Optoelectronic package having a transmission line between electrical components and optical components
    2.
    发明授权
    Optoelectronic package having a transmission line between electrical components and optical components 失效
    具有在电气部件和光学部件之间的传输线的光电封装

    公开(公告)号:US07076123B2

    公开(公告)日:2006-07-11

    申请号:US10209337

    申请日:2002-07-30

    IPC分类号: G02B6/12

    CPC分类号: G02B6/4201

    摘要: Described herein is a hermetic fiber optic package that may have a wide bandwidth radio frequency (e.g., between 9 kHz and 300 GHz) interface and a multilayer substrate provides a platform to integrated various components such as, for example, integrated circuits having electronic components, optoelectronic components, or optics. In one embodiment, the substrate has a wide bandwidth surface mountable interface that may be a single ended or a differential that allows for an electrical signal to pass from the exterior of the package to the interior. The interior of the package contains a “riser” that is used to bring an electrical signal from the plane of the substrate to the plane close to the optical axis. This riser includes a transmission line to achieve the change in height. The transmission line can be single ended or differential. Also within the package is a “submount” upon which electrical/optical/electro-optic components can be integrated.

    摘要翻译: 这里描述的是可以具有宽带宽射频(例如,9kHz和300GHz)接口之间的密封光纤封装,并且多层衬底提供了一个集成各种部件的平台,例如具有电子部件的集成电路, 光电子元件或光学元件。 在一个实施例中,衬底具有宽带宽可表面安装的接口,其可以是允许电信号从封装的外部传递到内部的单端或差分。 封装的内部包含一个“提升管”,用于将电信号从基板的平面带到靠近光轴的平面上。 该提升管包括实现高度变化的传输线。 传输线可以是单端或差分。 封装内还有一个“底座”,可以集成电/光/电光元件。

    Method and apparatus for a backsided and recessed optical package connection
    7.
    发明授权
    Method and apparatus for a backsided and recessed optical package connection 失效
    用于背面和凹陷的光学封装连接的方法和装置

    公开(公告)号:US07042082B2

    公开(公告)日:2006-05-09

    申请号:US11034413

    申请日:2005-01-11

    IPC分类号: H01L23/12

    摘要: A method and apparatus for a backsided and recessed optical package connection is described. The method includes the formation of a substrate having a top surface layer and an opposed layer, including one or more recessed portions. Following formation of the substrate, leads of a lead unit are coupled to one or more of the recessed portions of the substrate. Next, one or more optical electronic components are mounted onto the top surface of the substrate. Once the optoelectric components are mounted to the top surface of the substrate, a cap is attached to the top surface of the substrate to encapsulate the one or more optical electronic components and form an optoelectronic package.

    摘要翻译: 描述了用于背面和凹陷的光学封装连接的方法和装置。 该方法包括形成具有顶表面层和相对层的衬底,其包括一个或多个凹部。 在形成衬底之后,引线单元的引线耦合到衬底的一个或多个凹陷部分。 接下来,将一个或多个光学电子部件安装在基板的顶表面上。 一旦将光电部件安装到基板的顶表面上,则将盖连接到基板的顶表面以封装一个或多个光电子部件并形成光电封装。

    Optical Receiver for Computing Applications
    10.
    发明申请
    Optical Receiver for Computing Applications 有权
    用于计算应用的光接收器

    公开(公告)号:US20080298818A1

    公开(公告)日:2008-12-04

    申请号:US11970482

    申请日:2008-01-07

    IPC分类号: H04B10/06 G02B6/12

    摘要: A compact optical transceiver is provided in which a substrate provides for an alignment surface for optical fibers and a lens assembly provides the necessary optical paths for coupling to photodiode and photodetector structures. Appropriate electrical connections on the substrate enable the substrate to be directly connected to a printed circuit board, grid array socket, and the like.

    摘要翻译: 提供了一种紧凑型光收发器,其中基板提供用于光纤的对准表面,并且透镜组件提供用于耦合到光电二极管和光电检测器结构的必要的光路。 基板上的适当的电连接使得基板能够直接连接到印刷电路板,网格阵列插座等。