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公开(公告)号:US20090293604A1
公开(公告)日:2009-12-03
申请号:US12129429
申请日:2008-05-29
申请人: Man Lung Sham , Ziyang Gao , Chi Kuen Vincent Leung , Lap Wai Leung , Lourdito M. Olleres , Chang Hwa Chung
发明人: Man Lung Sham , Ziyang Gao , Chi Kuen Vincent Leung , Lap Wai Leung , Lourdito M. Olleres , Chang Hwa Chung
IPC分类号: B60C23/02 , H01L23/495 , H01L29/84 , H01L21/56
CPC分类号: B60C23/0408 , G01L19/141 , G01L19/148 , H01L21/56 , H01L23/24 , H01L23/49575 , H01L23/66 , H01L25/165 , H01L2924/0002 , H01L2924/00
摘要: Subject matter disclosed herein may relate to packaging for multi-chip semiconductor devices as may be used, for example, in tire pressure monitoring systems.
摘要翻译: 本文公开的主题可涉及可用于例如轮胎压力监测系统中的多芯片半导体器件的封装。
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公开(公告)号:US07832278B2
公开(公告)日:2010-11-16
申请号:US12129429
申请日:2008-05-29
申请人: Man Lung Ivan Sham , Ziyang Gao , Chi Kuen Vincent Leung , Lap Wai Lydia Leung , Lourdito M. Olleres , Chang Hwa Tom Chung
发明人: Man Lung Ivan Sham , Ziyang Gao , Chi Kuen Vincent Leung , Lap Wai Lydia Leung , Lourdito M. Olleres , Chang Hwa Tom Chung
IPC分类号: G01L9/00
CPC分类号: B60C23/0408 , G01L19/141 , G01L19/148 , H01L21/56 , H01L23/24 , H01L23/49575 , H01L23/66 , H01L25/165 , H01L2924/0002 , H01L2924/00
摘要: Subject matter disclosed herein may relate to packaging for multi-chip semiconductor devices as may be used, for example, in tire pressure monitoring systems.
摘要翻译: 本文公开的主题可涉及可用于例如轮胎压力监测系统中的多芯片半导体器件的封装。
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