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公开(公告)号：US5464927A
公开(公告)日：1995-11-07
申请号：US58303
申请日：1993-05-10
申请人： Marie Angelopoulos , Jeffrey D. Gelorme , Jeffrey W. Labadie , David A. Lewis , Sally A. Swanson , Nancy C. Labianca
发明人： Marie Angelopoulos , Jeffrey D. Gelorme , Jeffrey W. Labadie , David A. Lewis , Sally A. Swanson , Nancy C. Labianca
CPC分类号： C08G73/1025 , C08G73/1039 , C08G73/1042 , G03F7/0387
摘要： Copolyamic acid is obtained from tetracarboxylic acid dianhydride, diamine and a fluorinated diamine and/or fluorinated tetracarboxylic acid dianhydride; and optionally ester or amine salt derivative thereof to obtain radiation sensitive polymer; and low optical high thermally stable polyimide from curing the above polyamic acid and/or derivative thereof.
摘要翻译： 共聚酰胺酸由四羧酸二酐，二胺和氟化二胺和/或氟化四羧酸二酐得到; 和任选的酯或胺盐衍生物，以获得辐射敏感聚合物; 和低光学高热稳定性聚酰亚胺，其固化上述聚酰胺酸和/或其衍生物。
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公开(公告)号：US07063127B2
公开(公告)日：2006-06-20
申请号：US10665798
申请日：2003-09-18
申请人： Jeffrey D. Gelorme , Hendrik F. Hamann , Nancy C. LaBianca , Yves C. Martin , Theodore G. Van Kessel
发明人： Jeffrey D. Gelorme , Hendrik F. Hamann , Nancy C. LaBianca , Yves C. Martin , Theodore G. Van Kessel
IPC分类号： F28F7/00
CPC分类号： H01L23/433 , H01L2924/0002 , H01L2924/00
摘要： A thermal interface for IC chip cooling is provided. One embodiment of the thermal interface includes a thermally conductive liquid or paste-like metal(s) disposed within a flexible, thermally conductive enclosure. The enclosure is adapted to be placed between an IC chip and a heat sink to enhance heat transfer from the chip to the heat sink, thereby enabling quicker and more efficient cooling of the chip than can be achieved by conventional techniques. In several embodiments, the thermal interface is held in place by mechanical pressure rather than by bonding, which further facilitates inspection and repair of the IC device.
摘要翻译： 提供了用于IC芯片冷却的热接口。 热界面的一个实施例包括设置在柔性导热外壳内的导热液体或糊状金属。 壳体适于放置在IC芯片和散热器之间，以增强从芯片到散热片的热传递，从而比通过常规技术可以实现的更快和更有效地冷却芯片。 在几个实施例中，热界面通过机械压力而不是通过粘合保持在适当位置，这进一步便于IC器件的检查和修理。
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公开(公告)号：US07219713B2
公开(公告)日：2007-05-22
申请号：US11037913
申请日：2005-01-18
IPC分类号： F28F7/00
CPC分类号： H01L23/3733 , H01L23/4093 , H01L23/42 , H01L2924/0002 , H01L2924/00
摘要： The present invention is a thermal interface for coupling a heat source to a heat sink. One embodiment of the invention comprises a mesh and a liquid, e.g., a thermally conductive liquid, disposed in the mesh. The mesh and the thermally conductive liquid are adapted to contact both the heat source and the heat sink when disposed therebetween. In one embodiment, the mesh may comprise a metal or organic material compatible with the liquid. In one embodiment, the liquid may comprise liquid metal. For example, the liquid may comprise a gallium indium tin alloy. A gasket may optionally be used to seal the mesh and the liquid between the heat source and the heat sink. In one embodiment, the heat source is an integrated circuit chip.
