公开(公告)号：US20080033075A1

公开(公告)日：2008-02-07

申请号：US11596978

申请日：2005-05-21

申请人： Marco Schmidt ,  Christof Jackh ,  Dirk Funhoff ,  Manfred Siegler ,  Jack Armstrong ,  Eugene Zimmerman ,  James Lyon ,  Limei Lu

发明人： Marco Schmidt ,  Christof Jackh ,  Dirk Funhoff ,  Manfred Siegler ,  Jack Armstrong ,  Eugene Zimmerman ,  James Lyon ,  Limei Lu

IPC分类号： C08K9/10

CPC分类号： E04C2/16

摘要： The present invention provides moldings of lignocellulose materials comprising based on the weight of the molding 5-20% by weight of glue resin, and 2-30% by weight of microcapsules comprising a polymer wall and a core composed predominantly of latent heat storage materials.

摘要翻译： 本发明提供木质纤维素材料的模制品，其包含基于5-20重量％的胶树脂的成型体的重量，以及2-30重量％的包含聚合物壁和主要由潜热蓄热材料构成的芯的微胶囊。

公开(公告)号：US20220152885A1

公开(公告)日：2022-05-19

申请号：US17527003

申请日：2021-11-15

申请人： Jack Armstrong

发明人： Jack Armstrong

IPC分类号： B29C39/10 ,  B29C39/36 ,  B29C33/58

摘要： A method for potting electrical components into complex finishing forms is presented. A releasing agent is added into a mold cavity. Next, an initial layer of potting compound is added into the mold cavity. A label layer is added into the initial layer of the potting compound. A set of electronic components is added over the label layer. An interstitial layer of potting compound is added over the set of electronic components. A reinforcement layer is added along the interstitial layer. A finishing layer of the potting compound is added over the reinforcement layer forming an uncured potted electronic product. The uncured potted electronic product is cured within the mold cavity in order to produce a cured potted electronic product. The cured potted electronic product is released from the negative mold using a releasing device.

公开(公告)号：USD891708S1

公开(公告)日：2020-07-28

申请号：US29620988

申请日：2017-09-28

申请人： Jack Armstrong

设计人： Jack Armstrong

公开(公告)号：US4523673A

公开(公告)日：1985-06-18

申请号：US448260

申请日：1982-12-09

申请人： John R. Vessey ,  Chandrakant M. Patel ,  Jack Armstrong

发明人： John R. Vessey ,  Chandrakant M. Patel ,  Jack Armstrong

IPC分类号： B23Q7/00 ,  B23Q7/04 ,  B23Q7/06 ,  B65G25/00

CPC分类号： B23Q7/007 ,  B23Q7/04 ,  B23Q7/06

摘要： A device is disclosed for transferring workpieces from an entry station and to a predetermined position on a continuously moving conveyor. The device comprises a housing wherein at least a portion of the conveyor extends through and is movable along a predetermined path of movement through the housing. A carriage assembly is movably mounted to the housing along the path of movement and is movable from a first position in which the carriage assembly is aligned with the entry station and a second position which is spaced from its first position along the path of movement. The carriage assembly includes arms which engage and receive a workpiece from the entry station. Thereafter, a coupling member on the carriage engages an abutment member on the conveyor so that the carriage assembly and conveyor move in unison with each other. The carriage assembly arms release the work onto the conveyor when the carriage assembly reaches the second position and an air spring thereafter returns the carriage assembly to its first position for receipt of a subsequent workpiece.

摘要翻译： 公开了一种用于将工件从入口站传送到连续移动的输送机上的预定位置的装置。 该装置包括壳体，其中传送器的至少一部分延伸穿过并且可沿预定的穿过壳体的运动路径移动。 托架组件沿着运动路径可移动地安装到壳体，并且可从托架组件与入口台对准的第一位置和与其沿运动路径的第一位置间隔开的第二位置移动。 托架组件包括从入口台接合和接收工件的臂。 此后，滑架上的联接构件与输送机上的抵接构件接合，使得支架组件和输送机彼此一致地移动。 当托架组件到达第二位置时，托架组件臂将工件释放到输送机上，然后空气弹簧将托架组件返回到其第一位置以接收随后的工件。