LOCOS isolation for fully-depleted SOI devices
    1.
    发明授权
    LOCOS isolation for fully-depleted SOI devices 失效
    用于完全耗尽的SOI器件的LOCOS隔离

    公开(公告)号:US07510927B2

    公开(公告)日:2009-03-31

    申请号:US10330842

    申请日:2002-12-26

    申请人: Mark Bohr Julie Tsai

    发明人: Mark Bohr Julie Tsai

    IPC分类号: H01L21/84

    CPC分类号: H01L21/76264

    摘要: The present invention discloses a method including: providing a substrate; forming a buried oxide layer over the substrate; forming a thin silicon body layer over the buried oxide layer, the thin silicon body layer having a thickness of 3-40 nanometers; forming a pad oxide layer over the thin silicon body layer; forming a silicon nitride layer over the pad oxide layer; forming a photoresist over the silicon nitride layer; forming an opening in the photoresist; removing the silicon nitride layer in the opening; partially or completely removing the pad oxide layer in the opening; removing the photoresist over the silicon nitride layer; forming a field oxide layer from the thin silicon body layer in the opening; removing the silicon nitride layer over the pad oxide layer; and removing the pad oxide layer over the thin silicon body layer.The present invention also discloses a structure including: a substrate; a buried oxide layer located over the substrate; a thin silicon body layer located over the buried oxide layer, the thin silicon body layer including active areas separated by isolation regions, the isolation regions having a modified bird's beak length that is 30-60% of a thickness of the thin silicon body layer; and a fully-depleted device located in each of the active regions.

    摘要翻译: 本发明公开了一种方法,包括:提供基板; 在衬底上形成掩埋氧化层; 在所述掩埋氧化物层上形成薄的硅体层,所述薄硅体层的厚度为3-40纳米; 在所述薄硅体层上形成衬垫氧化物层; 在所述焊盘氧化物层上形成氮化硅层; 在氮化硅层上形成光致抗蚀剂; 在光致抗蚀剂中形成开口; 去除开口中的氮化硅层; 部分地或完全地去除开口中的垫氧化物层; 去除氮化硅层上的光致抗蚀剂; 从所述开口中的所述薄硅体层形成场氧化物层; 去除所述衬垫氧化物层上的所述氮化硅层; 以及去除所述薄硅体层上的所述衬垫氧化物层。 本发明还公开了一种结构,包括:基板; 位于衬底上方的掩埋氧化物层; 位于所述掩埋氧化物层上方的薄硅体层,所述薄硅体层包括由隔离区隔开的有效区域,所述隔离区域具有所述薄硅体层的厚度的30-60%的改进的鸟嘴长度; 以及位于每个活动区域中的完全耗尽的装置。