于包含探针的中心轴的参考平面的方向。 此外,主体具有指示器,用于使用户能够识别根据要测量的探针插入到要测量的人的外耳道的外耳道中的方向不同的多个保持方法 。
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公开(公告)号:US07036978B2
公开(公告)日:2006-05-02
申请号:US10311059
申请日:2001-06-13
申请人: Makoto Tabata , Hiroyuki Ota , Yoshihide Onishi , Toshihiko Ogura , Tatsuya Sato , Taiga Sato
发明人: Makoto Tabata , Hiroyuki Ota , Yoshihide Onishi , Toshihiko Ogura , Tatsuya Sato , Taiga Sato
IPC分类号: G01J5/00
CPC分类号: G01J5/02 , A61B5/01 , G01J5/021 , G01J5/025 , G01J5/026 , G01J5/04 , G01J5/045 , G01J5/049 , G01J5/12 , G01J5/16 , G01J5/522 , G01J2005/068
摘要: A first thermistor 8 and a second thermistor 9 are arranged forwardly and rearwardly of a thermopile sensor 5. A thermopile chip 55 is arranged and interposed between the first thermistor 8 and an integrated thermistor 57. A sensor cover is mounted in contact with front and side portions of a can portion 59 of a thermopile casing 56. A temperature or a radiant quantity of infrared rays on the front portion of the can portion is estimated from a temperature change of the integrated thermistor per second.
摘要翻译: 第一热敏电阻8和第二热敏电阻9被布置在热电堆传感器5的前方和后方。热电堆片55布置并置于第一热敏电阻8和集成热敏电阻57之间。传感器盖安装成与前面和侧面 根据集成热敏电阻每秒的温度变化来估计罐部分的前部上的红外线的温度或辐射量。
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公开(公告)号:US08157617B2
公开(公告)日:2012-04-17
申请号:US12542920
申请日:2009-08-18
IPC分类号: B24B1/00
CPC分类号: B24B37/042 , H01L21/02024
摘要: Semiconductor wafers are CMP polished by polishing the rear side of the semiconductor wafer by means of CMP with a material removal with a profile along the diameter of the wafer wherein material removal is higher at the center than at the edge of the rear side; and polishing the front side of the wafer by means of CMP with a material removal with a profile along the diameter of the wafer wherein material removal is lower in the center of the front side than in an edge region of the front side.
摘要翻译: 半导体晶片通过CMP抛光半导体晶片的后侧,通过沿着晶片直径的轮廓去除材料进行抛光,其中材料去除在中心处比后侧的边缘更高; 并且通过CMP沿着沿着晶片直径的轮廓的材料除去材料抛光晶片的前侧,其中在前侧的中心处的材料去除比在前侧的边缘区域更低。
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公开(公告)号:US07907093B2
公开(公告)日:2011-03-15
申请号:US12133410
申请日:2008-06-05
申请人: Satoru Honda , Tomoko Honda , Nobuyoshi Kuroiwa , Masaomi Nakahata , Jun Morimoto , Yoshikazu Hata , Koichi Sato , Akihiro Tsujimura , Makoto Tabata , Minoru Sakurai , Shoji Kato
发明人: Satoru Honda , Tomoko Honda , Nobuyoshi Kuroiwa , Masaomi Nakahata , Jun Morimoto , Yoshikazu Hata , Koichi Sato , Akihiro Tsujimura , Makoto Tabata , Minoru Sakurai , Shoji Kato
IPC分类号: H01Q1/24
CPC分类号: H01Q9/0407 , H01Q1/42 , Y10T29/49016
摘要: An electronic device includes a first molded body having a first frame, the first molded body being provided with a conductive pattern on its outer surface, a second molded body having a second frame, the second molded body being joined to the first molded body, a wiring sheet made of an insulative sheet provided with an interconnection pattern, a circuit board having a feed point, and a feed line having a first end extended to a mating surface of the first frame opposed to the second frame and a second end connected to the conductive pattern. The interconnection pattern has a first end connected to the one end of the feed line. The interconnection pattern has a second end connected to the feed point.
摘要翻译: 一种电子设备,包括具有第一框架的第一模制体,所述第一模制体在其外表面上设置有导电图案,具有第二框架的第二模制体,所述第二模制体与所述第一模制体接合, 由具有互连图案的绝缘片制成的布线片,具有馈电点的电路板和具有延伸到与第二框架相对的第一框架的配合表面的第一端的馈电线和连接到第二框架的第二端 导电图案。 互连图案具有连接到馈送线的一端的第一端。 互连图案具有连接到馈电点的第二端。
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公开(公告)号:US20080150811A1
公开(公告)日:2008-06-26
申请号:US11902448
申请日:2007-09-21
申请人: Tomoko Honda , Nobuyoshi Kuroiwa , Masaomi Nakahata , Jun Morimoto , Satoru Honda , Yoshikazu Hata , Koichi Sato , Akihiro Tsujimura , Makoto Tabata , Minoru Sakurai , Shoji Kato
发明人: Tomoko Honda , Nobuyoshi Kuroiwa , Masaomi Nakahata , Jun Morimoto , Satoru Honda , Yoshikazu Hata , Koichi Sato , Akihiro Tsujimura , Makoto Tabata , Minoru Sakurai , Shoji Kato
IPC分类号: H01Q1/22
CPC分类号: H01Q9/40 , H01Q9/42 , H01Q21/28 , H05K1/0284 , H05K1/144 , H05K3/325 , H05K2201/048 , H05K2201/0999 , H05K2203/167
摘要: An electronic apparatus includes: a housing provided with a first conductive pattern; a substrate provided with a first wiring layer in a surface thereof and fixed to the housing; and a first conductive member connecting the first conductive pattern and the first wiring layer. The first conductive pattern extends onto an outer surface and an inner surface of the housing. The first conductive member is in contact with each of at least a part of the first conductive pattern extending onto the inner surface and an end of the first wiring layer. Alternatively, an electronic apparatus includes: a housing provided with a conductive pattern and having a through part in a frame portion thereof; and a substrate provided with a wiring layer on a surface thereof and having a protruding part and fixed to the housing. The protruding part and the through part are fit. The conductive pattern extends onto an outer surface of the housing and onto an inner surface of the through part. At least some of the conductive pattern extending onto the inner surface is in contact with an end of the wiring layer.
摘要翻译: 电子设备包括:具有第一导电图案的壳体; 基板,其在其表面上设置有第一布线层并固定到所述壳体; 以及连接第一导电图案和第一布线层的第一导电构件。 第一导电图案延伸到壳体的外表面和内表面上。 第一导电构件与延伸到第一布线层的内表面和端部的第一导电图案的至少一部分中的每一个接触。 或者,电子设备包括:壳体,设置有导电图案,并且在其框架部分中具有通孔部分; 以及在其表面上设置有布线层并且具有突出部并固定到壳体的基板。 突出部分和贯穿部分是合适的。 导电图案延伸到壳体的外表面上并延伸到通孔的内表面上。 延伸到内表面上的至少一些导电图案与布线层的端部接触。
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公开(公告)号:USD570473S1
公开(公告)日:2008-06-03
申请号:US29252088
申请日:2006-01-19
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