摘要翻译： 本发明是用于将热源耦合到散热器的热界面。 本发明的一个实施例包括设置在网中的网和液体，例如导热液体。 网格和导热液体在其间设置时适于接触热源和散热器。 在一个实施方案中，网可以包含与液体相容的金属或有机材料。 在一个实施方案中，液体可以包含液态金属。 例如，液体可以包括镓铟锡合金。 可以可选地使用垫圈来密封网格和热源和散热器之间的液体。 在一个实施例中，热源是集成电路芯片。
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4.发明授权公开(公告)号：US06383415B1
公开(公告)日：2002-05-07
申请号：US09444985
申请日：1999-11-22
IPC分类号： H01B112
摘要： Cross-linked electrically conductive polymers, in particular electrically conductive, polyaniline are described. Dopants and substituents having pendant cross-linkable functionality are used which form a cross-linked conducting polymer network. The cross-linking functionality can be hydrogen-bonding as well as chemically polymerizable or cross-linkable. A conjugated path between chains can also be incorporated. The resulting cross-linked conducting polymers have enhanced thermal and environmental stability. The dopant cannot readily be washed out with solvents or diffuse out upon exposure to heat. In addition, the cross-linked polymers have enhanced electrical conductivity.
摘要翻译： 描述了交联的导电聚合物，特别是导电的聚苯胺。 使用具有侧链可交联官能团的掺杂剂和取代基，其形成交联的导电聚合物网络。 交联官能团可以是氢键合以及化学上可聚合的或可交联的。 还可以并入链之间的共轭路径。 所得的交联导电聚合物具有增强的热和环境稳定性。 掺杂剂不容易用溶剂洗涤或在暴露于热量时扩散出来。 此外，交联聚合物具有增强的导电性。
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5.发明授权
公开(公告)号：US5721299A
公开(公告)日：1998-02-24
申请号：US193926
申请日：1994-02-09
申请人： Marie Angelopoulos , Ali Afzali-Ardakani , Jack A. Dickerson , Thomas B. Pillsbury , Karl J. Puttlitz , Jane M. Shaw , Jeffrey D. Gelorme
发明人： Marie Angelopoulos , Ali Afzali-Ardakani , Jack A. Dickerson , Thomas B. Pillsbury , Karl J. Puttlitz , Jane M. Shaw , Jeffrey D. Gelorme
IPC分类号： C08G61/12 , H01B1/12 , H01J29/86 , H01L23/498 , H01L23/60 , H01L33/38 , H01L33/42 , H05K9/00 , H01B1/06
CPC分类号： H05K9/0079 , C08G61/12 , H01B1/125 , H01B1/127 , H01B1/128 , H01J29/868 , H01L23/49894 , H01L23/60 , H01L33/40 , H01L33/42 , H01L2924/0002
摘要： Electrically conductive and abrasion resistant polymeric compositions, methods of fabrication thereof and uses thereof are described. Admixtures of abrasion resistant materials and electrically conductive polymeric materials are formed. Many of these admixtures are light transmitting and can be used as an abrasion resistant light transmitting electrostatic discharge layers. The light transmitting discharge layer is useful as a surface coating for visual displays such as CRT screens to avoid electrostatic accumulation of dust and scratching. The compositions can be admixtures of abrasion resistant silicones, polysiloxanes, acrylates, epoxies, methacrylates, epoxyacrylates, epoxymethacrylates, styrenes and electrically conductive polymers selected from the group of substituted and unsubstituted polyanilines, polyparaphenylenevinyles, substituted and unsubstituted polythiophenes substituted and unsubstituted poly-p-phenylene sulfides, substituted and unsubstituted polyfuranes, substituted and unsubstituted polypyrroles, substituted and unsubstituted polyselenophenes, polyacetylines formed from soluble precursors, combinations thereof and blends thereof with other polymers. The compositions can be a layer of an electrically conductive polymer with an abrasion resistant layer thereover.
