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公开(公告)号：US07605466B2
公开(公告)日：2009-10-20
申请号：US11872562
申请日：2007-10-15
申请人： Marco Francesco Aimi , Christopher James Kapusta , Arun Virupaksha Gowda , David Cecil Hays , Oliver Charles Boomhower , Glenn Scott Claydon , Joseph Alfred Iannotti , Christopher Fred Keimel
发明人： Marco Francesco Aimi , Christopher James Kapusta , Arun Virupaksha Gowda , David Cecil Hays , Oliver Charles Boomhower , Glenn Scott Claydon , Joseph Alfred Iannotti , Christopher Fred Keimel
IPC分类号： H01L23/34
CPC分类号： B81C1/00269 , B81C2203/0118 , B81C2203/019 , B81C2203/032 , H01L2224/16225 , H01L2924/1461 , H01L2924/00
摘要： Multiple microelectromechanical systems (MEMS) on a substrate are capped with a cover using a layer that may function as a bonding agent, separation layer, and hermetic seal. A substrate has a first side with multiple MEMS devices. A cover is formed with through-holes for vias, and with standoff posts for layer registration and separation. An adhesive sheet is patterned with cutouts for the MEMS devices, vias, and standoff posts. The adhesive sheet is tacked to the cover, then placed on the MEMS substrate and heated to bond the layers. The via holes may be metalized with leads for circuit board connection. The MEMS units may be diced from the substrate after sealing, thus protecting them from contaminants.
摘要翻译： 衬底上的多个微电子机械系统（MEMS）用盖子盖住，使用可用作粘合剂，分离层和气密密封的层。 衬底具有具有多个MEMS器件的第一侧。 形成有用于通孔的通孔的盖，并且具有用于层对准和分离的支柱。 图案化粘合片用于MEMS器件，通孔和支柱的切口。 将粘合片粘合到盖上，然后放置在MEMS基板上并加热以粘合层。 通孔可以用电路板连接的引线金属化。 在密封之后，MEMS单元可以从基底切割，从而保护它们免受污染。
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公开(公告)号：US20090096088A1
公开(公告)日：2009-04-16
申请号：US11872562
申请日：2007-10-15
申请人： MARCO FRANCESCO AIMI , Chirstopher James Kapusta , Arun Virupaksha Gowda , David Cecil Hays , Oliver Charles Boomhower , Glenn Scott Claydon , Joseph Alfred Iannotti , Christopher Fred Keimel
发明人： MARCO FRANCESCO AIMI , Chirstopher James Kapusta , Arun Virupaksha Gowda , David Cecil Hays , Oliver Charles Boomhower , Glenn Scott Claydon , Joseph Alfred Iannotti , Christopher Fred Keimel
CPC分类号： B81C1/00269 , B81C2203/0118 , B81C2203/019 , B81C2203/032 , H01L2224/16225 , H01L2924/1461 , H01L2924/00
摘要： Multiple microelectromechanical systems (MEMS) on a substrate are capped with a cover using a layer that may function as a bonding agent, separation layer, and hermetic seal. A substrate has a first side with multiple MEMS devices. A cover is formed with through-holes for vias, and with standoff posts for layer registration and separation. An adhesive sheet is patterned with cutouts for the MEMS devices, vias, and standoff posts. The adhesive sheet is tacked to the cover, then placed on the MEMS substrate and heated to bond the layers. The via holes may be metalized with leads for circuit board connection. The MEMS units may be diced from the substrate after sealing, thus protecting them from contaminants.
摘要翻译： 衬底上的多个微电子机械系统（MEMS）用盖子盖住，使用可用作粘合剂，分离层和气密密封的层。 衬底具有具有多个MEMS器件的第一侧。 形成有用于通孔的通孔的盖，并且具有用于层对准和分离的支柱。 图案化粘合片用于MEMS器件，通孔和支柱的切口。 将粘合片粘合到盖上，然后放置在MEMS基板上并加热以粘合层。 通孔可以用电路板连接的引线金属化。 在密封之后，MEMS单元可以从基底切割，从而保护它们免受污染。
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公开(公告)号：US08916996B2
公开(公告)日：2014-12-23
申请号：US13194002
申请日：2011-07-29
CPC分类号： H01H1/0036 , H01H1/58 , H01H9/40 , H01H59/0009 , Y10T29/49105
摘要： An apparatus, such as an electrical distribution system, is provided. The apparatus can include a first conductor and a second conductor. Multiple conduction paths can form parallel electrical connections along a connection span between the first and second conductors, with each of the conduction paths having a respectively similar nominal electrical resistance. The first and second conductors can have respective cross-sectional areas that decrease in opposing directions along said connection span.
