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公开(公告)号：US07508292B2
公开(公告)日：2009-03-24
申请号：US11979445
申请日：2007-11-02
IPC分类号： H01F5/00
CPC分类号： H01F17/0013 , H01F27/323 , H01F2017/002 , H01F2017/0093 , H03H2001/0092
摘要： The invention relates to surface-mount type coil components having a mounting surface for mounting them on a printed circuit board or hybrid IC (HIC) and provides a coil component having high electrical characteristics. A common mode filter includes a coil conductor formed in a spiral shape, cut ends which are parts of the coil conductor cut to face each other, and bridge conductors formed so that an insulation film is interposed between the coil conductor and the same to connect the cut ends to each other.
摘要翻译： 本发明涉及具有用于将它们安装在印刷电路板或混合IC（HIC）上的安装表面的表面安装型线圈部件，并提供具有高电特性的线圈部件。 共模滤波器包括形成为螺旋形状的线圈导体，作为切断面对的线圈导体的部分的切端，以及形成为使得绝缘膜插入在线圈导体与其之间的桥导体，以将 相互切割。
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公开(公告)号：US20080100409A1
公开(公告)日：2008-05-01
申请号：US11907603
申请日：2007-10-15
IPC分类号： H01F5/00
CPC分类号： H01F17/0006 , H01F17/0013 , H01F27/027 , H01F27/292 , H01F27/323 , H03H2001/0092
摘要： The invention relates to surface-mount type coil components having a mounting surface for mounting them on a printed circuit board or hybrid IC (HIC) and provides a low-cost coil component having a low direct-current resistance. A common mode filter includes a bridge conductor layer which has a bridge conductor one end of which is connected to one end of a lead wire and another end of which is connected to an inner circumferential end of a coil conductor and another bridge conductor one end of which is connected to one end of another lead wire and another end of which is connected to an inner circumferential end of another coil conductor, the bridge conductor layer being formed between two coil conductor layers with an insulation film interposed between the bridge conductor layer and each of the coil conductor layers.
摘要翻译： 本发明涉及具有用于将它们安装在印刷电路板或混合IC（HIC）上的安装表面的表面安装型线圈部件，并提供具有低直流电阻的低成本线圈部件。 共模滤波器包括桥式导体层，该桥式导体层的一端连接到引线的一端并且另一端连接到线圈导体的内圆周端，桥式导体的一端 其连接到另一个引线的一端，另一端连接到另一个线圈导体的内圆周端，桥导体层形成在两个线圈导体层之间，绝缘膜置于桥导体层和每个导体层之间 的线圈导体层。
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公开(公告)号：US08564393B2
公开(公告)日：2013-10-22
申请号：US13293841
申请日：2011-11-10
申请人： Tomonaga Nishikawa , Makoto Yoshida , Tomokazu Ito , Hiroshi Kamiyama , Takeshi Okumura , Sho Nakagomi
发明人： Tomonaga Nishikawa , Makoto Yoshida , Tomokazu Ito , Hiroshi Kamiyama , Takeshi Okumura , Sho Nakagomi
CPC分类号： H01F27/292 , H01F17/0013
摘要： A coil component 100 is provided with a substrate 11, a thin-film coil layer 12 provided on the substrate 11, first and second bump electrodes 13a, 13b provided on a surface of the thin-film coil layer 12, a first lead conductor 20 provided on the surface of the thin-film coil layer 12 together with the first and second bump electrodes 13a, 13b and formed integrally with the first bump electrode 13a, and an insulator layer 14 provided between the first bump electrode 13a and the second bump electrode 13b. The thin-film coil layer 12 contains a first spiral conductor 16 which is a plane coil pattern. The first bump electrode 13a is connected to an internal peripheral end of the first spiral conductor 16 via the first lead conductor 20. The second bump electrode 13b is connected to an external peripheral end of the first spiral conductor 16.