摘要翻译： 描述了导电和耐磨聚合物组合物，其制造方法及其用途。 形成耐磨材料和导电聚合材料的外加剂。 这些混合物中的许多是透光性的并且可以用作耐磨光透射静电放电层。 透光放电层可用作诸如CRT屏幕的视觉显示器的表面涂层，以避免灰尘和划痕的静电积累。 组合物可以是耐磨硅氧烷，聚硅氧烷，丙烯酸酯，环氧树脂，甲基丙烯酸酯，环氧丙烯酸酯，环氧甲基丙烯酸酯，苯乙烯和选自取代和未取代的聚苯胺的聚合物，聚对亚苯基乙烯基，取代和未取代的聚噻吩的取代和未取代的聚对 - 取代和未取代的聚吡咯，取代和未取代的聚硒吩，可溶性前体形成的聚乙酰胺，其组合以及与其它聚合物的共混物。 组合物可以是其上具有耐磨层的导电聚合物层。
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公开(公告)号：US06193909B1
公开(公告)日：2001-02-27
申请号：US08595853
申请日：1996-02-02
IPC分类号： H01B112
CPC分类号： C08G73/1071 , H01B1/128
摘要： Cross-linked electrically conductive polymers, in particular electrically conductive, polyaniline are described. Dopants and substituents having pendant cross-linkable functionality are used which form a cross-linked conducting polymer network. The cross-linking functionality can be hydrogen-bonding as well as chemically polymerizable or cross-linkable. A conjugated path between chains can also be incorporated. The resulting cross-linked conducting polymers have enhanced thermal and environmental stability. The dopant cannot readily be washed out with solvents or diffuse out upon exposure to heat. In addition, the cross-linked polymers have enhanced electrical conductivity.
摘要翻译： 描述了交联的导电聚合物，特别是导电的聚苯胺。 使用具有侧链可交联官能团的掺杂剂和取代基，其形成交联的导电聚合物网络。 交联官能团可以是氢键合以及化学上可聚合的或可交联的。 还可以并入链之间的共轭路径。 所得的交联导电聚合物具有增强的热和环境稳定性。 掺杂剂不容易用溶剂洗涤或在暴露于热量时扩散出来。 此外，交联聚合物具有增强的导电性。
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公开(公告)号：US5370825A
公开(公告)日：1994-12-06
申请号：US25490
申请日：1993-03-03
申请人： Marie Angelopoulos , Jeffrey D. Gelorme , Thomas H. Newman , Niranjan M. Patel , David E. Seeger
发明人： Marie Angelopoulos , Jeffrey D. Gelorme , Thomas H. Newman , Niranjan M. Patel , David E. Seeger
IPC分类号： C08G61/12 , C08G61/10 , C08G75/02 , C08G75/04 , C08J3/28 , C08L33/00 , C08L33/02 , C08L41/00 , C08L79/00 , C08L101/00 , C08L101/02 , C08L101/12 , G03F7/038 , G03F7/09 , H01B1/12 , H01B1/00
摘要： Disclosed is a novel composition of matter comprising a polyacid and a polymer containing repeating units which contain one or more basic atoms. The complex is water-soluble and electrically conductive. The complex is useful in providing organic discharge layers for use in electronic applications and fabrications.
摘要翻译： 公开了一种包含多酸和含有含有一个或多个碱性原子的重复单元的聚合物的新物质组合物。 该复合物是水溶性和导电性的。 该复合物可用于提供用于电子应用和制造的有机放电层。
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8.发明授权
公开(公告)号：US6030550A
公开(公告)日：2000-02-29
申请号：US594680
申请日：1996-02-02
IPC分类号： H01B1/12
摘要： Cross-linked electrically conductive polymers, in particular electrically conductive, polyaniline are described. Dopants and substituents having pendant cross-linkable functionality are used which form a cross-linked conducting polymer network. The cross-linking functionality can be hydrogen-bonding as well as chemically polymerizable or cross-linkable. A conjugated path between chains can also be incorporated. The resulting cross-linked conducting polymers have enhanced thermal and environmental stability. The dopant cannot readily be washed out with solvents or diffuse out upon exposure to heat. In addition, the cross-linked polymers have enhanced electrical conductivity.