摘要翻译： 提供了诸如配电系统的装置。 该装置可以包括第一导体和第二导体。 多个传导路径可以沿着第一和第二导体之间的连接跨度形成并联电连接，其中每个导电路径具有分别相似的标称电阻。 第一和第二导体可以具有沿着所述连接跨度在相反方向上减小的相应横截面面积。
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公开(公告)号：US20130025934A1
公开(公告)日：2013-01-31
申请号：US13194002
申请日：2011-07-29
CPC分类号： H01H1/0036 , H01H1/58 , H01H9/40 , H01H59/0009 , Y10T29/49105
摘要： An apparatus, such as an electrical distribution system, is provided. The apparatus can include a first conductor and a second conductor. Multiple conduction paths can form parallel electrical connections along a connection span between the first and second conductors, with each of the conduction paths having a respectively similar nominal electrical resistance. The first and second conductors can have respective cross-sectional areas that decrease in opposing directions along said connection span.
摘要翻译： 提供了诸如配电系统的装置。 该装置可以包括第一导体和第二导体。 多个传导路径可以沿着第一和第二导体之间的连接跨度形成并联电连接，其中每个导电路径具有分别相似的标称电阻。 第一和第二导体可以具有沿着所述连接跨度在相反方向上减小的相应横截面面积。
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5.发明授权公开(公告)号：US08054148B2
公开(公告)日：2011-11-08
申请号：US12893444
申请日：2010-09-29
申请人： Duraiswamy Srinivasan , Reed Roeder Corderman , Christopher Fred Keimel , Somasundaram Gunasekaran , Sudhakar Eddula Reddy , Arun Virupaksha Gowda , Kanakasabapathi Subramanian , Om Prakash
发明人： Duraiswamy Srinivasan , Reed Roeder Corderman , Christopher Fred Keimel , Somasundaram Gunasekaran , Sudhakar Eddula Reddy , Arun Virupaksha Gowda , Kanakasabapathi Subramanian , Om Prakash
IPC分类号： H01H1/02
CPC分类号： H01H1/0036 , G02B26/0841 , H01H1/021 , H01H2001/0052
摘要： A device for controlling the flow of electric current is provided. The device comprises a first conductor as thin film form; a second conductor switchably coupled to the first conductor to alternate between an electrically connected state with the first conductor and an electrically disconnected state with the first conductor. At least one conductor further comprises an electrical contact, the electrical contact comprising a solid matrix comprising a plurality of pores; and a filler material disposed within at least a portion of the plurality of pores. The filler material has a melting point of less than about 575 K. A method to make an electrical contact is provided. The method includes the steps of: providing a substrate; providing a plurality of pores on the substrate; and disposing a filler material within at least a portion of the plurality of pores. The filler material has a melting point of less than about 575 K.
摘要翻译： 提供了一种用于控制电流流动的装置。 该装置包括作为薄膜形式的第一导体; 第二导体，其可切换地耦合到所述第一导体，以在与所述第一导体的电连接状态与与所述第一导体的电断开状态之间交替。 至少一个导体还包括电接触，所述电接触包括包含多个孔的固体基质; 以及设置在所述多个孔的至少一部分中的填充材料。 填充材料具有小于约575K的熔点。提供了形成电接触的方法。 该方法包括以下步骤：提供衬底; 在衬底上提供多个孔; 以及在所述多个孔的至少一部分内设置填充材料。 填充材料的熔点小于约575K。
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6.发明申请公开(公告)号：US20110062003A1
公开(公告)日：2011-03-17
申请号：US12893444
申请日：2010-09-29
申请人： Duraiswamy Srinivasan , Reed Roeder Corderman , Christopher Fred Keimel , Somasundaram Gunasekaran , Sudhakar Eddula Reddy , Arun Virupaksha Gowda , Kanakasabapathi Subramanian , Om Prakash
发明人： Duraiswamy Srinivasan , Reed Roeder Corderman , Christopher Fred Keimel , Somasundaram Gunasekaran , Sudhakar Eddula Reddy , Arun Virupaksha Gowda , Kanakasabapathi Subramanian , Om Prakash
CPC分类号： H01H1/0036 , G02B26/0841 , H01H1/021 , H01H2001/0052
摘要： A device for controlling the flow of electric current is provided. The device comprises a first conductor as thin film form; a second conductor switchably coupled to the first conductor to alternate between an electrically connected state with the first conductor and an electrically disconnected state with the first conductor. At least one conductor further comprises an electrical contact, the electrical contact comprising a solid matrix comprising a plurality of pores; and a filler material disposed within at least a portion of the plurality of pores. The filler material has a melting point of less than about 575 K. A method to make an electrical contact is provided. The method includes the steps of: providing a substrate; providing a plurality of pores on the substrate; and disposing a filler material within at least a portion of the plurality of pores. The filler material has a melting point of less than about 575 K.
