摘要:
Leaf switches and spine switches in a Clos network are interconnected by optical fibers. The network enables large numbers of servers or other apparatus to communicate with each other with minimal delay and minimal power consumption.
摘要:
Described herein is a hermetic fiber optic package that may have a wide bandwidth radio frequency (e.g., between 9 kHz and 300 GHz) interface and a multilayer substrate provides a platform to integrated various components such as, for example, integrated circuits having electronic components, optoelectronic components, or optics. In one embodiment, the substrate has a wide bandwidth surface mountable interface that may be a single ended or a differential that allows for an electrical signal to pass from the exterior of the package to the interior. The interior of the package contains a “riser” that is used to bring an electrical signal from the plane of the substrate to the plane close to the optical axis. This riser includes a transmission line to achieve the change in height. The transmission line can be single ended or differential. Also within the package is a “submount” upon which electrical/optical/electro-optic components can be integrated.
摘要:
A method and apparatus for a backsided and recessed optical package connection is described. The method includes the formation of a substrate having a top surface layer and an opposed layer, including one or more recessed portions. Following formation of the substrate, leads of a lead unit are coupled to one or more of the recessed portions of the substrate. Next, one or more optical electronic components are mounted onto the top surface of the substrate. Once the optoelectric components are mounted to the top surface of the substrate, a cap is attached to the top surface of the substrate to encapsulate the one or more optical electronic components and form an optoelectronic package.
摘要:
Leaf switches and spine switches in a Clos network are interconnected by optical fibers. The network enables large numbers of servers or other apparatus to communicate with each other with minimal delay and minimal power consumption.
摘要:
Leaf switches and spine switches in a Clos network are interconnected by optical fibers. The network enables large numbers of servers or other apparatus to communicate with each other with minimal delay and minimal power consumption.
摘要:
Leaf switches and spine switches in a Clos network are interconnected by optical fibers. The network enables large numbers of servers or other apparatus to communicate with each other with minimal delay and minimal power consumption.
摘要:
A method and apparatus for a backsided and recessed optical package connection is described. The method includes the formation of a substrate having a top surface layer and an opposed layer, including one or more recessed portions. Following formation of the substrate, leads of a lead unit are coupled to one or more of the recessed portions of the substrate. Next, one or more optical electronic components are mounted onto the top surface of the substrate. Once the optoelectric components are mounted to the top surface of the substrate, a cap is attached to the top surface of the substrate to encapsulate the one or more optical electronic components and form an optoelectronic package.
摘要:
A system is provided for implementing PCI Express protocol signals over an optical link. A transmission circuit is used to provide an electrical-to-optical conversion, a receiving circuit provides an optical-to-electrical conversion, and a sideband circuit is used to provide and receive control information.
摘要:
A system is provided for implementing PCI Express protocol signals over an optical link. A transmission circuit is used to provide an electrical-to-optical conversion, a receiving circuit provides an optical-to-electrical conversion, and a sideband circuit is used to provide and receive control information.
摘要:
A compact optical transceiver is provided in which a substrate provides for an alignment surface for optical fibers and a lens assembly provides the necessary optical paths for coupling to photodiode and photodetector structures. Appropriate electrical connections on the substrate enable the substrate to be directly connected to a printed circuit board, grid array socket, and the like.