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    Methods and fixtures for facilitating handling of thin films
    2.
    发明申请
    Methods and fixtures for facilitating handling of thin films 审中-公开
    用于促进薄膜处理的方法和装置

    公开(公告)号：US20050016464A1

    公开(公告)日：2005-01-27

    申请号：US10625171

    申请日：2003-07-24

    申请人： Anil Duggal ,  Paul McConnelee ,  Marc Schaepkens ,  Min Yan

    发明人： Anil Duggal ,  Paul McConnelee ,  Marc Schaepkens ,  Min Yan

    IPC分类号： C08J7/00 ,  H01L21/00 ,  H01L51/40 ,  H05B33/10 ,  B05D3/12 ,  C23C16/00

    CPC分类号： H01L21/67132 ,  C23C14/50 ,  C23C16/458 ,  H01L51/0002

    摘要： An apparatus comprises a fixture comprising at least one inner member and at least one outer member. The fixture is configured to secure a film between the at least one inner member and the at least one outer member. The secured film can be further processed to give a processed film. Further, the processed film, secured in the fixture, can undergo additional manufacturing steps to produce processed articles. The apparatus and methods described herein are useful for producing a variety of articles, such as micro-electronic and opto-electronic devices.

    摘要翻译： 一种装置包括一种固定装置，其包括至少一个内部构件和至少一个外部构件。 夹具被构造成将膜固定在至少一个内部构件和至少一个外部构件之间。 可以进一步处理固定膜以得到加工膜。 此外，固定在固定装置中的经处理的薄膜可以经受附加的制造步骤以产生加工制品。 本文描述的装置和方法可用于生产各种物品，例如微电子和光电器件。

    MULTILAYER DEVICE AND METHOD OF MAKING
    3.
    发明申请
    MULTILAYER DEVICE AND METHOD OF MAKING 有权
    多层设备及其制造方法

    公开(公告)号：US20070069233A1

    公开(公告)日：2007-03-29

    申请号：US11420366

    申请日：2006-05-25

    申请人： Min Yan ,  Anil Duggal ,  Marc Schaepkens ,  Tae Kim

    发明人： Min Yan ,  Anil Duggal ,  Marc Schaepkens ,  Tae Kim

    IPC分类号： H01L33/00

    CPC分类号： H01L51/00 ,  G02F1/133305 ,  H01L51/0097 ,  H01L51/5253 ,  H01L2251/5338 ,  Y10S428/918 ,  Y10T428/24942 ,  Y10T428/31507 ,  Y10T428/31678

    摘要： The invention relates to composite articles comprising a substrate and additional layers on the substrate. According to one example, the layers are selected so that the difference in the coefficient of thermal expansion (CTE) between the substrate and a first layer on one side of the substrate is substantially equal to the CTE difference between the substrate and a second layer on the other side of the substrate. The stress caused by the CTE difference and/or shrinkage on one side of the substrate during heating or cooling is balanced by the stress caused by the CTE difference on the other side of the substrate during heating or cooling. Such stress balancing can reduce or minimize curling of the substrate.

    摘要翻译： 本发明涉及包含基底和在基底上的附加层的复合制品。 根据一个示例，选择这些层，使得衬底与衬底的一侧上的第一层之间的热膨胀系数（CTE）的差异基本上等于衬底和第二层之间的CTE差 衬底的另一面。 在加热或冷却期间由基板的一侧的CTE差异和/或收缩引起的应力由加热或冷却期间基板另一侧的CTE差异引起的应力平衡。 这种应力平衡可以减少或最小化衬底的卷曲。

    Multilayer device and method of making
    5.
    发明申请
    Multilayer device and method of making 有权
    多层设备及其制作方法

    公开(公告)号：US20050133781A1

    公开(公告)日：2005-06-23

    申请号：US10739298

    申请日：2003-12-19

    申请人： Min Yan ,  Anil Duggal ,  Marc Schaepkens ,  Tae Kim

    发明人： Min Yan ,  Anil Duggal ,  Marc Schaepkens ,  Tae Kim

    IPC分类号： G02F1/1333 ,  H01L51/00 ,  H01L51/52 ,  H01L35/24 ,  H01L29/08 ,  H01L51/40

    CPC分类号： H01L51/00 ,  G02F1/133305 ,  H01L51/0097 ,  H01L51/5253 ,  H01L2251/5338 ,  Y10S428/918 ,  Y10T428/24942 ,  Y10T428/31507 ,  Y10T428/31678

    摘要： The invention relates to composite articles comprising a substrate and additional layers on the substrate. According to one example, the layers are selected so that the difference in the coefficient of thermal expansion (CTE) between the substrate and a first layer on one side of the substrate is substantially equal to the CTE difference between the substrate and a second layer on the other side of the substrate. The stress caused by the CTE difference and/or shrinkage on one side of the substrate during heating or cooling is balanced by the stress caused by the CTE difference on the other side of the substrate during heating or cooling. Such stress balancing can reduce or minimize curling of the substrate.