摘要翻译： 提供了一种用于控制电流流动的装置。 该器件包括作为薄膜形式的第一导体; 第二导体，其可切换地耦合到所述第一导体，以在与所述第一导体的电连接状态与与所述第一导体的电断开状态之间交替。 至少一个导体还包括电接触，所述电接触包括包含多个孔的固体基质; 以及设置在所述多个孔的至少一部分中的填充材料。 填充材料具有小于约575K的熔点。提供了形成电接触的方法。 该方法包括以下步骤：提供衬底; 在衬底上提供多个孔; 以及在所述多个孔的至少一部分内设置填充材料。 填充材料的熔点小于约575K。
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7.发明申请POWER OVERLAY STRUCTURE FOR MEMS DEVICES AND METHOD FOR MAKING POWER OVERLAY STRUCTURE FOR MEMS DEVICES 审中-公开用于MEMS器件的电力覆盖结构和用于制造MEMS器件的功率覆盖结构的方法公开(公告)号：US20080190748A1
公开(公告)日：2008-08-14
申请号：US11674189
申请日：2007-02-13
申请人： Stephen Daley Arthur , Ahmed Elasser , Joshua Isaac Wright , Kanakasabapathi Subramanian , Christopher Fred Keimel , Arun Virupaksha Gowda
发明人： Stephen Daley Arthur , Ahmed Elasser , Joshua Isaac Wright , Kanakasabapathi Subramanian , Christopher Fred Keimel , Arun Virupaksha Gowda
CPC分类号： H01H59/0009 , H01H9/52 , H01L24/24 , H01L2224/32245 , H01L2224/73267 , H01L2224/92144 , H01L2924/01029 , H01L2924/10253 , H01L2924/12042 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , Y10T29/49105 , H01L2924/00
摘要： One embodiment of the invention comprises a MEMS structure further comprising: a MEMS device (240) having a first surface with one or more contact structures (244, 245 and 246) thereon connected to functional elements of the MEMS device (240), a dielectric layer (100) overlying the first surface defining openings therein through which the contact structures (244, 245 and 246) are exposed, a patterned metallization layer (254, 255 and 256) comprising conductive material extending from the contact structures (244, 245 and 246) through the openings in the dielectric layer (100) and onto a surface of the dielectric layer and a first heat sink (190) in thermal communication with the metallization layer (254, 255 and 256).
摘要翻译： 本发明的一个实施例包括一种MEMS结构，其进一步包括：MEMS器件（240），其具有其上连接到所述MEMS器件（240）的功能元件的一个或多个接触结构（244,245和246）的第一表面， 覆盖所述第一表面的层（100），所述第一表面限定其中所述接触结构（244,245和246）暴露于其中的开口;图案化金属化层（254,255和256），包括从所述接触结构（244,245和255）延伸的导电材料 246）通过介电层（100）中的开口并延伸到电介质层的表面上，以及与金属化层（254,255和256）热连通的第一散热器（190）。
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公开(公告)号：US09117813B2
公开(公告)日：2015-08-25
申请号：US13524369
申请日：2012-06-15
IPC分类号： H01L21/00 , H01L23/498 , H01L23/538 , H01L23/00 , H01L21/48 , H01L21/683 , H05K3/30
CPC分类号： H01L25/0655 , H01L21/4857 , H01L21/486 , H01L21/6836 , H01L23/49822 , H01L23/5383 , H01L23/5384 , H01L23/5386 , H01L24/19 , H01L24/20 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/83 , H01L24/92 , H01L24/94 , H01L25/50 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2224/04105 , H01L2224/2101 , H01L2224/221 , H01L2224/27003 , H01L2224/27312 , H01L2224/27318 , H01L2224/2732 , H01L2224/2741 , H01L2224/27416 , H01L2224/27418 , H01L2224/27422 , H01L2224/27436 , H01L2224/2781 , H01L2224/27848 , H01L2224/2919 , H01L2224/32225 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83855 , H01L2224/83856 , H01L2224/92 , H01L2224/9202 , H01L2224/92144 , H01L2224/94 , H01L2924/07802 , H01L2924/12042 , H01L2924/3511 , H05K3/305 , H01L2224/27 , H01L2224/83 , H01L2224/19 , H01L21/78 , H01L2924/00013 , H01L2924/00014 , H01L2924/0665 , H01L2924/00
摘要： A chip package includes a first die with an active surface having at least one die pad positioned thereon; a first adhesive layer having a first surface coupled to the active surface of the first die and a second surface opposite the first surface; and a first dielectric layer having a top surface. A first portion of the top surface of the first dielectric layer is coupled to the second surface of the first adhesive layer. A second portion of the top surface of the first dielectric layer, distinct from the first portion, is substantially free of adhesive.