摘要翻译： 线圈部件100设置有基板11，设置在基板11上的薄膜线圈层12，设置在薄膜线圈层12的表面上的第一和第二凸起电极13a，13b，第一引线导体20 与第一和第二凸块电极13a，13b一起设置在薄膜线圈层12的表面上并与第一凸起电极13a一体形成，以及设置在第一凸起电极13a和第二凸起电极之间的绝缘体层14 13b。 薄膜线圈层12包含作为平面线圈图案的第一螺旋导体16。 第一突起电极13a经由第一引线导体20与第一螺旋导体16的内周端连接。第二突起电极13b与第一螺旋导体16的外周端连接。
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公开(公告)号：US08174349B2
公开(公告)日：2012-05-08
申请号：US12621194
申请日：2009-11-18
CPC分类号： H01F27/292 , H01F27/027 , H01F41/046 , H01G4/224 , H01G4/33 , Y10T29/4913
摘要： A manufacturing method of electronic components includes forming a first insulation layer on a substrate, forming a plurality of passive elements on the first insulation layer, forming a second insulation layer on the passive elements, forming a plurality of conductor layers electrically connected to the respective passive elements, on the outer side of the second insulation layer to be exposed to an upper surface of each electronic component, and forming grooves between the electronic components including the respective passive elements to expose side surfaces of each electronic component and parts of the conductor layers from the side surfaces of each electronic component. The manufacturing method further including plating a plurality of external electrodes on the respective conductor layers exposed to the upper surface and the side surfaces of each electronic component, and cutting the substrate to completely separate into individual electronic components.
摘要翻译： 电子部件的制造方法包括在基板上形成第一绝缘层，在所述第一绝缘层上形成多个无源元件，在所述无源元件上形成第二绝缘层，形成与各自被动电连接的多个导体层 元件，在第二绝缘层的外侧暴露于每个电子部件的上表面，以及在包括各个无源元件的电子部件之间形成凹槽，以暴露每个电子部件的侧表面和导体层的部分 每个电子元件的侧面。 该制造方法还包括在暴露于每个电子部件的上表面和侧表面的各个导体层上电镀多个外部电极，并且将基板切割成完全分离为各个电子部件。
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公开(公告)号：US08878641B2
公开(公告)日：2014-11-04
申请号：US13294627
申请日：2011-11-11
申请人： Tomonaga Nishikawa , Makoto Yoshida , Tomokazu Ito , Hiroshi Kamiyama , Takeshi Okumura , Tsuneo Kuwahara
发明人： Tomonaga Nishikawa , Makoto Yoshida , Tomokazu Ito , Hiroshi Kamiyama , Takeshi Okumura , Tsuneo Kuwahara
CPC分类号： H01F17/04 , H01F27/292 , H01F41/042
摘要： An electronic component is provided with a substrate, a thin-film element layer provided on the substrate, first and second bump electrodes, provided on a surface of the thin-film element layer, and an insulator layer provided between the first bump electrode and the second bump electrode. The thin-film element layer contains a first spiral conductor which is a plane coil pattern. The first bump electrode is connected to an internal peripheral end of the first spiral conductor. The second bump electrode is connected to an external peripheral end of the first spiral conductor. Both of the first and second bump electrodes, have a first exposure surface exposed to a principal surface of the insulator layer and a second exposure surface exposed to an end face of the insulator layer.