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9.发明授权Solid state chain extension polymerization between Lewis acid oligomers and deblocked Lewis bases 失效路易斯酸低聚物和解封路易斯碱之间的固态链延伸聚合
公开(公告)号：US5382637A
公开(公告)日：1995-01-17
申请号：US785734
申请日：1991-10-31
CPC分类号： C08G73/101 , G03F7/0045 , G03F7/0387
摘要： A solid state chain extension method provides for the formation of a solid state film comprised of a high molecular weight polymer by chain extending a deblocked Lewis base with Lewis acid oligomers while the reactants are in a solid state form. In one embodiment, a negative resist is prepared by selectively exposing regions of the solid state film. The Lewis base is deblocked at the exposed regions by a suitable deblocking means. The Lewis acid oligomers and the deblocked Lewis base chain extend at the exposed regions. Development of the film removes the non-polymerized reactants. Optionally, the Lewis acid oligomers, when radiation-cross-linking, are cross-linked with one another prior to deblocking the Lewis base to form a negative resist. The cross-linked oligomers polymerize with the subsequently deblocked base to provide a high molecular weight polymer film. In an alternative embodiment, a positive resist is used by degrading and removing phot-sensitive Lewis acid oligomers using selective exposure lithography techniques and, subsequently, deblocking the Lewis base and chain extending the remaining oligomers with the deblocked Lewis base at the unexposed regions.
摘要翻译： 固态链延伸方法提供了通过将路易斯酸低聚物链路延伸解链路易斯碱同时反应物呈固态形式形成由高分子量聚合物构成的固态膜。 在一个实施方案中，通过选择性地暴露固态膜的区域来制备负性抗蚀剂。 路易斯碱通过合适的去块装置在暴露区域解封。 路易斯酸低聚物和解封的路易斯碱基链在暴露的区域延伸。 膜的开发除去未聚合的反应物。 任选地，当辐射交联时，路易斯酸低聚物在将路易斯碱解封以形成负性抗蚀剂之前彼此交联。 交联的低聚物与随后的解封底物聚合以提供高分子量聚合物膜。 在替代实施方案中，通过使用选择性曝光光刻技术降解和除去光敏路易斯酸低聚物，并且随后使路易斯碱和链在未曝光区域上与解封的路易斯碱扩展剩余的低聚物，使用正性抗蚀剂。
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公开(公告)号：US5241040A
公开(公告)日：1993-08-31
申请号：US551716
申请日：1990-07-11
申请人： Jerome J. Cuomo , Jeffrey D. Gelorme , Michael Hatzakis, Jr. , David A. Lewis , Jane M. Shaw , Stanley J. Whitehair
发明人： Jerome J. Cuomo , Jeffrey D. Gelorme , Michael Hatzakis, Jr. , David A. Lewis , Jane M. Shaw , Stanley J. Whitehair
CPC分类号： H05B6/705 , B01J19/126 , C08G73/1025 , G01N22/00 , H05B6/68 , B01J2219/00191 , B01J2219/1215 , H05K1/0346 , H05K3/4644 , Y02B40/143 , Y10T428/31681 , Y10T428/31721
摘要： A method and apparatus are disclosed for conducting a physical process and a chemical reaction by exposing a material containing a volatile substance to microwave radiation where the morphology of said material will change when exposed to such radiation. The power of said radiation is adjusted over time as the morphology of the material changes to maximize the effect of the radiation in order to produce a product in a minimum amount of time that is substantially free of said volatile substance.The method and apparatus can also be used to conduct such a process or reaction with materials that do not contain a volatile material.In one embodiment a method and apparatus are disclosed for manufacturing a polyimide from a precursor in a solvent by exposing the precursor to microwave radiation in a tuneable microwave resonant cavity that is tuned during imidization to achieve critical coupling of the system. Microwave power is controlled to remove the solvent and obtain the desired level of reaction. Processing time has been reduced thirty fold as compared to conventional thermal methods.
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