摘要翻译： 芯片封装包括具有活性表面的第一裸片，其中至少一个芯片焊盘位于其上; 第一粘合剂层，其具有联接到第一管芯的有效表面的第一表面和与第一表面相对的第二表面; 以及具有顶表面的第一电介质层。 第一电介质层的顶表面的第一部分耦合到第一粘合剂层的第二表面。 与第一部分不同的第一介电层的顶表面的第二部分基本上没有粘合剂。
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公开(公告)号：US08531027B2
公开(公告)日：2013-09-10
申请号：US12771892
申请日：2010-04-30
IPC分类号： H01L23/34
CPC分类号： H01L24/24 , H01L23/48 , H01L24/72 , H01L24/82 , H01L25/071 , H01L25/072 , H01L2224/04105 , H01L2224/18 , H01L2224/24137 , H01L2224/73267 , H01L2924/10253 , H01L2924/10272 , H01L2924/10329 , H01L2924/1033 , H01L2924/1301 , H01L2924/1302 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/19041 , H01L2924/30105 , H01L2924/351 , H02P2101/15 , H01L2924/00 , H01L2924/00014
摘要： Systems and methods for utilizing power overlay (POL) technology and semiconductor press-pack technology to produce semiconductor packages with higher reliability and power density are provided. A POL structure may interconnect semiconductor devices within a semiconductor package, and certain embodiments may be implemented to reduce the probability of damaging the semiconductor devices during the pressing of the conductive plates. In one embodiment, springs and/or spacers may be used to reduce or control the force applied by an emitter plate onto the semiconductor devices in the package. In another embodiment, the emitter plate may be recessed to exert force on the POL structure, rather than directly against the semiconductor devices. Further, in some embodiments, the conductive layer of the POL structure may be grown to function as an emitter plate, and regions of the conductive layer may be made porous to provide compliance.
摘要翻译： 提供了利用功率覆盖（POL）技术和半导体压制包技术制造具有更高可靠性和功率密度的半导体封装的系统和方法。 POL结构可以将半导体封装内的半导体器件互连，并且可以实现某些实施例以减少在压制导电板期间损坏半导体器件的可能性。 在一个实施例中，可以使用弹簧和/或间隔件来减少或控制由发射极板施加到封装中的半导体器件上的力。 在另一个实施例中，发射极板可以凹入以在POL结构上施加力而不是直接抵靠半导体器件。 此外，在一些实施例中，POL结构的导电层可以被生长以发挥发射极板的作用，并且导电层的区域可以制成多孔的以提供柔量。
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公开(公告)号：US08358000B2
公开(公告)日：2013-01-22
申请号：US12404272
申请日：2009-03-13
申请人： Richard Alfred Beaupre , Arun Virupaksha Gowda , Ljubisa Dragol jub Stevanovic , Stephen Adam Solovitz
发明人： Richard Alfred Beaupre , Arun Virupaksha Gowda , Ljubisa Dragol jub Stevanovic , Stephen Adam Solovitz
IPC分类号： H01L23/48
CPC分类号： H01L23/3735 , H01L23/051 , H01L23/42 , H01L23/473 , H01L24/24 , H01L25/072 , H01L2224/24137 , H01L2224/92144 , H01L2924/01029 , H01L2924/14
摘要： A power module includes one or more semiconductor power devices having a power overlay (POL) bonded thereto. A first heat sink is bonded to the semiconductor power devices on a side opposite the POL. A second heat sink is bonded to the POL opposite the side of the POL bonded to the semiconductor power devices. The semiconductor power devices, POL, first channel heat sink, and second channel heat sink together form a double side cooled power overlay module. The second channel heat sink is bonded to the POL solely via a compliant thermal interface material without the need for planarizing, brazing or metallurgical bonding.
摘要翻译： 功率模块包括具有与其结合的功率覆盖（POL）的一个或多个半导体功率器件。 第一散热器在与POL相对的一侧结合到半导体功率器件。 第二散热器接合到与结合到半导体功率器件的POL的侧面相反的POL。 半导体功率器件POL，第一通道散热器和第二通道散热器一起形成双侧冷却功率覆盖模块。 第二通道散热器仅通过柔性热界面材料结合到POL，而不需要平坦化，钎焊或冶金结合。
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