摘要翻译： 电子部件设置有基板，设置在基板上的薄膜元件层，设置在薄膜元件层的表面上的第一和第二突起电极，以及设置在第一突起电极和第二突起电极之间的绝缘体层 第二凸起电极。 薄膜元件层包含作为平面线圈图案的第一螺旋导体。 第一凸起电极连接到第一螺旋导体的内周端。 第二凸起电极连接到第一螺旋导体的外周端。 第一和第二凸起电极都具有暴露于绝缘体层的主表面的第一曝光表面和暴露于绝缘体层的端面的第二曝光表面。
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公开(公告)号：US07408435B2
公开(公告)日：2008-08-05
申请号：US11907603
申请日：2007-10-15
IPC分类号： H01F5/00
CPC分类号： H01F17/0006 , H01F17/0013 , H01F27/027 , H01F27/292 , H01F27/323 , H03H2001/0092
摘要： The invention relates to surface-mount type coil components having a mounting surface for mounting them on a printed circuit board or hybrid IC (HIC) and provides a low-cost coil component having a low direct-current resistance. A common mode filter includes a bridge conductor layer which has a bridge conductor one end of which is connected to one end of a lead wire and another end of which is connected to an inner circumferential end of a coil conductor and another bridge conductor one end of which is connected to one end of another lead wire and another end of which is connected to an inner circumferential end of another coil conductor, the bridge conductor layer being formed between two coil conductor layers with an insulation film interposed between the bridge conductor layer and each of the coil conductor layers.
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公开(公告)号：US20120112869A1
公开(公告)日：2012-05-10
申请号：US13293841
申请日：2011-11-10
申请人： Tomonaga Nishikawa , Makoto Yoshida , Tomokazu Ito , Hiroshi Kamiyama , Takeshi Okumura , Sho Nakagomi
发明人： Tomonaga Nishikawa , Makoto Yoshida , Tomokazu Ito , Hiroshi Kamiyama , Takeshi Okumura , Sho Nakagomi
CPC分类号： H01F27/292 , H01F17/0013
摘要： A coil component 100 is provided with a substrate 11, a thin-film coil layer 12 provided on the substrate 11, first and second bump electrodes 13a, 13b provided on a surface of the thin-film coil layer 12, a first lead conductor 20 provided on the surface of the thin-film coil layer 12 together with the first and second bump electrodes 13a, 13b and formed integrally with the first bump electrode 13a, and an insulator layer 14 provided between the first bump electrode 13a and the second bump electrode 13b. The thin-film coil layer 12 contains a first spiral conductor 16 which is a plane coil pattern. The first bump electrode 13a is connected to an internal peripheral end of the first spiral conductor 16 via the first lead conductor 20. The second bump electrode 13b is connected to an external peripheral end of the first spiral conductor 16.
摘要翻译： 线圈部件100设置有基板11，设置在基板11上的薄膜线圈层12，设置在薄膜线圈层12的表面上的第一和第二凸起电极13a，13b，第一引线导体20 与第一和第二凸块电极13a，13b一起设置在薄膜线圈层12的表面上并与第一凸起电极13a一体形成，以及设置在第一凸起电极13a和第二凸起电极之间的绝缘体层14 13b。 薄膜线圈层12包含作为平面线圈图案的第一螺旋导体16。 第一突起电极13a经由第一引线导体20与第一螺旋导体16的内周端连接。第二突起电极13b与第一螺旋导体16的外周端连接。
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公开(公告)号：US07619500B1
公开(公告)日：2009-11-17
申请号：US12463756
申请日：2009-05-11
申请人： Tomonaga Nishikawa , Tomokazu Ito , Takeshi Okumura , Makoto Yoshida , Hiroshi Kamiyama , Sho Nakagomi , Tatsuya Karakame
发明人： Tomonaga Nishikawa , Tomokazu Ito , Takeshi Okumura , Makoto Yoshida , Hiroshi Kamiyama , Sho Nakagomi , Tatsuya Karakame
IPC分类号： H01F5/00
CPC分类号： H01F17/0013 , H01F17/04 , H01F2017/0066 , H01F2017/0093 , H03H7/427 , H03H2001/0085
摘要： A common mode filter is provided as one in a three-layered structure with improved high-frequency characteristics. The common mode filter 1 has the three-layered structure including a first coil layer 14, a second coil layer 18, and a lead layer 16. A first planar coil 21 and a second planar coil 41 of a substantially circular spiral shape are formed in the first and second coil layers 14, 18, respectively. A first lead wire 31 and a second lead wire 32 formed in a lead layer 16 have a first straight portion 31c and a second straight portion 32c, respectively. The first straight portion 31c is located on a straight line L1 perpendicular to a plurality of first tangent lines to spirals 22, 42 at a plurality of respective intersection points with the spirals 22, 42. The second straight portion 32c is located on a straight line L2 perpendicular to a plurality of second tangent lines to the spirals 22, 42 at a plurality of respective intersection points with the spirals 22, 42.