    摘要翻译： 本发明涉及包含基底和在基底上的附加层的复合制品。 根据一个示例，选择这些层，使得衬底与衬底的一侧上的第一层之间的热膨胀系数（CTE）的差异基本上等于衬底和第二层之间的CTE差 衬底的另一面。 在加热或冷却期间由基板的一侧的CTE差异和/或收缩引起的应力由加热或冷却期间基板另一侧的CTE差异引起的应力平衡。 这种应力平衡可以减少或最小化衬底的卷曲。

    Electrode tuning method and apparatus for a layered heater structure
    9.
    发明授权
    Electrode tuning method and apparatus for a layered heater structure 有权
    用于层状加热器结构的电极调谐方法和装置

    公开(公告)号：US07777160B2

    公开(公告)日：2010-08-17

    申请号：US12002381

    申请日：2007-12-17

    申请人： Wei Fan ,  Benjamin J. Olechnowicz ,  Marc Schaepkens ,  David M. Rusinko, Jr. ,  Xiang Liu ,  John T. Mariner

    发明人： Wei Fan ,  Benjamin J. Olechnowicz ,  Marc Schaepkens ,  David M. Rusinko, Jr. ,  Xiang Liu ,  John T. Mariner

    IPC分类号： H05B3/68 ,  C23C16/00

    CPC分类号： H01L21/68735 ,  H01L21/67103 ,  H05B3/143

    摘要： A layered heater structure including an electrode layer and a localized tuning method for tuning the electrode layer of a layered heater structure with high precision is provided. The localized tuning method tunes the electrode layer to its proper local resistance to minimize temperature offsets on the heater surface and thus provide a desired thermal profile that is in marked contrast to conventional, non-localized resistance tuning approaches based on thickness trimming practices, such as grinding or blasting, or resistivity adjustment, such as local heat treatment.

    摘要翻译： 提供了包括电极层和用于高精度地调谐层状加热器结构的电极层的局部调谐方法的层状加热器结构。 局部调谐方法将电极层调整到其适当的局部电阻以最小化加热器表面上的温度偏移，并因此提供期望的热分布，其与基于厚度修整实践的常规非局部电阻调谐方法形成鲜明对比，例如 研磨或爆破，或电阻率调整，如局部热处理。

    WAFER PROCESSING APPARATUS HAVING A TUNABLE ELECTRICAL RESISTIVITY
    10.
    发明申请
    WAFER PROCESSING APPARATUS HAVING A TUNABLE ELECTRICAL RESISTIVITY 有权
    具有可调节电阻率的加工装置

    公开(公告)号：US20100053841A1

    公开(公告)日：2010-03-04

    申请号：US12204079

    申请日：2008-09-04

    申请人： David Michael Rusinko, JR. ,  Marc Schaepkens ,  Wanxue Zeng

    发明人： David Michael Rusinko, JR. ,  Marc Schaepkens ,  Wanxue Zeng

    IPC分类号： H01L21/683

    CPC分类号： H01L21/683 ,  H01L21/6831 ,  H01L21/6833

    摘要： An article with an etch resistant coating is disclosed. The article is a heating element, wafer carrier, or electrostatic chuck. The article has a base substrate made of a ceramic or other material, and further has one or more electrodes for resistance heating or electromagnetic chucking or both. The eth resistant coating has a plurality of regions made from materials having different electrical volume resistivities, such that the overall coating has a bulk resistivity that can be tailored by varying the relative size of each region.

    摘要翻译： 公开了具有耐蚀刻涂层的物品。 该物品是加热元件，晶片载体或静电卡盘。 该制品具有由陶瓷或其他材料制成的基底，并且还具有用于电阻加热或电磁夹持的两个或更多个电极。 耐腐蚀涂层具有由具有不同电体积电阻率的材料制成的多个区域，使得整个涂层具有可以通过改变每个区域的相对尺寸来调整的体电阻率。