摘要:
At least one bearing body in a power semiconductor module has a surface section on which a first semiconductor component and at least one additional semiconductor component are arranged adjacent to each other. The semiconductor components have contact surfaces, oriented away from the surface section of the bearing body, that are in a contact in a planar manner to provide a flat connection line between the contact surfaces of the semiconductor components. The flat connection line has a lower inductivity and a lower instance dependency of inductivity compared to a bonding wire. A distance between the semiconductor components along the surface section is greater than a lateral measurement of at least one of the semiconductor components and can be, selectively, relatively large, allowing for thermal and/or temperature expansion and a lower thermal load of the semiconductor module than previously obtained.
摘要:
A filter short circuit is detected when the primary voltage of the high-voltage transformer drops below a specified minimum value and does not rise above the specified minimum value during a specified delay period and a filter current is greater than a specified minimum current. No current is drawn from the external current supply for a variable time delay when a filter short circuit is detected. A filter short circuit count is incremented when a filter short circuit is detected. When the count exceeds a specified, variable limit within a specified, variable time span, the indirect converter is disconnected.