摘要翻译： 共模滤波器被提供为具有改进的高频特性的三层结构中的一种。 共模滤波器1具有包括第一线圈层14，第二线圈层18和引线层16的三层结构。基本圆形螺旋形状的第一平面线圈21和第二平面线圈41形成在 第一和第二线圈层14,18。 形成在引线层16中的第一引线31和第二引线32分别具有第一直线部分31c和第二直线部分32c。 第一直线部分31c位于与多个第一切线垂直的直线L1上，在与螺旋22,42的多个相交点处的螺线22和42处。第二直线部分32c位于直线 L2在与螺线22,42的多个相应交点处垂直于与螺线22,42的多条第二切线。
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公开(公告)号：US20080129439A1
公开(公告)日：2008-06-05
申请号：US11979445
申请日：2007-11-02
CPC分类号： H01F17/0013 , H01F27/323 , H01F2017/002 , H01F2017/0093 , H03H2001/0092
摘要： The invention relates to surface-mount type coil components having a mounting surface for mounting them on a printed circuit board or hybrid IC (HIC) and provides a coil component having high electrical characteristics. A common mode filter includes a coil conductor formed in a spiral shape, cut ends which are parts of the coil conductor cut to face each other, and bridge conductors formed so that an insulation film is interposed between the coil conductor and the same to connect the cut ends to each other.
摘要翻译： 本发明涉及具有用于将它们安装在印刷电路板或混合IC（HIC）上的安装表面的表面安装型线圈部件，并提供具有高电特性的线圈部件。 共模滤波器包括形成为螺旋形状的线圈导体，作为切断面对的线圈导体的部分的切端，以及形成为使得绝缘膜插入在线圈导体与其之间的桥导体，以将 相互切割。
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10.发明申请公开(公告)号：US20070109683A1
公开(公告)日：2007-05-17
申请号：US11553706
申请日：2006-10-27
IPC分类号： G11B5/147
CPC分类号： G11B5/3106 , G11B5/012 , G11B5/3133 , G11B5/3163
摘要： A thin-film magnetic head where the closure is bonded with sufficiently high adhesive strength by the adhesive layer thinner than conventional and that is free from the problem of fine dusts, is provided. The head comprises: a substrate having an element-formed surface and an opposed-to-medium surface; at least one magnetic head element provided on/above the element-formed surface; an overcoat layer formed on the element-formed surface; an etching pattern formed on a part of an upper surface of the overcoat layer, the whole or a part of the etching pattern being filled up by adhesive; a closure provided on the etching pattern of the overcoat layer; and an opening portion formed close to an edge on the opposite side to the opposed-to-medium surface of an adhesive surface of the closure, being a portion exposed from the closure of the etching pattern.
摘要翻译： 提供了一种薄膜磁头，其中封闭物通过比常规更薄的粘合剂层以足够高的粘合强度粘合，并且没有细粉尘的问题。 头部包括：具有元件形成表面和相对中间表面的基底; 设置在所述元件形成表面上/上的至少一个磁头元件; 形成在所述元件形成表面上的外涂层; 形成在外涂层的上表面的一部分上的蚀刻图案，蚀刻图案的全部或一部分被粘合剂填充; 设置在外涂层的蚀刻图案上的封闭件; 以及开口部分，其形成在与封闭件的粘合剂表面的相对中间表面的相对侧上的边缘附近，该部分是从蚀刻图案的封闭体露出的部分。
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